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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 43863-2024 |
Large-scale integrated circuits (LSI)-Package-Printed Circuit Board Common Design Structure {译} 大规模集成电路（LSI）-封装-印制电路板共通设计结构 |
China National Standards design integrated circuit |
 English PDF |
| GB/T 43454-2023 |
Integrated circuit intellectual property (IP) core design requirements {译} 集成电路知识产权（IP）核设计要求 |
China National Standards design integrated circuit |
English PDF |
| GB/T 43228-2023 |
Design requirements for radiation-hardened integrated circuit unit libraries for aerospace use {译} 宇航用抗辐射加固集成电路单元库设计要求 |
China National Standards design integrated circuit |
English PDF |
| GB 51122-2015 |
Code for design of integrated circuit assembly and test factory 集成电路封装测试厂设计规范 |
China National Standards design integrated circuit |
English PDF |
| GB 50809-2012 |
Code for design of silicon integrated circuits wafer fab 硅集成电路芯片工厂设计规范 |
China National Standards design integrated circuit |
English PDF |
| GB/T 15157.12-2011 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits 频率低于3MHz的印制板连接器 第12部分：集成电路插座的尺寸、一般要求和试验方法详细规范 |
China National Standards design integrated circuit |
English PDF |
| GB/T 3430-1989 |
The rule of type designation for semiconductor integrated circuits 半导体集成电路型号命名方法 |
China National Standards design integrated circuit |
English PDF |
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