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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 43894.1-2024 |
Evaluation of near-edge geometry of semiconductor Wafers - Part 1: High radial second derivative method (ZDD) {译} 半导体晶片近边缘几何形态评价-第1部分：高度径向二阶导数法（ZDD） |
China National Standards Wafer |
 English PDF |
| GB/T 43493.3-2023 |
Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial Wafers for power devices - Part 3: Photoluminescence detection method of defects {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第3部分：缺陷的光致发光检测方法 |
China National Standards Wafer |
English PDF |
| GB/T 43493.2-2023 |
Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial Wafers for power devices - Part 2: Optical detection methods for defects {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分：缺陷的光学检测方法 |
China National Standards Wafer |
English PDF |
| GB/T 43493.1-2023 |
Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial Wafers for power devices - Part 1: Defect classification {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第1部分：缺陷分类 |
China National Standards Wafer |
English PDF |
| GB/T 43315-2023 |
Detection of silicon Wafer flow pattern defects Corrosion method {译} 硅片流动图形缺陷的检测 腐蚀法 |
China National Standards Wafer |
English PDF |
| GB/T 43313-2023 |
Testing of surface quality and microtube density of polished silicon carbide Wafers by confocal differential interference method {译} 碳化硅抛光片表面质量和微管密度的测试 共焦点微分干涉法 |
China National Standards Wafer |
English PDF |
| GB/T 42907-2023 |
Testing of non-equilibrium carrier recombination lifetime in silicon ingots, silicon blocks and silicon Wafers Non-contact eddy current induction method {译} 硅锭、硅块和硅片中非平衡载流子复合寿命的测试 非接触涡流感应法 |
China National Standards Wafer |
English PDF |
| GB/T 42902-2023 |
Testing of surface defects of silicon carbide epitaxial Wafers Laser scattering method {译} 碳化硅外延片表面缺陷的测试 激光散射法 |
China National Standards Wafer |
English PDF |
| GB/T 42789-2023 |
Test method for silicon Wafer surface gloss {译} 硅片表面光泽度的测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 6616-2023 |
Testing of semiconductor Wafer resistivity and semiconductor film sheet resistance non-contact eddy current method {译} 半导体晶片电阻率及半导体薄膜薄层电阻的测试 非接触涡流法 |
China National Standards Wafer |
English PDF |
| GB/T 42706.5-2023 |
Electronic components - Long term storage of semiconductor devices - Part 5: Chips and Wafers {译} 电子元器件 半导体器件长期贮存 第5部分：芯片和晶圆 |
China National Standards Wafer |
English PDF |
| GB/T 30656-2023 |
Silicon carbide single crystal polished Wafer {译} 碳化硅单晶抛光片 |
China National Standards Wafer |
English PDF |
| GB/T 32280-2022 |
Test method for warp and bow of silicon Wafers—Automated non-contact scanning method 硅片翘曲度和弯曲度的测试 自动非接触扫描法 |
China National Standards Wafer |
English PDF |
| GB/T 26069-2022 |
Annealed monocrystalline silicon Wafers 硅单晶退火片 |
China National Standards Wafer |
English PDF |
| GB/T 41325-2022 |
Low-density crystal primary pit silicon single crystal polishing Wafer for integrated circuits {译} 集成电路用低密度晶体原生凹坑硅单晶抛光片 |
China National Standards Wafer |
English PDF |
| GB/T 41853-2022 |
Semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement {译} 半导体器件 微机电器件 晶圆间键合强度测量 |
China National Standards Wafer |
English PDF |
| GB/T 40391-2021 |
Aluminum matrix composite Wafers 铝基复合圆片 |
China National Standards Wafer |
English PDF |
| GB/T 40279-2021 |
Test method for thickness of films on silicon Wafer surface—Optical reflection method 硅片表面薄膜厚度的测试 光学反射法 |
China National Standards Wafer |
English PDF |
| GB/T 40110-2021 |
Surface chemical analysis - Determination of surface elemental contamination on silicon Wafers by total-reflection X-ray fluorescence (TXRF) spectroscopy 表面化学分析 全反射X射线荧光光谱法（TXRF）测定硅片表面元素污染 |
China National Standards Wafer |
English PDF |
| GB/T 39145-2020 |
Test method for the content of surface metal elements on silicon Wafers—Inductively coupled plasma mass spectrometry 硅片表面金属元素含量的测定 电感耦合等离子体质谱法 |
China National Standards Wafer |
English PDF |
| GB/T 11094-2020 |
Gallium arsenide single crystal and cutting Wafer grown by horizontal bridgman method 水平法砷化镓单晶及切割片 |
China National Standards Wafer |
English PDF |
| GB/T 29055-2019 |
Multicrystalline silicon Wafers for photovoltaic solar cell 太阳能电池用多晶硅片 |
China National Standards Wafer |
English PDF |
| GB/T 14139-2019 |
Silicon epitaxial Wafers 硅外延片 |
China National Standards Wafer |
English PDF |
| GB/T 16596-2019 |
Specification for establishing a Wafer coordinate system 确定晶片坐标系规范 |
China National Standards Wafer |
English PDF |
| GB/T 16595-2019 |
Specification for a universal Wafer grid 晶片通用网格规范 |
China National Standards Wafer |
English PDF |
| GB/T 37053-2018 |
General specification for epitaxial Wafers and substrates based on gallium nitride 氮化镓外延片及衬底片通用规范 |
China National Standards Wafer |
English PDF |
| GB/T 19921-2018 |
Test method for particles on polished silicon Wafer surfaces 硅抛光片表面颗粒测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 26068-2018 |
Test method for carrier recombination lifetime in silicon Wafers and silicon ingots—Non-contact measurement of photoconductivity decay by microwave reflectance method 硅片和硅锭载流子复合寿命的测试-非接触微波反射光电导衰减法 |
China National Standards Wafer |
English PDF |
| GB/T 26071-2018 |
Monocrystalline silicon Wafers for solar cells 太阳能电池用硅单晶片 |
China National Standards Wafer |
English PDF |
| GB/T 12964-2018 |
Monocrystalline silicon polished Wafers 硅单晶抛光片 |
China National Standards Wafer |
English PDF |
| GB/T 12965-2018 |
Monocrystalline silicon as cut Wafers and lapped wafers 硅单晶切割片和研磨片 |
China National Standards Wafer |
English PDF |
| GB/T 34479-2017 |
Specification for alphanumeric marking of silicon Wafers 硅片字母数字标志规范 |
China National Standards Wafer |
English PDF |
| GB/T 34504-2017 |
Measurement method for surface metal contamination on sapphire polished substrate Wafer 蓝宝石抛光衬底片表面残留金属元素测量方法 |
China National Standards Wafer |
English PDF |
| GB/T 34177-2017 |
Quartz glass Wafer for lithography 光刻用石英玻璃晶圆 |
China National Standards Wafer |
English PDF |
| GB/T 33922-2017 |
Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances MEMS压阻式压力敏感芯片性能的圆片级试验方法 |
China National Standards Wafer |
English PDF |
| GB/T 33657-2017 |
Nanotechnologies—Electrical operating parameter test specification of Wafer level nano-scale phase change memory cells 纳米技术 晶圆级纳米尺度相变存储单元电学操作参数测试规范 |
China National Standards Wafer |
English PDF |
| GB/T 35310-2017 |
200mm silicon epitaxial Wafer 200mm硅外延片 |
China National Standards Wafer |
English PDF |
| GB/T 35308-2017 |
Epitaxial Wafers of germanium based Ⅲ-Ⅴcompounds for solar cell 太阳能电池用锗基Ⅲ-Ⅴ族化合物外延片 |
China National Standards Wafer |
English PDF |
| GB/T 35305-2017 |
Monocrystalline gallium arsenide polished Wafers for solar cell 太阳能电池用砷化镓单晶抛光片 |
China National Standards Wafer |
English PDF |
| GB/T 32988-2016 |
Synthetic quartz crystal Wafer for optical low pass filter (OLPF) 人造石英光学低通滤波器晶片 |
China National Standards Wafer |
English PDF |
| GB/T 32814-2016 |
Silicon-based MEMS fabrication technology—Specification for criterion of the SOI Wafer based MEMS process 硅基MEMS制造技术 基于SOI硅片的MEMS工艺规范 |
China National Standards Wafer |
English PDF |
| GB/T 32281-2015 |
Test method for measuring oxygen, carbon, boron and phosphorus in solar silicon Wafers and feedstock by secondary ion mass spectrometry 太阳能级硅片和硅料中氧、碳、硼和磷量的测定 二次离子质谱法 |
China National Standards Wafer |
English PDF |
| GB/T 32280-2015 |
Test method for warp of silicon Wafers—Automated non-contact scanning method 硅片翘曲度测试 自动非接触扫描法 |
China National Standards Wafer |
English PDF |
| GB/T 32279-2015 |
Specification for order entry format of silicon Wafers 硅片订货单格式输入规范 |
China National Standards Wafer |
English PDF |
| GB/T 32278-2015 |
Test methods for flatness of monocrystalline silicon carbide Wafers 碳化硅单晶片平整度测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 24578-2015 |
Test method for measuring surface metal contamination on silicon Wafers by total reflection X-Ray fluorescence spectroscopy 硅片表面金属沾污的全反射X光荧光光谱测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 31351-2014 |
Nondestructive test method for micropipe density of polished monocrystalline silicon carbide Wafers 碳化硅单晶抛光片微管密度无损检测方法 |
China National Standards Wafer |
English PDF |
| GB/T 30656-2014 |
Polished monocrystalline silicon carbide Wafers 碳化硅单晶抛光片 |
China National Standards Wafer |
English PDF |
| GB/T 30860-2014 |
Test methods for surface roughness and saw mark of silicon Wafers for solar cells 太阳能电池用硅片表面粗糙度及切割线痕测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 30859-2014 |
Test method for warp and waviness of silicon Wafers for solar cells 太阳能电池用硅片翘曲度和波纹度测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 30869-2014 |
Test method for thickness and total thickness variation of silicon Wafers for solar cell 太阳能电池用硅片厚度及总厚度变化测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 30868-2014 |
Test method for measuring micropipe density of monocrystalline silicon carbide Wafers―Chemically etching 碳化硅单晶片微管密度的测定 化学腐蚀法 |
China National Standards Wafer |
English PDF |
| GB/T 30867-2014 |
Test method for measuring thickness and total thickness variation of monocrystalline silicon carbide Wafers 碳化硅单晶片厚度和总厚度变化测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 30866-2014 |
Test method for measuring diameter of monocrystalline silicon carbide Wafers 碳化硅单晶片直径测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 30701-2014 |
Surface chemical analysis―Chemical methods for the collection of elements from the surface of silicon-Wafer working reference materials and their determination by total-reflection X-ray fluorescence (TXRF) spectroscopy 表面化学分析 硅片工作标准样品表面元素的化学收集方法和全反射X射线荧光光谱法(TXRF)测定 |
China National Standards Wafer |
English PDF |
| GB/T 30118-2013 |
Single crystal Wafers for surface acoustic wave (SAW) device applications―Specifications and measuring methods 声表面波（SAW）器件用单晶晶片规范与测量方法 |
China National Standards Wafer |
English PDF |
| GB/T 29507-2013 |
Test method for measuring flatness, thickness and total thickness variation on silicon Wafers by automated non-contact scanning 硅片平整度、厚度及总厚度变化测试 自动非接触扫描法 |
China National Standards Wafer |
English PDF |
| GB/T 29506-2013 |
300mm polished monocrystalline silicon Wafers 300mm 硅单晶抛光片 |
China National Standards Wafer |
English PDF |
| GB/T 29505-2013 |
Test method for measuring surface roughness on planar surfaces of silicon Wafer 硅片平坦表面的表面粗糙度测量方法 |
China National Standards Wafer |
English PDF |
| GB/T 29055-2012 |
Multi-crystalline silicon Wafer for solar cell 太阳电池用多晶硅片 |
China National Standards Wafer |
English PDF |
| GB 50809-2012 |
Code for design of silicon integrated circuits Wafer fab 硅集成电路芯片工厂设计规范 |
China National Standards Wafer |
English PDF |
| GB/T 28276-2012 |
Silicon-based MEMS fabrication technology - Specification for the dissolved Wafer process 硅基MEMS制造技术 体硅溶片工艺规范 |
China National Standards Wafer |
English PDF |
| GB/T 26144-2010 |
Liner fluoroplatics for flanged ang Wafer steel butterfly valve 法兰和对夹连接钢制衬氟塑料蝶阀 |
China National Standards Wafer |
English PDF |
| GB/T 3610-2010 |
Zinc Wafer for dry cell 电池锌饼 |
China National Standards Wafer |
English PDF |
| GB/T 26070-2010 |
Characterization of subsurface damage in polished compound semiconductor Wafers by reflectance difference spectroscopy method 化合物半导体抛光晶片亚表面损伤的反射差分谱测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 26069-2010 |
Specification for silicon annealed Wafers 硅退火片规范 |
China National Standards Wafer |
English PDF |
| GB/T 26068-2010 |
Test method for carrier recombination lifetime in silicon Wafers by non-contact measurement of photoconductivity decay by microwave reflectance 硅片载流子复合寿命的无接触微波反射光电导衰减测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 26067-2010 |
Standard test method for dimensions of notches on silicon Wafers 硅片切口尺寸测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 26065-2010 |
Specification for polished test silicon Wafers 硅单晶抛光试验片规范 |
China National Standards Wafer |
English PDF |
| GB/T 26064-2010 |
Lithium Wafers 锂圆片 |
China National Standards Wafer |
English PDF |
| GB/T 25188-2010 |
Thickness measurements for ultrathin silicon oxide layers on silicon Wafers X-ray photoelectron spectroscopy 硅晶片表面超薄氧化硅层厚度的测量 X射线光电子能谱法 |
China National Standards Wafer |
English PDF |
| GB/T 6619-2009 |
Test methods for bow of silicon Wafers 硅片弯曲度测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 6617-2009 |
Test method for measuring resistivity of silicon Wafer using spreading resistance probe 硅片电阻率测定 扩展电阻探针法 |
China National Standards Wafer |
English PDF |
| GB/T 6616-2009 |
Test methods for measuring resistivity of semiconductor Wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge 半导体硅片电阻率及硅薄膜薄层电阻测试方法 非接触涡流法 |
China National Standards Wafer |
English PDF |
| GB/T 4058-2009 |
Test method for detection of oxidation induced defects in polished silicon Wafers 硅抛光片氧化诱生缺陷的检验方法 |
China National Standards Wafer |
English PDF |
| GB/T 24578-2009 |
Test method for measuring surface metal contamination on silicon Wafers by total reflection X-ray fluorescence spectroscopy 硅片表面金属沾污的全反射X光荧光光谱测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 24577-2009 |
Test methods for analyzing organic contaminants on silicon Wafer surfaces by thermal desorption gas chromatography 热解吸气相色谱法测定硅片表面的有机污染物 |
China National Standards Wafer |
English PDF |
| GB/T 14140-2009 |
Test method for measuring diameter of semiconductor Wafer 硅片直径测量方法 |
China National Standards Wafer |
English PDF |
| GB/T 14139-2009 |
Silicon epitaxial Wafers 硅外延片 |
China National Standards Wafer |
English PDF |
| GB/T 13388-2009 |
Method for measuring crystallographic orientation of flats on single-crystal silicon slices and Wafers by X-ray techniques 硅片参考面结晶学取向X射线测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 13387-2009 |
Test method for measuring flat length Wafers of silicon and other electronic materials 硅及其它电子材料晶片参考面长度测量方法 |
China National Standards Wafer |
English PDF |
| GB/T 12238-2008 |
Flanged and Wafer resilient seal butterfly valves 法兰和对夹连接弹性密封蝶阀 |
China National Standards Wafer |
English PDF |
| GB/T 11094-2007 |
Horizontal bridgman grown gallium arsenide single crystal and cutting Wafer 水平法砷化镓单晶及切割片 |
China National Standards Wafer |
English PDF |
| GB/T 19922-2005 |
Standard test methods for measuring site flatness on silicon Wafers by noncontact scanning 硅片局部平整度非接触式标准测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 19921-2005 |
Test method of particles on silicon Wafer surfaces 硅抛光片表面颗粒测试方法 |
China National Standards Wafer |
English PDF |
| GB/T 19444-2004 |
Oxygen precipitation characterization of silicon Wafers by measurement of interstitial oxygen reduction 硅片氧沉淀特性的测定 间隙氧含量减少法 |
China National Standards Wafer |
English PDF |
| GB/T 12964-2003 |
Monocrystalline silicon polished Wafers 硅单晶抛光片 |
China National Standards Wafer |
English PDF |
| GB/T 16596-1996 |
Specification for establishing a Wafer coordinatesystem 确定晶片坐标系规范 |
China National Standards Wafer |
English PDF |
| GB/T 16595-1996 |
Specification for a universal Wafer grid 晶片通用网格规范 |
China National Standards Wafer |
English PDF |
| GB/T 14015-1992 |
Silicon on sapphire epitaxial Wafers 硅-蓝宝石外延片 |
China National Standards Wafer |
English PDF |
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