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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 41852-2022 |
Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译} 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 |
China National Standards structures,bonding |
 English PDF |
| GB/T 19271.2-2005 |
Protection against lightning electromagnetic impulse(LEMP)-Part 2:Shielding of structures,bonding inside structures and earthing 雷电电磁脉冲的防护 第2部分：建筑物的屏蔽、内部等电位连接及接地 |
China National Standards structures,bonding |
English PDF |
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