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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/Z 41275.23-2023 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 23: Rework/Repair Guidelines for Lead-Free and Mixed Electronics {译} 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第23部分：无铅及混装电子产品返工/修复指南 |
China National Standards Avionics Process Management |
 English PDF |
| GB/Z 41275.22-2023 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solders Part 22: Technical Guide {译} 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第22部分：技术指南 |
China National Standards Avionics Process Management |
English PDF |
| GB/Z 41275.4-2023 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 4: Ball Grid Array Ball Installation {译} 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第4部分：球栅阵列植球 |
China National Standards Avionics Process Management |
English PDF |
| GB/T 41270.9-2022 |
Avionics Process Management—Effects of atmospheric radiation—Part 9: Procedures and methods for calculating single event effect failure rates for avionics {译} 航空电子过程管理 大气辐射影响 第9部分：航空电子设备单粒子效应故障率计算程序与方法 |
China National Standards Avionics Process Management |
English PDF |
| GB/T 41270.7-2022 |
Avionics Process Management - Effects of atmospheric radiation - Part 7: Process management for single event effects analysis in avionics product design {译} 航空电子过程管理 大气辐射影响 第7部分：航空电子产品设计中单粒子效应分析过程管理 |
China National Standards Avionics Process Management |
English PDF |
| GB/T 41275.3-2022 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solder Part 3: System Performance Test Methods Containing Lead-Free Solder and Lead-Free Pins {译} 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第3部分：含无铅焊料和无铅管脚的系统性能试验方法 |
China National Standards Avionics Process Management |
English PDF |
| GB/T 41275.21-2022 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solders Part 21: Guidelines for Transitioning to Lead-Free Electronics {译} 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第21部分：向无铅电子过渡指南 |
China National Standards Avionics Process Management |
English PDF |
| GB/T 41275.2-2022 |
Avionics Process Management Aerospace and Defense Electronic Systems Containing Lead-Free Solders Part 2: Reducing the Harmful Effects of Tin {译} 航空电子过程管理 含无铅焊料航空航天及国防电子系统 第2部分：减少锡有害影响 |
China National Standards Avionics Process Management |
English PDF |
| GB/T 37312.1-2019 |
Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors 航空电子过程管理 航空航天、国防及其他高性能应用领域（ADHP）电子元器件 第1部分：高可靠集成电路与分立半导体器件通用要求 |
China National Standards Avionics Process Management |
English PDF |
| GB/T 37034.2-2018 |
Process management for avionics—Counterfeit prevention—Part2：Managing electronic components from non-franchised sources 航空电子过程管理-防伪-第2部分：来源于非授权经销商电子元器件的管理 |
China National Standards Avionics Process Management |
English PDF |
| GB/T 34954.1-2017 |
Process management for avionics—Electronic components capability in operation—Part 1:Temperature uprating 航空电子过程管理 电子器件使用性能 第1部分：温度升额 |
China National Standards Avionics Process Management |
English PDF |
| GB/Z 31478-2015 |
Process management for avionics —Preparation of an electronic components management plan 航空电子过程管理 电子元器件管理计划的制定 |
China National Standards Avionics Process Management |
English PDF |
| GB/Z 31477-2015 |
Process management for avionics-defining and performing highly accelerated tests in aerospace systems-application guide 航空电子过程管理 航空电子产品高加速试验定义和应用指南 |
China National Standards Avionics Process Management |
English PDF |
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