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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 42897-2023 |
Microelectromechanical systems (MEMS) technology Silicon-based MEMS nano-thickness film tensile strength test method {译} 微机电系统（MEMS）技术 硅基MEMS纳米厚度膜抗拉强度试验方法 |
China National Standards MEMS |
 English PDF |
| GB/T 42896-2023 |
Microelectromechanical systems (MEMS) technology Silicon-based MEMS nanoscale structure impact test method {译} 微机电系统（MEMS）技术 硅基MEMS纳尺度结构冲击试验方法 |
China National Standards MEMS |
English PDF |
| GB/T 42895-2023 |
Microelectromechanical systems (MEMS) technology Silicon-based MEMS microstructure bending strength test method {译} 微机电系统（MEMS）技术 硅基MEMS微结构弯曲强度试验方法 |
China National Standards MEMS |
English PDF |
| GB/T 42597-2023 |
Micro-Electro-Mechanical Systems (MEMS) Technology Gyroscopes {译} 微机电系统（MEMS）技术 陀螺仪 |
China National Standards MEMS |
English PDF |
| GB/T 26111-2023 |
Micro Electro Mechanical Systems (MEMS) Technology Terminology {译} 微机电系统（MEMS）技术 术语 |
China National Standards MEMS |
English PDF |
| GB/T 42191-2023 |
MEMS piezoresistive pressure sensitive device performance test method {译} MEMS压阻式压力敏感器件性能试验方法 |
China National Standards MEMS |
English PDF |
| GB/T 42709.7-2023 |
Semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection {译} 半导体器件 微电子机械器件 第7部分：用于射频控制和选择的MEMS体声波滤波器和双工器 |
China National Standards MEMS |
English PDF |
| GB/T 42709.5-2023 |
Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches {译} 半导体器件 微电子机械器件 第5部分：射频MEMS开关 |
China National Standards MEMS |
English PDF |
| GB/T 42158-2023 |
Micro-Electro-Mechanical Systems (MEMS) Technology-Description and Measurement Methods of Micro-grooves and Pyramidal Needle Structures {译} 微机电系统（MEMS）技术 微沟槽和棱锥式针结构的描述和测量方法 |
China National Standards MEMS |
English PDF |
| GB/T 41852-2022 |
Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译} 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 |
China National Standards MEMS |
English PDF |
| GB/T 41853-2022 |
Semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement {译} 半导体器件 微机电器件 晶圆间键合强度测量 |
China National Standards MEMS |
English PDF |
| GB/T 38447-2020 |
Micro-electromechanical system technology—Fatigue testing method of MEMS structure using resonant vibration 微机电系统（MEMS）技术 MEMS结构共振疲劳试验方法 |
China National Standards MEMS |
English PDF |
| GB/T 38341-2019 |
Micro-electromechanical system technology—The reliability test methods of MEMS in integrated environments 微机电系统（MEMS）技术 MEMS器件的可靠性综合环境试验方法 |
China National Standards MEMS |
English PDF |
| GB/T 35086-2018 |
General specification for MEMS electric field sensor MEMS电场传感器通用技术条件 |
China National Standards MEMS |
English PDF |
| GB/T 34898-2017 |
Micro electromechanical system technology—Test method for the nonlinear vibration of the MEMS resonant sensitive element 微机电系统（MEMS）技术 MEMS谐振敏感元件非线性振动测试方法 |
China National Standards MEMS |
English PDF |
| GB/T 34894-2017 |
Micro-electromechanical system technology—Measuring method for strain gradient measurements of MEMS microstructures using an optical interferometer 微机电系统（MEMS）技术 基于光学干涉的MEMS微结构应变梯度测量方法 |
China National Standards MEMS |
English PDF |
| GB/T 34900-2017 |
Micro-electromechanical system technology—Measuring method for residual strain measurements of MEMS microstructures using an optical interferometer 微机电系统（MEMS）技术 基于光学干涉的MEMS微结构残余应变测量方法 |
China National Standards MEMS |
English PDF |
| GB/T 34893-2017 |
Micro-electromechanical system technology—Measuring method for in-plane length measurements of MEMS microstructures using an optical interferometer 微机电系统（MEMS）技术 基于光学干涉的MEMS微结构面内长度测量方法 |
China National Standards MEMS |
English PDF |
| GB/T 33929-2017 |
Test methods of the performance for MEMS high g accelerometer MEMS高g值加速度传感器性能试验方法 |
China National Standards MEMS |
English PDF |
| GB/T 33922-2017 |
Wafer level test methods for MEMS piezoresistive pressure-sensitive die performances MEMS压阻式压力敏感芯片性能的圆片级试验方法 |
China National Standards MEMS |
English PDF |
| GB/T 32815-2016 |
Silicon-based MEMS fabrication technology—Specification for criterion of the bulk silicon piezoresistance process 硅基MEMS制造技术 体硅压阻加工工艺规范 |
China National Standards MEMS |
English PDF |
| GB/T 32814-2016 |
Silicon-based MEMS fabrication technology—Specification for criterion of the SOI wafer based MEMS process 硅基MEMS制造技术 基于SOI硅片的MEMS工艺规范 |
China National Standards MEMS |
English PDF |
| GB/T 32816-2016 |
Silicon-based MEMS fabrication technology—Specification for criterion of the combination of the deep etching and bonding process 硅基MEMS制造技术 以深刻蚀与键合为核心的工艺集成规范 |
China National Standards MEMS |
English PDF |
| GB/T 32817-2016 |
Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS 半导体器件 微机电器件 MEMS总规范 |
China National Standards MEMS |
English PDF |
| GB/T 28277-2012 |
Silicon-based MEMS fabrication technology - Measurement method of cutting and pull-press strength of micro bonding area 硅基MEMS制造技术 微键合区剪切和拉压强度检测方法 |
China National Standards MEMS |
English PDF |
| GB/T 28276-2012 |
Silicon-based MEMS fabrication technology - Specification for the dissolved wafer process 硅基MEMS制造技术 体硅溶片工艺规范 |
China National Standards MEMS |
English PDF |
| GB/T 28275-2012 |
Silicon-based MEMS fabrication technology - Specification for KOH etch process 硅基MEMS制造技术 氢氧化钾腐蚀工艺规范 |
China National Standards MEMS |
English PDF |
| GB/T 28274-2012 |
Silicon-based MEMS fabrication technology - The basic regulation of layout design 硅基MEMS制造技术 版图设计基本规则 |
China National Standards MEMS |
English PDF |
| GB/T 14006.2-1997 |
Outline diMEMSions of transformers and inductors for use in telecommunication and electronic equipmemt--Part 2:Transformers and inductors using YEx-2 laminations for printed wiring boardmounting 通信和电子设备用变压器和电感器外形尺寸 第2部分:采用YEx-2系列铁心片印制板安装式变压器和电感器 |
China National Standards MEMS |
English PDF |
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