Standard Code | Standard Title | Standard Class | Order |
---|---|---|---|
GB/T 15879.604-2023 |
Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages {译} 半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法 |
China National Standards Mechanical drawings General |
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GB/T 26099.4-2010 |
General principles of three-dimensional modeling for mechanical products - Part 4:Model projection drawings 机械产品三维建模通用规则 第4部分:模型投影工程图 |
China National Standards Mechanical drawings General |
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GB/T 4459.8-2009 |
Mechanical drawings - Seals for dynamic application - Part 1: General simplified representation 机械制图 动密封圈 第1部分:通用简化表示法 |
China National Standards Mechanical drawings General |
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GB/T 4458.6-2002 |
Mechanical drawings--General principles of presentation--Sections 机械制图 图样画法 剖视图和断面图 |
China National Standards Mechanical drawings General |
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GB/T 4458.1-2002 |
Mechanical drawings--General principles of presentation--Views 机械制图 图样画法 视图 |
China National Standards Mechanical drawings General |
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GB/T 4457.4-2002 |
Mechanical drawings--General principles of presentation--Lines 机械制图 图样画法 图线 |
China National Standards Mechanical drawings General |
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