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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 44928-2024 |
Microelectronics Micro-lithography technical terms {译} 微电子学微光刻技术术语 |
China National Standards Microelectro |
 English PDF |
| GB/T 44839-2024 |
Microelectromechanical system (MEMS) technology-Microcolumn compression test method for MEMS materials {译} 微机电系统（MEMS）技术-MEMS材料微柱压缩试验方法 |
China National Standards Microelectro |
English PDF |
| GB/T 44842-2024 |
Microelectromechanical system (MEMS) technology-Bending test method for thin film materials {译} 微机电系统（MEMS）技术-薄膜材料的弯曲试验方法 |
China National Standards Microelectro |
English PDF |
| GB/T 44849-2024 |
Microelectromechanical system (MEMS) technology-Method for measuring the forming limit of metal film materials {译} 微机电系统（MEMS）技术-金属膜材料成形极限测量方法 |
China National Standards Microelectro |
English PDF |
| GB/T 44529-2024 |
Microelectromechanical systems (MEMS) technology - RF MEMS circulators and isolators {译} 微机电系统（MEMS）技术-射频MEMS环行器和隔离器 |
China National Standards Microelectro |
English PDF |
| GB/T 44517-2024 |
Microelectromechanical systems (MEMS) technology - Wafer curvature and cantilever beam deflection test methods for residual stress of MEMS membranes {译} 微机电系统（MEMS）技术-MEMS膜残余应力的晶圆曲率和悬臂梁挠度试验方法 |
China National Standards Microelectro |
English PDF |
| GB/T 44513-2024 |
Microelectromechanical systems (MEMS) technology - Environmental test methods for MEMS piezoelectric films for sensors {译} 微机电系统（MEMS）技术-传感器用MEMS压电薄膜的环境试验方法 |
China National Standards Microelectro |
English PDF |
| GB/T 44514-2024 |
Microelectromechanical systems (MEMS) technology - Four-point bending test method for interfacial adhesion energy of layered MEMS materials {译} 微机电系统（MEMS）技术-层状MEMS材料界面黏附能四点弯曲试验方法 |
China National Standards Microelectro |
English PDF |
| GB/T 44515-2024 |
Microelectromechanical systems (MEMS) technology - Measurement method for electromechanical conversion characteristics of MEMS piezoelectric films {译} 微机电系统（MEMS）技术-MEMS压电薄膜机电转换特性测量方法 |
China National Standards Microelectro |
English PDF |
| GB/T 44531-2024 |
Microelectromechanical systems (MEMS) technology - Technical specifications for automotive-grade pressure sensors based on MEMS technology {译} 微机电系统（MEMS）技术-基于MEMS技术的车规级压力传感器技术规范 |
China National Standards Microelectro |
English PDF |
| GB/T 42709.19-2023 |
Semiconductor devices Microelectronic mechanical devices Part 19: Electronic compass {译} 半导体器件 微电子机械器件 第19部分：电子罗盘 |
China National Standards Microelectro |
English PDF |
| GB/T 42897-2023 |
Microelectromechanical systems (MEMS) technology Silicon-based MEMS nano-thickness film tensile strength test method {译} 微机电系统（MEMS）技术 硅基MEMS纳米厚度膜抗拉强度试验方法 |
China National Standards Microelectro |
English PDF |
| GB/T 42896-2023 |
Microelectromechanical systems (MEMS) technology Silicon-based MEMS nanoscale structure impact test method {译} 微机电系统（MEMS）技术 硅基MEMS纳尺度结构冲击试验方法 |
China National Standards Microelectro |
English PDF |
| GB/T 42895-2023 |
Microelectromechanical systems (MEMS) technology Silicon-based MEMS microstructure bending strength test method {译} 微机电系统（MEMS）技术 硅基MEMS微结构弯曲强度试验方法 |
China National Standards Microelectro |
English PDF |
| GB/T 42709.7-2023 |
Semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection {译} 半导体器件 微电子机械器件 第7部分：用于射频控制和选择的MEMS体声波滤波器和双工器 |
China National Standards Microelectro |
English PDF |
| GB/T 42709.5-2023 |
Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches {译} 半导体器件 微电子机械器件 第5部分：射频MEMS开关 |
China National Standards Microelectro |
English PDF |
| GB/T 17473.7-2022 |
Test methods of precious metals pastes used for Microelectronics—Part 7: Determination of solderability and solder leaching resistance 微电子技术用贵金属浆料测试方法 第7部分：可焊性、耐焊性测定 |
China National Standards Microelectro |
English PDF |
| GB/T 17472-2022 |
Specification for precious metal pastes for Microelectronics {译} 微电子技术用贵金属浆料规范 |
China National Standards Microelectro |
English PDF |
| GB/T 41852-2022 |
Semiconductor devices; Microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译} 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 |
China National Standards Microelectro |
English PDF |
| GB/T 32653-2016 |
Microelectro mechanical system acceleration geophone 微机械系统加速度检波器 |
China National Standards Microelectro |
English PDF |
| GB/T 17473.7-2008 |
Test methods of precious metals pastes used for Microelectronics - Determination of solderability and solderelaching resistance 微电子技术用贵金属浆料测试方法 可焊性、耐焊性测定 |
China National Standards Microelectro |
English PDF |
| GB/T 17473.6-2008 |
Test methods of precious metal pastes used for Microelectronics - Determination of resolution 微电子技术用贵金属浆料测试方法 分辨率测定 |
China National Standards Microelectro |
English PDF |
| GB/T 17473.5-2008 |
Test methods of pastes used for Microelectronics - Determination of viscosity 微电子技术用贵金属浆料测试方法 粘度测定 |
China National Standards Microelectro |
English PDF |
| GB/T 17473.4-2008 |
Test methods of precious metals pastes used for Microelectronics - Determination of adhesion 微电子技术用贵金属浆料测试方法 附着力测定 |
China National Standards Microelectro |
English PDF |
| GB/T 17473.3-2008 |
Test methods of precious metals pastes used for Microelectronics Determination of sheet resistance 微电子技术用贵金属浆料测试方法 方阻测定 |
China National Standards Microelectro |
English PDF |
| GB/T 17473.2-2008 |
Test methods of presious metals pastes used for Microelectronics - Determination of fineness 微电子技术用贵金属浆料测试方法 细度测定 |
China National Standards Microelectro |
English PDF |
| GB/T 17473.1-2008 |
Test methods of precious metals pastes used for Microelectronics-Determination of solids content 微电子技术用贵金属浆料测试方法 固体含量测定 |
China National Standards Microelectro |
English PDF |
| GB/T 17472-2008 |
Specification for pastes of precious metal used for Microelectronics 微电子技术用贵金属浆料规范 |
China National Standards Microelectro |
English PDF |
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