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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 15651.7-2024 |
Printed board assembly - Part 6: Evaluation requirements for voids in ball grid array (BGA) and land grid array (LGA) solder joints and test methods {译} 半导体器件-第5-7部分：光电子器件-光电二极管和光电晶体管 |
China National Standards Printed board assembly |
 English PDF |
| GB/T 38342-2019 |
Aerospace electronic product—Assembling requirements of printed circuit board assembly 宇航电子产品 印制板组装件组装要求 |
China National Standards Printed board assembly |
English PDF |
| GB/T 19247.1-2003 |
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies 印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求 |
China National Standards Printed board assembly |
English PDF |
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