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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 43035-2023 |
Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements {译} 半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求 |
China National Standards Semiconductor Devices Integrated |
 English PDF |
| GB/T 20870.5-2023 |
Semiconductor devices Part 16-5: Microwave integrated circuits Oscillators {译} 半导体器件 第16-5部分：微波集成电路 振荡器 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 20870.2-2023 |
Semiconductor devices Part 16-2: Microwave integrated circuits Prescalers {译} 半导体器件 第16-2部分：微波集成电路 预分频器 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 20870.10-2023 |
Semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures {译} 半导体器件 第16-10部分：单片微波集成电路技术可接收程序 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 11498-2018 |
Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 13062-2018 |
Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 4023-2015 |
Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分：整流二极管 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 20870.1-2007 |
Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers 半导体器件 第16-1部分：微波集成电路 放大器 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 17574.9-2006 |
Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories 半导体器件 集成电路 第2-9部分：数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 17574.20-2006 |
Semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits 半导体器件 集成电路 第2-20部分：数字集成电路 低压集成电路族规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 17574.11-2006 |
Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory 半导体器件 集成电路 第2-11部分：数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 4589.1-2006 |
Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits 半导体器件 第10部分：分立器件和集成电路总规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 20515-2006 |
Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits 半导体器件 集成电路 第5部分：半定制集成电路 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 12750-2006 |
Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits 半导体器件 集成电路 第11部分：半导体集成电路分规范(不包括混合电路) |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 2900.66-2004 |
Electrotechnical terminology--Semiconductor devices and integrated circuits 电工术语 半导体器件和集成电路 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 19403.1-2003 |
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits) 半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 (不包括混合电路) |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 17574.10-2003 |
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories 半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 15651.3-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods 半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 15651.2-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics 半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 18500.2-2001 |
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) 半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 18500.1-2001 |
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) 半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 5965-2000 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) 半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 17940-2000 |
Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits 半导体器件 集成电路 第3部分:模拟集成电路 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 9424-1998 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 17574-1998 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits 半导体器件 集成电路 第2部分:数字集成电路 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 17573-1998 |
Semiconductor devices--Discrete devices and integrated circuits--Part 1:General 半导体器件 分立器件和集成电路 第1部分:总则 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 17572-1998 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第四篇 CMOS数字集成电路 4000B和4000UB系列族规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 4023-1997 |
Semiconductor devices--Discrete devices and integrated circuits--Part 2:Rectifier diodes 半导体器件 分立器件和集成电路 第2部分:整流二极管 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 17024-1997 |
Semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 17023-1997 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section two--Family specification for HCMOS digital integrated circuits series 54/74HC，54/74HCT，54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第二篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 16464-1996 |
Semiconductor devices--Integrated circuits--Part 1:General 半导体器件 集成电路 第1部分:总则 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 15879-1995 |
Mechanical standardization of semiconductor devices--Part 5:Recommendations applying to tape automated bonding (TAB) of integrated circuits 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 15651-1995 |
Semiconductor devices--Discrete devices and integrated circuits--Part 5:Optoelectronic devices 半导体器件 分立器件和集成电路 第5部分:光电子器件 |
China National Standards Semiconductor Devices Integrated |
English PDF |
| GB/T 4587-1994 |
Semiconductor discrete devices and integrated circuits--Part 7:Bipolar transistors 半导体分立器件和集成电路 第7部分:双极型晶体管 |
China National Standards Semiconductor Devices Integrated |
English PDF |
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