Standard Code | Standard Title | Standard Class | Order |
---|---|---|---|
GB/T 43777-2024 |
Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors {译} 化妆品中功效组分虾青素的测定-高效液相色谱法 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 15651.5-2024 |
Semiconductor devices - Part 5-5: Optoelectronic devices - Optocouplers {译} 半导体器件-第5-5部分:光电子器件-光电耦合器 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 4937.35-2024 |
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy of plastic encapsulated electronic components {译} 半导体器件-机械和气候试验方法-第35部分:塑封电子元器件的声学显微镜检查 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 20870.5-2023 |
Semiconductor devices Part 16-5: Microwave integrated circuits Oscillators {译} 半导体器件 第16-5部分:微波集成电路 振荡器 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 15651.6-2023 |
Semiconductor devices Part 5-6: Optoelectronic devices Light emitting diodes {译} 半导体器件 第5-6部分:光电子器件 发光二极管 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 42706.5-2023 |
Electronic components - Long term storage of semiconductor devices - Part 5: Chips and wafers {译} 电子元器件 半导体器件长期贮存 第5部分:芯片和晶圆 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 42709.5-2023 |
Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches {译} 半导体器件 微电子机械器件 第5部分:射频MEMS开关 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 4937.15-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices 半导体器件 机械和气候试验方法 第15部分:通孔安装器件的耐焊接热 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 15651.4-2017 |
Semiconductor devices—Discrete devices—Part 5-4:Optoelectronic devices—Semiconductor lasers 半导体器件 分立器件 第5-4部分:光电子器件 半导体激光器 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 20515-2006 |
Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits 半导体器件 集成电路 第5部分:半定制集成电路 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 15651.3-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods 半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 15651.2-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics 半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 18904.5-2003 |
Semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail,for fibre optic systems or subsystems 半导体器件 第12-5部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的pin光电二极管空白详细规范 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 6219-1998 |
Semiconductor devices--Discrete devices--Part 8:Field-effect transistors--Section One:Blank detail specification for single-gate field-effect transistors up to 5W and 1GHz 半导体器件 分立器件 第8部分:场效应晶体管 第一篇 1 GHz、5 W以下的单栅场效应晶体管 空白详细规范 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 17024-1997 |
Semiconductor devices--integratedcircuits--Part 2:Digital integrated circuits--Section three--Blank detail specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第三篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列空白详细规范 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 17023-1997 |
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section two--Family specification for HCMOS digital integrated circuits series 54/74HC,54/74HCT,54/74HCU 半导体器件 集成电路 第2部分:数字集成电路 第二篇 HCMOS数字集成电路54/74HC、54/74HCT、54/74HCU系列族规范 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 15879-1995 |
Mechanical standardization of semiconductor devices--Part 5:Recommendations applying to tape automated bonding (TAB) of integrated circuits 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards Semiconductor devices 5 |
English PDF |
GB/T 15651-1995 |
Semiconductor devices--Discrete devices and integrated circuits--Part 5:Optoelectronic devices 半导体器件 分立器件和集成电路 第5部分:光电子器件 |
China National Standards Semiconductor devices 5 |
English PDF |
Find out:19Items | To Page of: First -Previous-Next -Last | 1 |