China Semiconductor devices Mechanical GB Standards List

China "Semiconductor devices Mechanical" GB Standards List:

Standard Code	Standard Title	Standard Class	Order
GB/T 4937.35-2024	Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy of plastic encapsulated electronic components {译} 半导体器件-机械和气候试验方法-第35部分：塑封电子元器件的声学显微镜检查	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.34-2024	Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling {译} 半导体器件-机械和气候试验方法-第34部分：功率循环	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.26-2023	Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM) {译} 半导体器件机械和气候试验方法第26部分：静电放电（ESD）敏感度测试人体模型（HBM）	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 42709.19-2023	Semiconductor devices Microelectronic mechanical devices Part 19: Electronic compass {译} 半导体器件微电子机械器件第19部分：电子罗盘	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.23-2023	Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life {译} 半导体器件机械和气候试验方法第23部分：高温工作寿命	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.27-2023	Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM) {译} 半导体器件机械和气候试验方法第27部分：静电放电（ESD）敏感度测试机器模型（MM）	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.32-2023	Semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) {译} 半导体器件机械和气候试验方法第32部分：塑封器件的易燃性（外部引起的）	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.31-2023	Semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) {译} 半导体器件机械和气候试验方法第31部分：塑封器件的易燃性（内部引起的）	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 15879.604-2023	Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages {译} 半导体器件的机械标准化第6-4部分：表面安装半导体器件封装外形图绘制的一般规则焊球阵列（BGA）封装的尺寸测量方法	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.42-2023	Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage {译} 半导体器件机械和气候试验方法第42部分：温湿度贮存	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 42709.7-2023	Semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection {译} 半导体器件微电子机械器件第7部分：用于射频控制和选择的MEMS体声波滤波器和双工器	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 42709.5-2023	Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches {译} 半导体器件微电子机械器件第5部分：射频MEMS开关	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 41852-2022	Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译} 半导体器件微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 15879.4-2019	Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages 半导体器件的机械标准化第4部分：半导体器件封装外形的分类和编码体系	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 15879.5-2018	Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化第5部分：用于集成电路载带自动焊(TAB)的推荐值	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.22-2018	Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength 半导体器件机械和气候试验方法第22部分：键合强度	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.21-2018	Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 半导体器件机械和气候试验方法第21部分：可焊性	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.14-2018	Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity）半导体器件机械和气候试验方法第14部分：引出端强度（引线牢固性）	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.201-2018	Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 半导体器件机械和气候试验方法第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.13-2018	Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere 半导体器件机械和气候试验方法第13部分：盐雾	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.20-2018	Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 半导体器件机械和气候试验方法第20部分：塑封表面安装器件耐潮湿和焊接热综合影响	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.15-2018	Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices 半导体器件机械和气候试验方法第15部分：通孔安装器件的耐焊接热	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.12-2018	Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency 半导体器件机械和气候试验方法第12部分：扫频振动	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.18-2018	Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) 半导体器件机械和气候试验方法第18部分：电离辐照(总剂量)	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.19-2018	Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength 半导体器件机械和气候试验方法第19部分：芯片剪切强度	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.30-2018	Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件机械和气候试验方法第30部分：非密封表面安装器件在可靠性试验前的预处理	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.17-2018	Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation 半导体器件机械和气候试验方法第17部分：中子辐照	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.11-2018	Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method 半导体器件机械和气候试验方法第11部分：快速温度变化双液槽法	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 32817-2016	Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS 半导体器件微机电器件 MEMS总规范	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.4-2012	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) 半导体器件机械和气候试验方法第4部分：强加速稳态湿热试验（HAST）	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.3-2012	Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination 半导体器件机械和气候试验方法第3部分：外部目检	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.2-2006	Semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure 半导体器件机械和气候试验方法第2部分:低气压	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 4937.1-2006	Semiconductor devices―Mechanical and climatic test methods―Part 1: General 半导体器件机械和气候试验方法第1部分: 总则	China National Standards Semiconductor devices Mechanical	English PDF
GB/T 15879-1995	Mechanical standardization of semiconductor devices--Part 5:Recommendations applying to tape automated bonding (TAB) of integrated circuits 半导体器件的机械标准化第5部分:用于集成电路载带自动焊(TAB)的推荐值	China National Standards Semiconductor devices Mechanical	English PDF

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