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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 17473.7-2022 |
Test methods of precious metals pastes used for microelectronics—Part 7: Determination of Solderability and solder leaching resistance 微电子技术用贵金属浆料测试方法 第7部分：可焊性、耐焊性测定 |
China National Standards Solderability |
 English PDF |
| GB/T 4937.21-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 半导体器件 机械和气候试验方法 第21部分：可焊性 |
China National Standards Solderability |
English PDF |
| GB/T 4909.12-2009 |
Test methods for bare wires - Part 12: Solderability test of coating - Solder globule method 裸电线试验方法 第12部分：镀层可焊性试验-焊球法 |
China National Standards Solderability |
English PDF |
| GB/T 17473.7-2008 |
Test methods of precious metals pastes used for microelectronics - Determination of Solderability and solderelaching resistance 微电子技术用贵金属浆料测试方法 可焊性、耐焊性测定 |
China National Standards Solderability |
English PDF |
| GB/T 2423.32-2008 |
Environmental testing for electric and electronic products - Part 2: Test methods - Test Ta: Solderability test by the wetting balance method 电工电子产品环境试验 第2部分：试验方法 试验Ta: 润湿称量法可焊性 |
China National Standards Solderability |
English PDF |
| GB/T 16745-1997 |
Standard test method for Solderability of metallic-coated products 金属覆盖层产品钎焊性的标准试验方法 |
China National Standards Solderability |
English PDF |
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