Standard Code | Standard Title | Standard Class | Order |
---|---|---|---|
GB/T 17473.7-2022 |
Test methods of precious metals pastes used for microelectronics—Part 7: Determination of solderability and solder leaching resistance 微电子技术用贵金属浆料测试方法 第7部分:可焊性、耐焊性测定 |
China National Standards Test methods pastes |
English PDF |
GB/T 17473.7-2008 |
Test methods of precious metals pastes used for microelectronics - Determination of solderability and solderelaching resistance 微电子技术用贵金属浆料测试方法 可焊性、耐焊性测定 |
China National Standards Test methods pastes |
English PDF |
GB/T 17473.6-2008 |
Test methods of precious metal pastes used for microelectronics - Determination of resolution 微电子技术用贵金属浆料测试方法 分辨率测定 |
China National Standards Test methods pastes |
English PDF |
GB/T 17473.5-2008 |
Test methods of pastes used for microelectronics - Determination of viscosity 微电子技术用贵金属浆料测试方法 粘度测定 |
China National Standards Test methods pastes |
English PDF |
GB/T 17473.4-2008 |
Test methods of precious metals pastes used for microelectronics - Determination of adhesion 微电子技术用贵金属浆料测试方法 附着力测定 |
China National Standards Test methods pastes |
English PDF |
GB/T 17473.3-2008 |
Test methods of precious metals pastes used for microelectronics Determination of sheet resistance 微电子技术用贵金属浆料测试方法 方阻测定 |
China National Standards Test methods pastes |
English PDF |
GB/T 17473.2-2008 |
Test methods of presious metals pastes used for microelectronics - Determination of fineness 微电子技术用贵金属浆料测试方法 细度测定 |
China National Standards Test methods pastes |
English PDF |
GB/T 17473.1-2008 |
Test methods of precious metals pastes used for microelectronics-Determination of solids content 微电子技术用贵金属浆料测试方法 固体含量测定 |
China National Standards Test methods pastes |
English PDF |
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