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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 15651.7-2024 |
Printed board assembly - Part 6: Evaluation requirements for voids in ball grid array (BGA) and land grid array (LGA) solder joints and test methods {译} 半导体器件-第5-7部分：光电子器件-光电二极管和光电晶体管 |
China National Standards Test methods printed |
 English PDF |
| GB/T 13557-2017 |
Test methods for copper-clad material for flexible printed circuits 印制电路用挠性覆铜箔材料试验方法 |
China National Standards Test methods printed |
English PDF |
| GB/T 4722-2017 |
Test methods for rigid copper clad laminates for printed circuits board 印制电路用刚性覆铜箔层压板试验方法 |
China National Standards Test methods printed |
English PDF |
| GB/T 33016-2016 |
Test methods for bongding sheet for multilayer printed boards 多层印制板用粘结片试验方法 |
China National Standards Test methods printed |
English PDF |
| GB/T 29847-2013 |
Test methods for copper foil used for printed boards 印制板用铜箔试验方法 |
China National Standards Test methods printed |
English PDF |
| GB/T 20633.2-2011 |
Coatings for loaded printed wire boards (conformal coatings) - Part 2：Methods of test 承载印制电路板用涂料(敷形涂料) 第2部分：试验方法 |
China National Standards Test methods printed |
English PDF |
| GB/T 17961-2010 |
Requirements and test methods for printed Chinese character recognition system 印刷体汉字识别系统要求与测试方法 |
China National Standards Test methods printed |
English PDF |
| GB/T 4677-2002 |
Test methods of printed boards 印制板测试方法 |
China National Standards Test methods printed |
English PDF |
| GB/T 4722-1992 |
Test methods for copper-clad laminatedsheets for printed circuits 印制电路用覆铜箔层压板试验方法 |
China National Standards Test methods printed |
English PDF |
| GB/T 13557-1992 |
Test methods for flexible copper-clad material for printed circuits 印制电路用挠性覆铜箔材料试验方法 |
China National Standards Test methods printed |
English PDF |
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