Standard Code | Standard Title | Standard Class | Order |
---|---|---|---|
GB/Z 14048.24-2024 |
Low-voltage switchgear and control equipment - Part 7-5: Auxiliary devices - Terminal blocks for aluminum conductors {译} 低压开关设备和控制设备-第7-5部分:辅助器件-铝导体的接线端子排 |
China National Standards conductor |
English PDF |
GB/T 14264-2024 |
Terms of semiconductor materials {译} 半导体材料术语 |
China National Standards conductor |
English PDF |
GB/T 43894.1-2024 |
Evaluation of near-edge geometry of semiconductor wafers - Part 1: High radial second derivative method (ZDD) {译} 半导体晶片近边缘几何形态评价-第1部分:高度径向二阶导数法(ZDD) |
China National Standards conductor |
English PDF |
GB/T 43967-2024 |
Space environment - single particle effect pulse laser test method for semiconductor devices for aerospace use {译} 空间环境-宇航用半导体器件单粒子效应脉冲激光试验方法 |
China National Standards conductor |
English PDF |
GB/T 44003-2024 |
Mechanical Property Measurement - Test Method for Delamination Strength of REBCO Coated conductors (Copper Plating) {译} 力学性能测量-REBCO涂层导体(镀铜)脱层强度测试方法 |
China National Standards conductor |
English PDF |
GB/T 43777-2024 |
Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors {译} 化妆品中功效组分虾青素的测定-高效液相色谱法 |
China National Standards conductor |
English PDF |
GB/T 15651.5-2024 |
Semiconductor devices - Part 5-5: Optoelectronic devices - Optocouplers {译} 半导体器件-第5-5部分:光电子器件-光电耦合器 |
China National Standards conductor |
English PDF |
GB/T 4937.35-2024 |
Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy of plastic encapsulated electronic components {译} 半导体器件-机械和气候试验方法-第35部分:塑封电子元器件的声学显微镜检查 |
China National Standards conductor |
English PDF |
GB/T 4937.34-2024 |
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling {译} 半导体器件-机械和气候试验方法-第34部分:功率循环 |
China National Standards conductor |
English PDF |
GB/T 43493.3-2023 |
Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第3部分:缺陷的光致发光检测方法 |
China National Standards conductor |
English PDF |
GB/T 43493.2-2023 |
Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分:缺陷的光学检测方法 |
China National Standards conductor |
English PDF |
GB/T 43493.1-2023 |
Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 1: Defect classification {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第1部分:缺陷分类 |
China National Standards conductor |
English PDF |
GB/T 43366-2023 |
General specification for semiconductor discrete devices for aerospace applications {译} 宇航用半导体分立器件通用规范 |
China National Standards conductor |
English PDF |
GB/T 4937.26-2023 |
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM) {译} 半导体器件 机械和气候试验方法 第26部分:静电放电(ESD)敏感度测试 人体模型(HBM) |
China National Standards conductor |
English PDF |
GB/T 4587-2023 |
Semiconductor Devices Discrete Devices Part 7: Bipolar Transistors {译} 半导体器件 分立器件 第7部分:双极型晶体管 |
China National Standards conductor |
English PDF |
GB/T 43226-2023 |
Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications {译} 宇航用半导体集成电路单粒子软错误时域测试方法 |
China National Standards conductor |
English PDF |
GB/T 43136-2023 |
Superabrasive products Grinding wheels for precision scribing of semiconductor chips {译} 超硬磨料制品 半导体芯片精密划切用砂轮 |
China National Standards conductor |
English PDF |
GB/T 43061-2023 |
Semiconductor integrated circuit PWM controller test method {译} 半导体集成电路 PWM控制器测试方法 |
China National Standards conductor |
English PDF |
GB/T 43040-2023 |
Semiconductor integrated circuit AC/DC converter test method {译} 半导体集成电路 AC/DC变换器测试方法 |
China National Standards conductor |
English PDF |
GB/T 43035-2023 |
Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements {译} 半导体器件 集成电路 第20部分:膜集成电路和混合膜集成电路总规范 第一篇:内部目检要求 |
China National Standards conductor |
English PDF |
GB/T 42975-2023 |
Semiconductor integrated circuit driver test methods {译} 半导体集成电路 驱动器测试方法 |
China National Standards conductor |
English PDF |
GB/T 42974-2023 |
Semiconductor integrated circuit flash memory (FLASH) {译} 半导体集成电路 快闪存储器(FLASH) |
China National Standards conductor |
English PDF |
GB/T 42973-2023 |
Semiconductor integrated circuit Digital-to-analog (DA) converter {译} 半导体集成电路 数字模拟(DA)转换器 |
China National Standards conductor |
English PDF |
GB/T 42970-2023 |
Semiconductor integrated circuit video encoding and decoding circuit testing method {译} 半导体集成电路 视频编解码电路测试方法 |
China National Standards conductor |
English PDF |
GB/T 20870.5-2023 |
Semiconductor devices Part 16-5: Microwave integrated circuits Oscillators {译} 半导体器件 第16-5部分:微波集成电路 振荡器 |
China National Standards conductor |
English PDF |
GB/T 20870.2-2023 |
Semiconductor devices Part 16-2: Microwave integrated circuits Prescalers {译} 半导体器件 第16-2部分:微波集成电路 预分频器 |
China National Standards conductor |
English PDF |
GB/T 20870.10-2023 |
Semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures {译} 半导体器件 第16-10部分:单片微波集成电路技术可接收程序 |
China National Standards conductor |
English PDF |
GB/T 15651.6-2023 |
Semiconductor devices Part 5-6: Optoelectronic devices Light emitting diodes {译} 半导体器件 第5-6部分:光电子器件 发光二极管 |
China National Standards conductor |
English PDF |
GB/T 12113-2023 |
Methods of measurement of touch current and protective conductor current {译} 接触电流和保护导体电流的测量方法 |
China National Standards conductor |
English PDF |
GB/T 42709.19-2023 |
Semiconductor devices Microelectronic mechanical devices Part 19: Electronic compass {译} 半导体器件 微电子机械器件 第19部分:电子罗盘 |
China National Standards conductor |
English PDF |
GB/T 42676-2023 |
Testing the quality of semiconductor single crystals X-ray diffraction method {译} 半导体单晶晶体质量的测试 X射线衍射法 |
China National Standards conductor |
English PDF |
GB/T 6616-2023 |
Testing of semiconductor wafer resistivity and semiconductor film sheet resistance non-contact eddy current method {译} 半导体晶片电阻率及半导体薄膜薄层电阻的测试 非接触涡流法 |
China National Standards conductor |
English PDF |
GB/T 1555-2023 |
Semiconductor single crystal crystal orientation determination method {译} 半导体单晶晶向测定方法 |
China National Standards conductor |
English PDF |
GB/T 42848-2023 |
Semiconductor integrated circuits - Test methods for direct digital frequency synthesizers {译} 半导体集成电路 直接数字频率合成器测试方法 |
China National Standards conductor |
English PDF |
GB/T 42839-2023 |
Semiconductor integrated circuit Analog-to-digital (AD) converter {译} 半导体集成电路 模拟数字(AD)转换器 |
China National Standards conductor |
English PDF |
GB/T 42838-2023 |
Semiconductor integrated circuit Hall circuit test method {译} 半导体集成电路 霍尔电路测试方法 |
China National Standards conductor |
English PDF |
GB/T 42837-2023 |
Microwave semiconductor integrated circuit amplifier {译} 微波半导体集成电路 放大器 |
China National Standards conductor |
English PDF |
GB/T 42836-2023 |
Microwave semiconductor integrated circuit mixer {译} 微波半导体集成电路 混频器 |
China National Standards conductor |
English PDF |
GB/T 42835-2023 |
Semiconductor integrated circuit system on chip (SoC) {译} 半导体集成电路 片上系统(SoC) |
China National Standards conductor |
English PDF |
GB/T 22077-2023 |
Test method for creep of overhead conductors {译} 架空导线蠕变试验方法 |
China National Standards conductor |
English PDF |
GB/T 4937.23-2023 |
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life {译} 半导体器件 机械和气候试验方法 第23部分:高温工作寿命 |
China National Standards conductor |
English PDF |
GB/T 4937.27-2023 |
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM) {译} 半导体器件 机械和气候试验方法 第27部分:静电放电(ESD)敏感度测试 机器模型(MM) |
China National Standards conductor |
English PDF |
GB/T 4937.32-2023 |
Semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) {译} 半导体器件 机械和气候试验方法 第32部分:塑封器件的易燃性(外部引起的) |
China National Standards conductor |
English PDF |
GB/T 4937.31-2023 |
Semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) {译} 半导体器件 机械和气候试验方法 第31部分:塑封器件的易燃性(内部引起的) |
China National Standards conductor |
English PDF |
GB/T 42706.5-2023 |
Electronic components - Long term storage of semiconductor devices - Part 5: Chips and wafers {译} 电子元器件 半导体器件长期贮存 第5部分:芯片和晶圆 |
China National Standards conductor |
English PDF |
GB/T 42706.2-2023 |
Electronic components - Long-term storage of semiconductor devices - Part 2: Degradation mechanisms {译} 电子元器件 半导体器件长期贮存 第2部分:退化机理 |
China National Standards conductor |
English PDF |
GB/T 42706.1-2023 |
Electronic components - Long term storage of semiconductor devices - Part 1: General {译} 电子元器件 半导体器件长期贮存 第1部分:总则 |
China National Standards conductor |
English PDF |
GB/T 15879.604-2023 |
Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages {译} 半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法 |
China National Standards conductor |
English PDF |
GB/T 4937.42-2023 |
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage {译} 半导体器件 机械和气候试验方法 第42部分:温湿度贮存 |
China National Standards conductor |
English PDF |
GB/T 42709.7-2023 |
Semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection {译} 半导体器件 微电子机械器件 第7部分:用于射频控制和选择的MEMS体声波滤波器和双工器 |
China National Standards conductor |
English PDF |
GB/T 42709.5-2023 |
Semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches {译} 半导体器件 微电子机械器件 第5部分:射频MEMS开关 |
China National Standards conductor |
English PDF |
GB/T 8446.3-2022 |
Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners 电力半导体器件用散热器 第3部分:绝缘件和紧固件 |
China National Standards conductor |
English PDF |
GB/T 8446.2-2022 |
Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop 电力半导体器件用散热器 第2部分:热阻和流阻测量方法 |
China National Standards conductor |
English PDF |
GB/T 8446.1-2022 |
Heat sinks for power semiconductor devices—Part 1: Radiators 电力半导体器件用散热器 第1部分:散热体 |
China National Standards conductor |
English PDF |
GB/T 8750-2022 |
Gold-based bonding wire and ribbon for semiconductor packaging {译} 半导体封装用金基键合丝、带 |
China National Standards conductor |
English PDF |
GB/T 34590.11-2022 |
Road vehicles - Functional safety - Part 11: Guidelines for semiconductor applications {译} 道路车辆 功能安全 第11部分:半导体应用指南 |
China National Standards conductor |
English PDF |
GB/T 14048.22-2022 |
Low-voltage switchgear and controlgear - Part 7-4: Auxiliary devices - PCB terminal blocks for copper conductors {译} 低压开关设备和控制设备 第7-4部分:辅助器件 铜导体的PCB接线端子排 |
China National Standards conductor |
English PDF |
GB/T 42043-2022 |
Aerospace - Aluminum alloy and copper-clad aluminum conductors for electrical wires - General performance requirements {译} 航空航天 电线的铝合金和铜包铝导体 通用性能要求 |
China National Standards conductor |
English PDF |
GB/T 41852-2022 |
Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译} 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 |
China National Standards conductor |
English PDF |
GB/T 41853-2022 |
Semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement {译} 半导体器件 微机电器件 晶圆间键合强度测量 |
China National Standards conductor |
English PDF |
GB/T 40296-2021 |
Practical superconducting wires—Twist pitch measurement method of Nb-Ti and Nb3Sn composite superconductors 实用超导线 铌-钛(Nb-Ti)与铌三锡(Nb3Sn)复合超导体的扭距测量方法 |
China National Standards conductor |
English PDF |
GB/T 21548-2021 |
Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems 光通信用高速直接调制半导体激光器的测量方法 |
China National Standards conductor |
English PDF |
GB/T 7092-2021 |
Outline dimensions of semiconductor integrated circuits 半导体集成电路外形尺寸 |
China National Standards conductor |
English PDF |
GB/T 41040-2021 |
COTS semiconductor parts for space application -- Quality assurance requirements 宇航用商业现货(COTS)半导体器件 质量保证要求 |
China National Standards conductor |
English PDF |
GB/T 40819-2021 |
Aeolian vibration fatigue test method for overhead conductors and cables 架空线缆微风振动疲劳试验方法 |
China National Standards conductor |
English PDF |
GB/T 39187-2020 |
Jack up conductor/blow out preventer tension compensation system 自升式平台隔水管/防喷器张力补偿系统 |
China National Standards conductor |
English PDF |
GB/T 25085.4-2020 |
Road vehicles—Automotive cables—Part 4: Dimensions and requirements for 30 V a.c. or 60 V d.c. single-core aluminium conductor cables 道路车辆 汽车电缆 第4部分:交流30 V或直流60 V单芯铝导体电缆的尺寸和要求 |
China National Standards conductor |
English PDF |
GB/T 38841-2020 |
Mechanical properties measurement—Room temperature tensile test of reacted Nb3Sn composite superconductors 力学性能测量 反应后的Nb3Sn复合超导线室温拉伸试验方法 |
China National Standards conductor |
English PDF |
GB/T 25085.3-2020 |
Road vehicles—Automotive cables—Part 3: Dimensions and requirements for 30 V a.c. or 60 V d.c. single-core copper conductor cables 道路车辆 汽车电缆 第3部分:交流30 V或直流60 V单芯铜导体电缆的尺寸和要求 |
China National Standards conductor |
English PDF |
GB/T 5584.4-2020 |
Rectangular copper or aluminium and its alloy wires for electrical purposes—Part 4: Strip copper conductor 电工用铜、铝及其合金扁线 第4部分:铜带 |
China National Standards conductor |
English PDF |
GB/T 25897-2020 |
Residual resistance ratio measurement—Residual resistance ratio of Nb-Ti and Nb3Sn composite superconductors 剩余电阻比测量 铌-钛(Nb-Ti)和铌三锡(Nb3Sn)复合超导体剩余电阻比测量 |
China National Standards conductor |
English PDF |
GB/T 33588.4-2020 |
Lightning protection system components (LPSC)—Part 4: Requirements for conductor fasteners 雷电防护系统部件(LPSC)第4部分:导体的紧固件要求 |
China National Standards conductor |
English PDF |
GB/T 33588.2-2020 |
Lightning protection system components (LPSC)—Part 2: Requirements for air-termination systems,down-conductors and earth electrodes 雷电防护系统部件(LPSC)第2部分:接闪器、引下线和接地极的要求 |
China National Standards conductor |
English PDF |
GB/T 38345-2019 |
General design requirements of semiconductor integrate circuit for space application 宇航用半导体集成电路通用设计要求 |
China National Standards conductor |
English PDF |
GB/T 15879.4-2019 |
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages 半导体器件的机械标准化 第4部分:半导体器件封装外形的分类和编码体系 |
China National Standards conductor |
English PDF |
GB/T 37329-2019 |
Aluminum alloy wire for the conductor of electric security fence 电子围栏导体用铝合金线材 |
China National Standards conductor |
English PDF |
GB/T 37751.33-2019 |
Residual current operated circuit-breakers for household and similar use—Part 3-3: Specific requirements for RCDs with screw-type terminals for external untreated aluminium conductors and with aluminium screw-type terminals for use with copper or with alu 家用和类似用途的剩余电流动作断路器 第3-3部分:具有连接外部未经处理铝导线的螺纹型接线端子和连接铜或铝导线的铝制螺纹型接线端子RCD的特殊要求 |
China National Standards conductor |
English PDF |
GB/T 37751.31-2019 |
Residual current operated circuit-breakers for household and similar use—Part 3-1:Particular requirements for RCDs with screwless-type terminals for external copper conductors 家用和类似用途的剩余电流动作断路器 第3-1部分:具有连接外部铜导线的无螺纹型接线端子的RCD的特殊要求 |
China National Standards conductor |
English PDF |
GB/T 4026-2019 |
Basic and safety principles for man-machine interface, marking and identification—Identification of equipment terminals, conductor terminations and conductors 人机界面标志标识的基本和安全规则 设备端子、导体终端和导体的标识 |
China National Standards conductor |
English PDF |
GB/T 37312.1-2019 |
Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors 航空电子过程管理 航空航天、国防及其他高性能应用领域(ADHP)电子元器件 第1部分:高可靠集成电路与分立半导体器件通用要求 |
China National Standards conductor |
English PDF |
GB/T 11498-2018 |
Semiconductor devices—Integrated circuits—Part 21:Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分:膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) |
China National Standards conductor |
English PDF |
GB/T 13062-2018 |
Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21-1部分:膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) |
China National Standards conductor |
English PDF |
GB/T 14844-2018 |
Designations of semiconductor materials 半导体材料牌号表示方法 |
China National Standards conductor |
English PDF |
GB/T 37131-2018 |
Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy 纳米技术-半导体纳米粉体材料紫外-可见漫反射光谱的测试方法 |
China National Standards conductor |
English PDF |
GB/T 37031-2018 |
Semiconductor lighting terminology 半导体照明术语 |
China National Standards conductor |
English PDF |
GB/T 20141-2018 |
Formed wire concentric lay overhead electrical stranded conductors 型线同心绞架空导线 |
China National Standards conductor |
English PDF |
GB/T 36279-2018 |
Methods for testing self-damping characteristics of overhead conductors 架空导线自阻尼特性测试方法 |
China National Standards conductor |
English PDF |
GB/T 36474-2018 |
Semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM) 半导体集成电路 第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法 |
China National Standards conductor |
English PDF |
GB/T 36477-2018 |
Semiconductor integrated circuit—Measuring methods for flash memory 半导体集成电路 快闪存储器测试方法 |
China National Standards conductor |
English PDF |
GB/T 36551-2018 |
Calculation methods for properties of concentric lay overhead electrical stranded conductors 同心绞架空导线性能计算方法 |
China National Standards conductor |
English PDF |
GB/T 4728.3-2018 |
Graphical symbols for electrical diagrams—Part 3:conductors and connecting devices 电气简图用图形符号 第3部分: 导体和连接件 |
China National Standards conductor |
English PDF |
GB/T 36360-2018 |
Semiconductor optoelectronic devices--Blank detail specification for middle power light-emitting diodes 半导体光电子器件 中功率发光二极管空白详细规范 |
China National Standards conductor |
English PDF |
GB/T 36358-2018 |
Semiconductor optoelectronic devices—Blank detail specification for power light-emitting diodes 半导体光电子器件 功率发光二极管空白详细规范 |
China National Standards conductor |
English PDF |
GB/T 36359-2018 |
Semiconductor optoelectronic devices—Blank detail specification for lower power light-emitting diodes 半导体光电子器件 小功率发光二极管空白详细规范 |
China National Standards conductor |
English PDF |
GB/T 4728.5-2018 |
Graphical symbols for electrical diagrams—Part 5:Semiconductors and electron tubes 电气简图用图形符号 第5部分:半导体管和电子管 |
China National Standards conductor |
English PDF |
GB/T 36292-2018 |
Greases for overhead conductors 架空导线用防腐脂 |
China National Standards conductor |
English PDF |
GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards conductor |
English PDF |
GB/T 4937.22-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength 半导体器件 机械和气候试验方法 第22部分:键合强度 |
China National Standards conductor |
English PDF |
GB/T 4937.21-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 半导体器件 机械和气候试验方法 第21部分:可焊性 |
China National Standards conductor |
English PDF |
GB/T 11313.11-2018 |
Radio-frequency connectors—Part 11:Sectional specification for RF coaxial connectors with inner diameter of outer conductor 9.5mm (0.374in) with screw coupling with characteristic impedance 50Ω (type 4.1/9.5) 射频连接器 第11部分:外导体内径为9.5mm(0.374in)、特性阻抗为50Ω、螺纹连接的射频同轴连接器(4.1/9.5型)分规范 |
China National Standards conductor |
English PDF |
GB/T 4937.14-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations(lead integrity) 半导体器件 机械和气候试验方法 第14部分:引出端强度(引线牢固性) |
China National Standards conductor |
English PDF |
GB/T 4937.201-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20-1部分:对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输 |
China National Standards conductor |
English PDF |
GB/T 4937.13-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere 半导体器件 机械和气候试验方法 第13部分:盐雾 |
China National Standards conductor |
English PDF |
GB/T 4937.20-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20部分:塑封表面安装器件耐潮湿和焊接热综合影响 |
China National Standards conductor |
English PDF |
GB/T 4937.15-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices 半导体器件 机械和气候试验方法 第15部分:通孔安装器件的耐焊接热 |
China National Standards conductor |
English PDF |
GB/T 4937.12-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency 半导体器件 机械和气候试验方法 第12部分:扫频振动 |
China National Standards conductor |
English PDF |
GB/T 4937.18-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) 半导体器件 机械和气候试验方法 第18部分:电离辐照(总剂量) |
China National Standards conductor |
English PDF |
GB/T 4937.19-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength 半导体器件 机械和气候试验方法 第19部分:芯片剪切强度 |
China National Standards conductor |
English PDF |
GB/T 4937.30-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件 机械和气候试验方法 第30部分:非密封表面安装器件在可靠性试验前的预处理 |
China National Standards conductor |
English PDF |
GB/T 36611-2018 |
Mechanical properties measurement—Room temperature tensile test of Ag-and/or Ag alloy-sheathed Bi-2223 and Bi-2212 composite superconductors 力学性能测量 Ag和/或Ag合金包套Bi-2223和Bi-2212复合超导体室温拉伸试验方法 |
China National Standards conductor |
English PDF |
GB/T 36646-2018 |
Equipment for preparation of nitride semiconductor materials by hydride vapor phase epitaxy 制备氮化物半导体材料用氢化物气相外延设备 |
China National Standards conductor |
English PDF |
GB/T 4937.17-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation 半导体器件 机械和气候试验方法 第17部分:中子辐照 |
China National Standards conductor |
English PDF |
GB/T 4937.11-2018 |
Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method 半导体器件 机械和气候试验方法 第11部分:快速温度变化 双液槽法 |
China National Standards conductor |
English PDF |
GB/T 36005-2018 |
Measuring methods of optical radiation safety for semiconductor lighting equipments and systems 半导体照明设备和系统的光辐射安全测试方法 |
China National Standards conductor |
English PDF |
GB/T 22586-2018 |
Electronic characteristic measurements—Surface resistance of superconductors at microwave frequencies 电子学特性测量 超导体在微波频率下的表面电阻 |
China National Standards conductor |
English PDF |
GB/T 35010.2-2018 |
Semiconductor die products—Part 2: Exchange data formats 半导体芯片产品 第2部分:数据交换格式 |
China National Standards conductor |
English PDF |
GB/T 35010.6-2018 |
Semiconductor die products—Part 6: Requirements for concerning thermal simulation 半导体芯片产品 第6部分:热仿真要求 |
China National Standards conductor |
English PDF |
GB/T 35010.8-2018 |
Semiconductor die products—Part8: EXPRESS model schema for data exchange 半导体芯片产品 第8部分:数据交换的EXPRESS格式 |
China National Standards conductor |
English PDF |
GB/T 35007-2018 |
Semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路 低电压差分信号电路测试方法 |
China National Standards conductor |
English PDF |
GB/T 35006-2018 |
Semiconductor integrated circuits—Measuring method of level converter 半导体集成电路 电平转换器测试方法 |
China National Standards conductor |
English PDF |
GB/T 35010.5-2018 |
Semiconductor die products—Part 5:Requirements for concerning electrical simulation 半导体芯片产品 第5部分:电学仿真要求 |
China National Standards conductor |
English PDF |
GB/T 35010.7-2018 |
Semiconductor die products—Part 7: XML schema for data exchange 半导体芯片产品 第7部分:数据交换的XML格式 |
China National Standards conductor |
English PDF |
GB/T 35010.1-2018 |
Semiconductor die products—Part 1:Requirements for procurement and use 半导体芯片产品 第1部分:采购和使用要求 |
China National Standards conductor |
English PDF |
GB/T 14028-2018 |
Semiconductor integrated circuits—Measuring method of analogue switch 半导体集成电路 模拟开关测试方法 |
China National Standards conductor |
English PDF |
GB/T 35010.3-2018 |
Semiconductor die products—Part 3: Guide for handling, packing and storage 半导体芯片产品 第3部分:操作、包装和贮存指南 |
China National Standards conductor |
English PDF |
GB/T 4377-2018 |
Semiconductor integrated circuits—Measuring method of voltage regulators 半导体集成电路 电压调整器测试方法 |
China National Standards conductor |
English PDF |
GB/T 35010.4-2018 |
Semiconductor die products—Part 4: Requirements for die users and suppliers 半导体芯片产品 第4部分:芯片使用者和供应商要求 |
China National Standards conductor |
English PDF |
GB/T 18502-2018 |
Critical current measurement—DC critical current of Ag-and/or Ag alloy-sheathed Bi-2212 and Bi-2223 oxide superconductors 临界电流测量 银和/或银合金包套Bi-2212和Bi-2223氧化物超导体的直流临界电流 |
China National Standards conductor |
English PDF |
GB/T 35852-2018 |
Dimensions and characteristics of conductors for general purpose aircraft electrical cables and aerospace applications 飞机通用电缆和航空航天应用的导体尺寸和特性 |
China National Standards conductor |
English PDF |
GB/T 17737.101-2018 |
Coaxial communication cables—Part 1-101: Electrical test methods—Test for conductor d.c. resistance of cable 同轴通信电缆 第1-101部分:电气试验方法 导体直流电阻试验 |
China National Standards conductor |
English PDF |
GB/T 11313.15-2018 |
Radio frequency connectors—Part 15: R.F.coaxial connectors with inner diameter of outer conductor 4.13mm(0.163in), characteristic impedance 50 ohms, screw coupling (Type SMA) 射频连接器 第15部分:外导体内径为4.13mm(0.163in)、特性阻抗为50Ω、螺纹连接的射频同轴连接器(SMA型) |
China National Standards conductor |
English PDF |
GB/T 1179-2017 |
Round wire concentric lay overhead electrical stranded conductors 圆线同心绞架空导线 |
China National Standards conductor |
English PDF |
GB/T 17048-2017 |
Hard-draw aluminium wire for overhead line conductor 架空绞线用硬铝线 |
China National Standards conductor |
English PDF |
GB/T 34971-2017 |
Guide for gaseous effluent handling in semiconductor industry 半导体制造用气体处理指南 |
China National Standards conductor |
English PDF |
GB/T 34507-2017 |
Palladium coated copper bonding wire for semiconductor package 封装键合用镀钯铜丝 |
China National Standards conductor |
English PDF |
GB/T 5226.33-2017 |
Electrical safety of machinary—Electrical equipment of machines—Part 33: Requirements for semiconductor fabrication equipment 机械电气安全 机械电气设备 第33部分:半导体设备技术条件 |
China National Standards conductor |
English PDF |
GB/T 34502-2017 |
Gold-coated silver and silver alloy bonding wires for semiconductor package 封装键合用镀金银及银合金丝 |
China National Standards conductor |
English PDF |
GB/T 16895.3-2017 |
Low-voltage electrical installations—Part 5-54: Selection and erection of electrical equipment—Earthing arrangements and protective conductors 低压电气装置 第5-54部分:电气设备的选择和安装 接地配置和保护导体 |
China National Standards conductor |
English PDF |
GB/T 15651.4-2017 |
Semiconductor devices—Discrete devices—Part 5-4:Optoelectronic devices—Semiconductor lasers 半导体器件 分立器件 第5-4部分:光电子器件 半导体激光器 |
China National Standards conductor |
English PDF |
GB/T 12631-2017 |
Test method for resistance of conductors of printed boards 印制板导线电阻测试方法 |
China National Standards conductor |
English PDF |
GB/T 33588.2-2017 |
Lightning protection system components(LPSC)—Part 2: Requirements for conductors and earth electrodes 雷电防护系统部件(LPSC) 第2部分:导体和接地极的要求 |
China National Standards conductor |
English PDF |
GB/T 249-2017 |
The rule of type designation for discrete semiconductor devices 半导体分立器件型号命名方法 |
China National Standards conductor |
English PDF |
GB/T 33588.4-2017 |
Lightning protection system components(LPSC)—Part 4: Requirements for conductor fasteners 雷电防护系统部件(LPSC) 第4部分:导体紧固件的要求 |
China National Standards conductor |
English PDF |
GB/T 33597-2017 |
Continuously transposed conductors 换位导线 |
China National Standards conductor |
English PDF |
GB/T 17196-2017 |
Connecting devices—Flat quick-connect terminations for electrical copper conductors—Safety requirements 连接器件 连接铜导线用的扁形快速连接端头 安全要求 |
China National Standards conductor |
English PDF |
GB/T 14048.22-2017 |
Low-voltage switchgear and controlgear—Part 7-4: Ancillary equipment—PCB terminal blocks for copper conductors 低压开关设备和控制设备 第7-4部分:辅助器件 铜导体的PCB接线端子排 |
China National Standards conductor |
English PDF |
GB/T 22587-2017 |
Matrix to superconductor volume ratio measurement—Copper to superconductor volume ratio of Cu/Nb-Ti composite superconducting wires 基体与超导体体积比测量 铜-铌鈦(Cu Nb-Ti)复合超导线铜-超[体积]比的测量 |
China National Standards conductor |
English PDF |
GB/T 14048.12-2016 |
Low-voltage switchgear and controlgear—Part 4-3: Contactors and motor-starters—AC semiconductor controllers and contactors for non-motor loads 低压开关设备和控制设备 第4-3部分:接触器和电动机起动器 非电动机负载用交流半导体控制器和接触器 |
China National Standards conductor |
English PDF |
GB/T 32817-2016 |
Semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS 半导体器件 微机电器件 MEMS总规范 |
China National Standards conductor |
English PDF |
GB/T 14048.6-2016 |
Low-voltage switchgear and controlgear—Part 4-2: Contactors and motor-starters—AC semiconductor motor controllers and starters (including soft-starters) 低压开关设备和控制设备 第4-2部分:接触器和电动机起动器 交流电动机用半导体控制器和起动器(含软起动器) |
China National Standards conductor |
English PDF |
GB/T 14048.8-2016 |
Low-voltage switchgear and controlgear—Part 7-2: Ancillary equipment—Protective conductor terminal blocks for copper conductors 低压开关设备和控制设备 第7-2部分:辅助器件 铜导体的保护导体接线端子排 |
China National Standards conductor |
English PDF |
GB/T 13539.4-2016 |
Low-voltage fuses—Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices 低压熔断器 第4部分:半导体设备保护用熔断体的补充要求 |
China National Standards conductor |
English PDF |
GB/T 32502-2016 |
Overhead electrical stranded conductors composite core supported/reinforced 复合材料芯架空导线 |
China National Standards conductor |
English PDF |
GB/T 32499-2016 |
Connecting devices—Devices for the connection of aluminium conductors in clamping units of any material and copper conductors in aluminium bodied clamping units 连接器件 任何材料的夹紧件用铝线的连接器件及铝基夹紧件用铜线的连接器件 |
China National Standards conductor |
English PDF |
GB/T 14048.7-2016 |
Low-voltage switchgear and controlgear—Part 7-1:Ancillary equipment—Terminal blocks for copper conductors 低压开关设备和控制设备 第7-1部分:辅助器件 铜导体的接线端子排 |
China National Standards conductor |
English PDF |
GB/T 4023-2015 |
Semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分:整流二极管 |
China National Standards conductor |
English PDF |
GB/T 15291-2015 |
Semiconductor devices—Part 6: Thyristors 半导体器件 第6部分:晶闸管 |
China National Standards conductor |
English PDF |
GB/T 31780-2015 |
Critical temperature measurement—Critical temperature of composite superconductors by a resistance method 临界温度测量 电阻法测复合超导体临界温度 |
China National Standards conductor |
English PDF |
GB/T 11313.8-2015 |
Radio-frequency connectors—Part 8: Sectional specification for RF coaxial connectors with inner diameter of outer conductor 6.5 mm (0.256 in) with bayonet lock—Characteristic impedance 50Ω(75Ω)(type BNC) 射频连接器 第8部分:外导体内径为6.5mm(0.256in)、特性阻抗为50Ω(75Ω)、卡口连接的射频同轴连接器(BNC型)分规范 |
China National Standards conductor |
English PDF |
GB/T 11313.16-2015 |
Radio-frequency connectors—Part 16:Sectional specification for RF coaxial connectors with inner diameter of outer conductor 7 mm (0.276 in) with screw coupling—Characteristics impedance 50 Ω (75 Ω) (type N) 射频连接器 第16部分:外导体内径为7mm(0.276in)、特性阻抗为50Ω(75Ω)、螺纹连接的射频同轴连接器(N型)分规范 |
China National Standards conductor |
English PDF |
GB/T 31469-2015 |
Semiconductor materials cutting fluid 半导体材料切削液 |
China National Standards conductor |
English PDF |
GB/T 16525-2015 |
Semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 |
China National Standards conductor |
English PDF |
GB/T 15878-2015 |
Semiconductor integrated circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 |
China National Standards conductor |
English PDF |
GB/T 15876-2015 |
Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 |
China National Standards conductor |
English PDF |
GB/T 14112-2015 |
Semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 |
China National Standards conductor |
English PDF |
GB/T 31527-2015 |
Mechanical properties measurement—Room temperature tensile test of NbTi/Cu composite superconductors 力学性能测量 NbTi/Cu复合超导线室温拉伸试验方法 |
China National Standards conductor |
English PDF |
GB/T 31522-2015 |
Matrix to superconductor volume ratio measurement—Copper to non-copper volume ratio of Nb3Sn composite superconducting wires 基体与超导体体积比测试 Nb3Sn复合超导线铜与非铜体积比 |
China National Standards conductor |
English PDF |
GB/T 31359-2015 |
Test methods of semiconductor lasers 半导体激光器测试方法 |
China National Standards conductor |
English PDF |
GB/T 31358-2015 |
General specification for semiconductor lasers 半导体激光器总规范 |
China National Standards conductor |
English PDF |
GB/T 8750-2014 |
Gold bonding wire for semiconductor package 半导体封装用键合金丝 |
China National Standards conductor |
English PDF |
GB/T 30537-2014 |
Superconductivity―Measurements for bulk high temperature superconductors―Trapped flux density of large grain oxide superconductors 超导电性 块状高温超导体的测量 大晶粒氧化物超导体的俘获磁通密度 |
China National Standards conductor |
English PDF |
GB/T 30552-2014 |
Aluminium alloy wires for conductors of insulated cables 电缆导体用铝合金线 |
China National Standards conductor |
English PDF |
GB/T 30551-2014 |
Thermal-resistant aluminium alloy wire for overhead line conductor 架空绞线用耐热铝合金线 |
China National Standards conductor |
English PDF |
GB/T 30550-2014 |
Concentric lay stranded overhead electrical conductors containing one or more gap(s) 含有一个或多个间隙的同心绞架空导线 |
China National Standards conductor |
English PDF |
GB/T 15877-2013 |
Semiconductor integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 |
China National Standards conductor |
English PDF |
GB/T 15872-2013 |
Power supply interface for semiconductor equipment 半导体设备电源接口 |
China National Standards conductor |
English PDF |
GB/T 30116-2013 |
Requirements for semiconductor manufacturing facility electromagnetic compatibility 半导体生产设施电磁兼容性要求 |
China National Standards conductor |
English PDF |
GB/T 29845-2013 |
Guide for final assembly, packaging,transportation, unpacking, and relocation of semiconductor manufacturing equipment 半导体制造设备的最终装配、包装、运输、拆包及安放导则 |
China National Standards conductor |
English PDF |
GB/T 3859.3-2013 |
Semiconductor converters - General requirements and line commutated converters - Part 1-3: Transformers and reactors 半导体变流器 通用要求和电网换相变流器 第1-3部分:变压器和电抗器 |
China National Standards conductor |
English PDF |
GB/T 3859.2-2013 |
Semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guide 半导体变流器 通用要求和电网换相变流器 第1-2部分:应用导则 |
China National Standards conductor |
English PDF |
GB/T 3859.1-2013 |
Semiconductor converters - General requirements and line commutated Converters - Part 1-1: Specification of basic requirements 半导体变流器 通用要求和电网换相变流器 第1-1部分:基本要求规范 |
China National Standards conductor |
English PDF |
GB/T 13422-2013 |
Semiconductor converters - Electrical test methods 半导体变流器 电气试验方法 |
China National Standards conductor |
English PDF |
GB/T 3428-2012 |
Zinc-coated steel wires for stranded conductors 架空绞线用镀锌钢线 |
China National Standards conductor |
English PDF |
GB/T 29332-2012 |
Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors(IGBT) 半导体器件 分立器件 第9部分:绝缘栅双极晶体管(IGBT) |
China National Standards conductor |
English PDF |
GB/T 29325-2012 |
Annealed aluminum formed wires for overhead electrical conductors 架空导线用软铝型线 |
China National Standards conductor |
English PDF |
GB/T 29324-2012 |
Fiber reinforced polymer matrix composite core for overhead electrical conductors 架空导线用纤维增强树脂基复合材料芯棒 |
China National Standards conductor |
English PDF |
GB/T 29299-2012 |
General specification of semiconductor laser rangefinder 半导体激光测距仪通用技术条件 |
China National Standards conductor |
English PDF |
GB/T 13973-2012 |
General specification test methods for semiconductor device curve tracers 半导体管特性图示仪通用规范 |
China National Standards conductor |
English PDF |
GB 17464-2012 |
Connecting devices - Electrical copper conductors - Safety requirements for screw-type and screwless-type clamping units - Part 1: General requirements and particular requirements for clamping units for conductors from 0.2 mm2 up to 35 mm2 (included) 连接器件 电气铜导线 螺纹型和无螺纹型夹紧件的安全要求 适用于0.2 mm2以上至35 mm2(包括)导线的夹紧件的通用要求和特殊要求 |
China National Standards conductor |
English PDF |
GB/T 4937.4-2012 |
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) 半导体器件 机械和气候试验方法 第4部分:强加速稳态湿热试验(HAST) |
China National Standards conductor |
English PDF |
GB/T 4937.3-2012 |
Semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination 半导体器件 机械和气候试验方法 第3部分:外部目检 |
China National Standards conductor |
English PDF |
GB/T 28871-2012 |
Critical current measurement-DC critical current of Nb3Sn composite superconductors 铌三锡(Nb3Sn)复合超导体的直流临界电流测量 |
China National Standards conductor |
English PDF |
GB/T 5201-2012 |
Test procedures for semiconductor charged particle detectors 带电粒子半导体探测器测量方法 |
China National Standards conductor |
English PDF |
GB/T 12669-2012 |
General specification for cascade speed control assembly with semiconductor converter 半导体变流串级调速装置总技术条件 |
China National Standards conductor |
English PDF |
GB/T 12667-2012 |
General specification for excitation assembly with semiconductors for synchronous motors 同步电动机半导体励磁装置总技术条件 |
China National Standards conductor |
English PDF |
GB/T 27676-2011 |
Aluminium and aluminium alloy tube bus conductors 铝及铝合金管形导体 |
China National Standards conductor |
English PDF |
GB 7947-2010 |
Basic and safety principles for man-machine interface,marking and identification - Identification of conductors by colours or alphanumerics 人机界面标志标识的基本和安全规则 导体颜色或字母数字标识 |
China National Standards conductor |
English PDF |
GB/T 4026-2010 |
Basic and safety principles for man-machine interface,marking and identification - Identification of equipment terminals and conductor terminations 人机界面标志标识的基本和安全规则 设备端子和导体终端的标识 |
China National Standards conductor |
English PDF |
GB/T 26070-2010 |
Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method 化合物半导体抛光晶片亚表面损伤的反射差分谱测试方法 |
China National Standards conductor |
English PDF |
GB/T 25897-2010 |
Superconductivity: Residual resistance ratio measurement of Nb-Ti composite superconductors 超导电性:铌-酞复合超导体剩余电阻比测定 |
China National Standards conductor |
English PDF |
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