China National Standards

China devices—Mechanical GB Standards List


  •  China "devices—Mechanical" GB Standards List:
  • Standard  Code Standard Title Standard Class Order
    GB/T 4937.22-2018 Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
    半导体器件 机械和气候试验方法 第22部分:键合强度
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.21-2018 Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
    半导体器件 机械和气候试验方法 第21部分:可焊性
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.14-2018 Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations(lead integrity)
    半导体器件 机械和气候试验方法 第14部分:引出端强度(引线牢固性)
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.201-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    半导体器件 机械和气候试验方法 第20-1部分:对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.13-2018 Semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere
    半导体器件 机械和气候试验方法 第13部分:盐雾
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.20-2018 Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    半导体器件 机械和气候试验方法 第20部分:塑封表面安装器件耐潮湿和焊接热综合影响
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.15-2018 Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
    半导体器件 机械和气候试验方法 第15部分:通孔安装器件的耐焊接热
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.12-2018 Semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency
    半导体器件 机械和气候试验方法 第12部分:扫频振动
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.18-2018 Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
    半导体器件 机械和气候试验方法 第18部分:电离辐照(总剂量)
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.19-2018 Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
    半导体器件 机械和气候试验方法 第19部分:芯片剪切强度
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
    半导体器件 机械和气候试验方法 第30部分:非密封表面安装器件在可靠性试验前的预处理
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.17-2018 Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
    半导体器件 机械和气候试验方法 第17部分:中子辐照
    China National Standards
    devices—Mechanical

    English PDF
    GB/T 4937.11-2018 Semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method
    半导体器件 机械和气候试验方法 第11部分:快速温度变化 双液槽法
    China National Standards
    devices—Mechanical

    English PDF

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