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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 15879.4-2019 |
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages 半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系 |
China National Standards outlines |
 English PDF |
| GB/T 7249-2016 |
Maximum lamp outlines for incandescent lamps 白炽灯的最大外形尺寸 |
China National Standards outlines |
English PDF |
| GB/T 7249-2008 |
Maximum lamp outlines for incandescent lamps 白炽灯的最大外形尺寸 |
China National Standards outlines |
English PDF |
| GB/T 20143-2006 |
Procedure for use in the preparation of maximum lamp outlines 灯最大外形尺寸图的制定程序 |
China National Standards outlines |
English PDF |
| GB/T 15138-1994 |
Case outlines for film integrated circuits and hybrid integrated circuits 膜集成电路和混合集成电路外形尺寸 |
China National Standards outlines |
English PDF |
| GB/T 7581-1987 |
Dimensions of outlines for semiconductor discrete devices 半导体分立器件外形尺寸 |
China National Standards outlines |
English PDF |
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