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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 43723-2024 |
Performance requirements for semi-integrated LED lamps with a power supply voltage not greater than 50V AC effective value or 120V DC without ripple for general lighting {译} 普通照明用电源电压不大于交流有效值50V或无纹波直流120V的半集成式LED灯-性能要求 |
China National Standards semi |
 English PDF |
| GB-29995-2024 |
Energy consumption limit per unit product for coal-based activated carbon and semi-coke {译} 煤基活性炭和兰炭单位产品能源消耗限额 |
China National Standards semi |
English PDF |
| GB/T 14264-2024 |
Terms of semiconductor materials {译} 半导体材料术语 |
China National Standards semi |
English PDF |
| GB/T 17737.10-2024 |
Coaxial communication cables - Part 10: Sectional specification for fluoropolymer insulated semi-rigid cables {译} 同轴通信电缆-第10部分：含氟聚合物绝缘半硬电缆分规范 |
China National Standards semi |
English PDF |
| GB/T 17737.11-2024 |
Coaxial communication cables - Part 11: Sectional specification for polyethylene insulated semi-rigid cables {译} 同轴通信电缆-第11部分：聚乙烯绝缘半硬电缆分规范 |
China National Standards semi |
English PDF |
| GB/T 20790-2024 |
semi-feed combine harvesters - Technical conditions {译} 半喂入联合收割机-技术条件 |
China National Standards semi |
English PDF |
| GB/T 43894.1-2024 |
Evaluation of near-edge geometry of semiconductor wafers - Part 1: High radial second derivative method (ZDD) {译} 半导体晶片近边缘几何形态评价-第1部分：高度径向二阶导数法（ZDD） |
China National Standards semi |
English PDF |
| GB/T 43967-2024 |
Space environment - single particle effect pulse laser test method for semiconductor devices for aerospace use {译} 空间环境-宇航用半导体器件单粒子效应脉冲激光试验方法 |
China National Standards semi |
English PDF |
| GB/T 43777-2024 |
semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors {译} 化妆品中功效组分虾青素的测定-高效液相色谱法 |
China National Standards semi |
English PDF |
| GB/T 15651.5-2024 |
semiconductor devices - Part 5-5: Optoelectronic devices - Optocouplers {译} 半导体器件-第5-5部分：光电子器件-光电耦合器 |
China National Standards semi |
English PDF |
| GB/T 4937.35-2024 |
semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy of plastic encapsulated electronic components {译} 半导体器件-机械和气候试验方法-第35部分：塑封电子元器件的声学显微镜检查 |
China National Standards semi |
English PDF |
| GB/T 4937.34-2024 |
semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling {译} 半导体器件-机械和气候试验方法-第34部分：功率循环 |
China National Standards semi |
English PDF |
| GB/T 43626-2023 |
Safety regulations for semi-integrated LED lamps with power supply voltage not greater than AC rms 50V or ripple-free DC 120V for general lighting {译} 普通照明用电源电压不大于交流有效值50V或无纹波直流120V的半集成式LED灯 安全规范 |
China National Standards semi |
English PDF |
| GB/T 43493.3-2023 |
semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第3部分：缺陷的光致发光检测方法 |
China National Standards semi |
English PDF |
| GB/T 43493.2-2023 |
semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分：缺陷的光学检测方法 |
China National Standards semi |
English PDF |
| GB/T 43493.1-2023 |
semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 1: Defect classification {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第1部分：缺陷分类 |
China National Standards semi |
English PDF |
| GB/T 39075.201-2023 |
Organic light-emitting diode (OLED) light sources for general lighting Safety Part 2-1: Special requirements semi-integrated OLED modules {译} 普通照明用有机发光二极管（OLED）光源 安全 第2-1部分：特殊要求 半集成式OLED模块 |
China National Standards semi |
English PDF |
| GB/T 43366-2023 |
General specification for semiconductor discrete devices for aerospace applications {译} 宇航用半导体分立器件通用规范 |
China National Standards semi |
English PDF |
| GB/T 23986.2-2023 |
Paints and varnishes - Determination of volatile organic compounds (VOC) and/or semi-volatile organic compounds (SVOC) content - Part 2: Gas chromatography {译} 色漆和清漆 挥发性有机化合物(VOC)和/或半挥发性有机化合物(SVOC)含量的测定 第2部分：气相色谱法 |
China National Standards semi |
English PDF |
| GB/T 4937.26-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM) {译} 半导体器件 机械和气候试验方法 第26部分：静电放电（ESD）敏感度测试 人体模型（HBM） |
China National Standards semi |
English PDF |
| GB/T 4587-2023 |
semiconductor Devices Discrete Devices Part 7: Bipolar Transistors {译} 半导体器件 分立器件 第7部分：双极型晶体管 |
China National Standards semi |
English PDF |
| GB/T 43226-2023 |
Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications {译} 宇航用半导体集成电路单粒子软错误时域测试方法 |
China National Standards semi |
English PDF |
| GB/T 43136-2023 |
Superabrasive products Grinding wheels for precision scribing of semiconductor chips {译} 超硬磨料制品 半导体芯片精密划切用砂轮 |
China National Standards semi |
English PDF |
| GB/T 43061-2023 |
semiconductor integrated circuit PWM controller test method {译} 半导体集成电路 PWM控制器测试方法 |
China National Standards semi |
English PDF |
| GB/T 43040-2023 |
semiconductor integrated circuit AC/DC converter test method {译} 半导体集成电路 AC/DC变换器测试方法 |
China National Standards semi |
English PDF |
| GB/T 43035-2023 |
semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements {译} 半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求 |
China National Standards semi |
English PDF |
| GB/T 42975-2023 |
semiconductor integrated circuit driver test methods {译} 半导体集成电路 驱动器测试方法 |
China National Standards semi |
English PDF |
| GB/T 42974-2023 |
semiconductor integrated circuit flash memory (FLASH) {译} 半导体集成电路 快闪存储器（FLASH） |
China National Standards semi |
English PDF |
| GB/T 42973-2023 |
semiconductor integrated circuit Digital-to-analog (DA) converter {译} 半导体集成电路 数字模拟（DA）转换器 |
China National Standards semi |
English PDF |
| GB/T 42970-2023 |
semiconductor integrated circuit video encoding and decoding circuit testing method {译} 半导体集成电路 视频编解码电路测试方法 |
China National Standards semi |
English PDF |
| GB/T 20870.5-2023 |
semiconductor devices Part 16-5: Microwave integrated circuits Oscillators {译} 半导体器件 第16-5部分：微波集成电路 振荡器 |
China National Standards semi |
English PDF |
| GB/T 20870.2-2023 |
semiconductor devices Part 16-2: Microwave integrated circuits Prescalers {译} 半导体器件 第16-2部分：微波集成电路 预分频器 |
China National Standards semi |
English PDF |
| GB/T 20870.10-2023 |
semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures {译} 半导体器件 第16-10部分：单片微波集成电路技术可接收程序 |
China National Standards semi |
English PDF |
| GB/T 15651.6-2023 |
semiconductor devices Part 5-6: Optoelectronic devices Light emitting diodes {译} 半导体器件 第5-6部分：光电子器件 发光二极管 |
China National Standards semi |
English PDF |
| GB/T 42898-2023 |
Testing of semi-Volatile Organic Compounds (SVOC) Release in Building Materials Products {译} 建材产品中半挥发性有机化合物（SVOC）释放量的测试 |
China National Standards semi |
English PDF |
| GB/T 42709.19-2023 |
semiconductor devices Microelectronic mechanical devices Part 19: Electronic compass {译} 半导体器件 微电子机械器件 第19部分：电子罗盘 |
China National Standards semi |
English PDF |
| GB/T 42676-2023 |
Testing the quality of semiconductor single crystals X-ray diffraction method {译} 半导体单晶晶体质量的测试 X射线衍射法 |
China National Standards semi |
English PDF |
| GB/T 6616-2023 |
Testing of semiconductor wafer resistivity and semiconductor film sheet resistance non-contact eddy current method {译} 半导体晶片电阻率及半导体薄膜薄层电阻的测试 非接触涡流法 |
China National Standards semi |
English PDF |
| GB/T 1555-2023 |
semiconductor single crystal crystal orientation determination method {译} 半导体单晶晶向测定方法 |
China National Standards semi |
English PDF |
| GB/T 19831.3-2023 |
Oil and gas industry Casing centralizers Part 3: Rigid and semi-rigid centralizers {译} 石油天然气工业 套管扶正器 第3部分：刚性和半刚性扶正器 |
China National Standards semi |
English PDF |
| GB/T 42848-2023 |
semiconductor integrated circuits - Test methods for direct digital frequency synthesizers {译} 半导体集成电路 直接数字频率合成器测试方法 |
China National Standards semi |
English PDF |
| GB/T 42839-2023 |
semiconductor integrated circuit Analog-to-digital (AD) converter {译} 半导体集成电路 模拟数字（AD）转换器 |
China National Standards semi |
English PDF |
| GB/T 42838-2023 |
semiconductor integrated circuit Hall circuit test method {译} 半导体集成电路 霍尔电路测试方法 |
China National Standards semi |
English PDF |
| GB/T 42837-2023 |
Microwave semiconductor integrated circuit amplifier {译} 微波半导体集成电路 放大器 |
China National Standards semi |
English PDF |
| GB/T 42836-2023 |
Microwave semiconductor integrated circuit mixer {译} 微波半导体集成电路 混频器 |
China National Standards semi |
English PDF |
| GB/T 42835-2023 |
semiconductor integrated circuit system on chip (SoC) {译} 半导体集成电路 片上系统（SoC） |
China National Standards semi |
English PDF |
| GB/T 42736-2023 |
semi-conductive polyolefin heat shrink tubing {译} 半导电聚烯烃热收缩管 |
China National Standards semi |
English PDF |
| GB/T 4937.23-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life {译} 半导体器件 机械和气候试验方法 第23部分：高温工作寿命 |
China National Standards semi |
English PDF |
| GB/T 4937.27-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM) {译} 半导体器件 机械和气候试验方法 第27部分：静电放电（ESD）敏感度测试 机器模型（MM） |
China National Standards semi |
English PDF |
| GB/T 4937.32-2023 |
semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) {译} 半导体器件 机械和气候试验方法 第32部分：塑封器件的易燃性（外部引起的） |
China National Standards semi |
English PDF |
| GB/T 4937.31-2023 |
semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) {译} 半导体器件 机械和气候试验方法 第31部分：塑封器件的易燃性（内部引起的） |
China National Standards semi |
English PDF |
| GB/T 42706.5-2023 |
Electronic components - Long term storage of semiconductor devices - Part 5: Chips and wafers {译} 电子元器件 半导体器件长期贮存 第5部分：芯片和晶圆 |
China National Standards semi |
English PDF |
| GB/T 42706.2-2023 |
Electronic components - Long-term storage of semiconductor devices - Part 2: Degradation mechanisms {译} 电子元器件 半导体器件长期贮存 第2部分：退化机理 |
China National Standards semi |
English PDF |
| GB/T 42706.1-2023 |
Electronic components - Long term storage of semiconductor devices - Part 1: General {译} 电子元器件 半导体器件长期贮存 第1部分：总则 |
China National Standards semi |
English PDF |
| GB/T 15879.604-2023 |
Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages {译} 半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法 |
China National Standards semi |
English PDF |
| GB/T 4937.42-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage {译} 半导体器件 机械和气候试验方法 第42部分：温湿度贮存 |
China National Standards semi |
English PDF |
| GB/T 42709.7-2023 |
semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection {译} 半导体器件 微电子机械器件 第7部分：用于射频控制和选择的MEMS体声波滤波器和双工器 |
China National Standards semi |
English PDF |
| GB/T 42709.5-2023 |
semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches {译} 半导体器件 微电子机械器件 第5部分：射频MEMS开关 |
China National Standards semi |
English PDF |
| GB/T 42125.14-2023 |
Safety requirements for electrical equipment for measurement, control and laboratory use - Part 14: Particular requirements for automatic and semi-automatic laboratory equipment for analysis and other purposes {译} 测量、控制和实验室用电气设备的安全要求 第14部分：实验室用分析和其他目的自动和半自动设备的特殊要求 |
China National Standards semi |
English PDF |
| GB/T 32250.4-2022 |
Agricultural and forestry machinery Testing of sprayers in use Part 4: Stationary and semi-mobile sprayers {译} 农林机械 在用喷雾机的检测 第4部分：固定式和半移动式喷雾机 |
China National Standards semi |
English PDF |
| GB/T 41604-2022 |
Agricultural vehicles Steering systems for agricultural trailers semi-trailer articulated steering connections {译} 农业车辆 农用挂车转向系统 半挂车铰接式转向装置连接 |
China National Standards semi |
English PDF |
| GB/T 23336-2022 |
General technical conditions for semi-trailers {译} 半挂车通用技术条件 |
China National Standards semi |
English PDF |
| GB/T 8446.3-2022 |
Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners 电力半导体器件用散热器 第3部分：绝缘件和紧固件 |
China National Standards semi |
English PDF |
| GB/T 8446.2-2022 |
Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop 电力半导体器件用散热器 第2部分：热阻和流阻测量方法 |
China National Standards semi |
English PDF |
| GB/T 8446.1-2022 |
Heat sinks for power semiconductor devices—Part 1: Radiators 电力半导体器件用散热器 第1部分：散热体 |
China National Standards semi |
English PDF |
| GB/T 17737.8-2022 |
Coaxial communication cables—Part 8: Sectional specification for semi-flexible cables with polytetrafluoroethylene (PTFE) dielectric 同轴通信电缆 第8部分：聚四氟乙烯绝缘半柔电缆分规范 |
China National Standards semi |
English PDF |
| GB/T 17737.801-2022 |
Coaxial communication cables—Part 8-1: Blank detail specification for semi-flexible cables with polytetrafluoroethylene (PTFE) dielectric 同轴通信电缆 第8-1部分：聚四氟乙烯绝缘半柔电缆空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 8750-2022 |
Gold-based bonding wire and ribbon for semiconductor packaging {译} 半导体封装用金基键合丝、带 |
China National Standards semi |
English PDF |
| GB/T 34590.11-2022 |
Road vehicles - Functional safety - Part 11: Guidelines for semiconductor applications {译} 道路车辆 功能安全 第11部分：半导体应用指南 |
China National Standards semi |
English PDF |
| GB/T 41066.2-2022 |
Oil and gas drilling and production equipment Offshore oil semi-submersible drilling platform Part 2: Construction, installation, commissioning and acceptance {译} 石油天然气钻采设备 海洋石油半潜式钻井平台 第2部分：建造安装和调试验收 |
China National Standards semi |
English PDF |
| GB/T 41066.3-2022 |
Oil and gas drilling equipment - Offshore oil semi-submersible drilling platform - Part 3: Operation and inspection {译} 石油天然气钻采设备 海洋石油半潜式钻井平台 第3部分：操作和检验 |
China National Standards semi |
English PDF |
| GB/T 254-2022 |
semi-refined paraffin {译} 半精炼石蜡 |
China National Standards semi |
English PDF |
| GB/T 42271-2022 |
Non-contact measurement method for resistivity of semi-insulating silicon carbide single crystal {译} 半绝缘碳化硅单晶的电阻率非接触测试方法 |
China National Standards semi |
English PDF |
| GB/T 42248-2022 |
Determination of iodine and bromine content in soil and water system sediment semi-melting-inductively coupled plasma mass spectrometry {译} 土壤、水系沉积物 碘、溴含量的测定 半熔-电感耦合等离子体质谱法 |
China National Standards semi |
English PDF |
| GB/T 41862-2022 |
Earthmoving and Mining Machinery Autonomous and semi-Autonomous Machine Systems Safety {译} 土方及矿山机械 自主和半自主机器系统安全 |
China National Standards semi |
English PDF |
| GB/T 41852-2022 |
semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译} 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 |
China National Standards semi |
English PDF |
| GB/T 41853-2022 |
semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement {译} 半导体器件 微机电器件 晶圆间键合强度测量 |
China National Standards semi |
English PDF |
| GB/T 21548-2021 |
Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems 光通信用高速直接调制半导体激光器的测量方法 |
China National Standards semi |
English PDF |
| GB/T 7092-2021 |
Outline dimensions of semiconductor integrated circuits 半导体集成电路外形尺寸 |
China National Standards semi |
English PDF |
| GB/T 41040-2021 |
COTS semiconductor parts for space application -- Quality assurance requirements 宇航用商业现货（COTS）半导体器件 质量保证要求 |
China National Standards semi |
English PDF |
| GB/T 41066.1-2021 |
Petroleum drilling and production equipment—Offshore semisubmersible drilling unit—Part 1：Functional configuration and design 石油天然气钻采设备 海洋石油半潜式钻井平台 第1部分:功能配置和设计 |
China National Standards semi |
English PDF |
| GB/T 40809-2021 |
Casting aluminum alloys—Process specification for semisolid rheo-diecasting forming 铸造铝合金 半固态流变压铸成形工艺规范 |
China National Standards semi |
English PDF |
| GB/T 39037.1-2021 |
Lashing and securing arrangements on road vehicles for sea transportation on Ro/Ro ships—General requirements—Part 1：Commercial vehicles and combinations of vehicles，semi-trailers excluded 用于海上滚装船运输的道路车辆的系固点与系固设施布置 通用要求 第1部分：商用车和汽车列车（不包括半挂车） |
China National Standards semi |
English PDF |
| GB/T 39015.2-2020 |
Road vehicles—Interchangeability of mechanical couplings between tractors and semi-trailers—Part 2: Low-coupling tractors and high-volume semi-trailers 道路车辆 牵引车与半挂车之间机械连接互换性 第2部分：低牵引座半挂牵引车与大容积半挂车 |
China National Standards semi |
English PDF |
| GB/T 39037.2-2020 |
Lashing and securing arrangements on road vehicles for sea transportation on Ro/Ro ships—General requirements—Part 2: semi-trailers 用于海上滚装船运输的道路车辆的系固点与系固设施布置 通用要求 第2部分：半挂车 |
China National Standards semi |
English PDF |
| GB/T 39714.2-2020 |
Plastics—Polytetrafluoroethylene(PTFE) semi-finished products—Part 2:Preparation of test specimens and determination of properties 塑料 聚四氟乙烯(PTFE)半成品 第2部分：试样制备和性能测定 |
China National Standards semi |
English PDF |
| GB/T 39714.1-2020 |
Plastics—Polytetrafluoroethylene(PTFE) semi-finished products—Part 1:Requirements and designation 塑料 聚四氟乙烯(PTFE)半成品 第1部分：要求和命名 |
China National Standards semi |
English PDF |
| GB/T 39515.4-2020 |
Agricultural and forestry machinery—Environmental requirements for sprayers—Part 4: Fixed and semi-mobile sprayers 农林机械 喷雾机的环境要求 第4部分：固定式和半移动式喷雾机 |
China National Standards semi |
English PDF |
| GB/T 38345-2019 |
General design requirements of semiconductor integrate circuit for space application 宇航用半导体集成电路通用设计要求 |
China National Standards semi |
English PDF |
| GB/T 15879.4-2019 |
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages 半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系 |
China National Standards semi |
English PDF |
| GB/T 37499-2019 |
Safety and control devices for gas burners and gas-burning appliances—Particular requirements—Automatic and semi-automatic valves 燃气燃烧器和燃烧器具用安全和控制装置 特殊要求 自动和半自动阀 |
China National Standards semi |
English PDF |
| GB/T 37527-2019 |
Specifications for early-warning message dissemination on mobile phone client 基于手机客户端的预警信息播发规范 |
China National Standards semi |
English PDF |
| GB/T 37312.1-2019 |
Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors 航空电子过程管理 航空航天、国防及其他高性能应用领域（ADHP）电子元器件 第1部分：高可靠集成电路与分立半导体器件通用要求 |
China National Standards semi |
English PDF |
| GB/T 37019.3-2018 |
Specification for national BeiDou augmentation system dissemination interface—Part 3：Digital audio broadcasting in FM band 卫星导航地基增强系统播发接口规范-第3部分：调频频段数字音频广播 |
China National Standards semi |
English PDF |
| GB/T 37019.2-2018 |
Specification for national BeiDou augmentation system dissemination interface—Part 2：China Mobile Multi-media Broadcasting 卫星导航地基增强系统播发接口规范-第2部分：中国移动多媒体广播 |
China National Standards semi |
English PDF |
| GB/T 37019.1-2018 |
Specification for national BeiDou augmentation system dissemination interface—Part 1：Mobile communication network 卫星导航地基增强系统播发接口规范-第1部分：移动通信网 |
China National Standards semi |
English PDF |
| GB/T 11498-2018 |
semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) |
China National Standards semi |
English PDF |
| GB/T 13062-2018 |
semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) |
China National Standards semi |
English PDF |
| GB/T 22861-2018 |
Worsted yarn interweave with woollen yarn fabric and semi-worsted fabric 精粗梳交织及半精梳毛织品 |
China National Standards semi |
English PDF |
| GB/T 1550-2018 |
Test methods for conductivity type of extrinsic semiconducting materials 非本征半导体材料导电类型测试方法 |
China National Standards semi |
English PDF |
| GB/T 14844-2018 |
Designations of semiconductor materials 半导体材料牌号表示方法 |
China National Standards semi |
English PDF |
| GB/T 37131-2018 |
Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy 纳米技术-半导体纳米粉体材料紫外-可见漫反射光谱的测试方法 |
China National Standards semi |
English PDF |
| GB/T 37031-2018 |
semiconductor lighting terminology 半导体照明术语 |
China National Standards semi |
English PDF |
| GB/T 36226-2018 |
Stainless steel—Determination of manganse, nickel, chromium, molybdenum, copper and titanium—Handheld energy dispersive X-Ray fluorescence spectrometric method (semiquantitative method) 不锈钢 锰、镍、铬、钼、铜和钛含量的测定 手持式能量色散X射线荧光光谱法(半定量法) |
China National Standards semi |
English PDF |
| GB/T 36474-2018 |
semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM) 半导体集成电路 第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法 |
China National Standards semi |
English PDF |
| GB/T 36477-2018 |
semiconductor integrated circuit—Measuring methods for flash memory 半导体集成电路 快闪存储器测试方法 |
China National Standards semi |
English PDF |
| GB/T 36360-2018 |
semiconductor optoelectronic devices--Blank detail specification for middle power light-emitting diodes 半导体光电子器件 中功率发光二极管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 36358-2018 |
semiconductor optoelectronic devices—Blank detail specification for power light-emitting diodes 半导体光电子器件 功率发光二极管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 36359-2018 |
semiconductor optoelectronic devices—Blank detail specification for lower power light-emitting diodes 半导体光电子器件 小功率发光二极管空白详细规范 |
China National Standards semi |
English PDF |
| GB/T 4728.5-2018 |
Graphical symbols for electrical diagrams—Part 5：semiconductors and electron tubes 电气简图用图形符号 第5部分：半导体管和电子管 |
China National Standards semi |
English PDF |
| GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards semi |
English PDF |
| GB/T 4937.22-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength 半导体器件 机械和气候试验方法 第22部分：键合强度 |
China National Standards semi |
English PDF |
| GB/T 4937.21-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 半导体器件 机械和气候试验方法 第21部分：可焊性 |
China National Standards semi |
English PDF |
| GB/T 4937.14-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity） 半导体器件 机械和气候试验方法 第14部分：引出端强度（引线牢固性） |
China National Standards semi |
English PDF |
| GB/T 4937.201-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输 |
China National Standards semi |
English PDF |
| GB/T 4937.13-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere 半导体器件 机械和气候试验方法 第13部分：盐雾 |
China National Standards semi |
English PDF |
| GB/T 4937.20-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20部分：塑封表面安装器件耐潮湿和焊接热综合影响 |
China National Standards semi |
English PDF |
| GB/T 4937.15-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices 半导体器件 机械和气候试验方法 第15部分：通孔安装器件的耐焊接热 |
China National Standards semi |
English PDF |
| GB/T 4937.12-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency 半导体器件 机械和气候试验方法 第12部分：扫频振动 |
China National Standards semi |
English PDF |
| GB/T 4937.18-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) 半导体器件 机械和气候试验方法 第18部分：电离辐照(总剂量) |
China National Standards semi |
English PDF |
| GB/T 4937.19-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength 半导体器件 机械和气候试验方法 第19部分：芯片剪切强度 |
China National Standards semi |
English PDF |
| GB/T 4937.30-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件 机械和气候试验方法 第30部分：非密封表面安装器件在可靠性试验前的预处理 |
China National Standards semi |
English PDF |
| GB/T 36646-2018 |
Equipment for preparation of nitride semiconductor materials by hydride vapor phase epitaxy 制备氮化物半导体材料用氢化物气相外延设备 |
China National Standards semi |
English PDF |
| GB/T 4937.17-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation 半导体器件 机械和气候试验方法 第17部分：中子辐照 |
China National Standards semi |
English PDF |
| GB/T 4937.11-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method 半导体器件 机械和气候试验方法 第11部分：快速温度变化 双液槽法 |
China National Standards semi |
English PDF |
| GB/T 35989.1-2018 |
Petroleum and natural gas industries—Floating offshore structures—Part 1: Monohulls, semi-submersibles and spars 石油天然气工业 海上浮式结构 第1部分：单体船、半潜式平台和深吃水立柱式平台 |
China National Standards semi |
English PDF |
| GB/T 35897-2018 |
Pyropia yezoensis—Technical protocols for semi-floating raft cultivation 条斑紫菜 半浮动筏式栽培技术规范 |
China National Standards semi |
English PDF |
| GB/T 36005-2018 |
Measuring methods of optical radiation safety for semiconductor lighting equipments and systems 半导体照明设备和系统的光辐射安全测试方法 |
China National Standards semi |
English PDF |
| GB/T 35010.2-2018 |
semiconductor die products—Part 2: Exchange data formats 半导体芯片产品 第2部分：数据交换格式 |
China National Standards semi |
English PDF |
| GB/T 35010.6-2018 |
semiconductor die products—Part 6: Requirements for concerning thermal simulation 半导体芯片产品 第6部分：热仿真要求 |
China National Standards semi |
English PDF |
| GB/T 35010.8-2018 |
semiconductor die products—Part8: EXPRESS model schema for data exchange 半导体芯片产品 第8部分：数据交换的EXPRESS格式 |
China National Standards semi |
English PDF |
| GB/T 35007-2018 |
semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路 低电压差分信号电路测试方法 |
China National Standards semi |
English PDF |
| GB/T 35006-2018 |
semiconductor integrated circuits—Measuring method of level converter 半导体集成电路 电平转换器测试方法 |
China National Standards semi |
English PDF |
| GB/T 35010.5-2018 |
semiconductor die products—Part 5：Requirements for concerning electrical simulation 半导体芯片产品 第5部分：电学仿真要求 |
China National Standards semi |
English PDF |
| GB/T 35010.7-2018 |
semiconductor die products—Part 7: XML schema for data exchange 半导体芯片产品 第7部分：数据交换的XML格式 |
China National Standards semi |
English PDF |
| GB/T 35010.1-2018 |
semiconductor die products—Part 1：Requirements for procurement and use 半导体芯片产品 第1部分：采购和使用要求 |
China National Standards semi |
English PDF |
| GB/T 14028-2018 |
semiconductor integrated circuits—Measuring method of analogue switch 半导体集成电路 模拟开关测试方法 |
China National Standards semi |
English PDF |
| GB/T 35010.3-2018 |
semiconductor die products—Part 3: Guide for handling, packing and storage 半导体芯片产品 第3部分：操作、包装和贮存指南 |
China National Standards semi |
English PDF |
| GB/T 4377-2018 |
semiconductor integrated circuits—Measuring method of voltage regulators 半导体集成电路 电压调整器测试方法 |
China National Standards semi |
English PDF |
| GB/T 35010.4-2018 |
semiconductor die products—Part 4: Requirements for die users and suppliers 半导体芯片产品 第4部分：芯片使用者和供应商要求 |
China National Standards semi |
English PDF |
| GB/T 34971-2017 |
Guide for gaseous effluent handling in semiconductor industry 半导体制造用气体处理指南 |
China National Standards semi |
English PDF |
| GB/T 34507-2017 |
Palladium coated copper bonding wire for semiconductor package 封装键合用镀钯铜丝 |
China National Standards semi |
English PDF |
| GB/T 5226.33-2017 |
Electrical safety of machinary—Electrical equipment of machines—Part 33: Requirements for semiconductor fabrication equipment 机械电气安全 机械电气设备 第33部分：半导体设备技术条件 |
China National Standards semi |
English PDF |
| GB/T 34383-2017 |
semi-straight side press 半闭式压力机 |
China National Standards semi |
English PDF |
| GB/T 34502-2017 |
Gold-coated silver and silver alloy bonding wires for semiconductor package 封装键合用镀金银及银合金丝 |
China National Standards semi |
English PDF |
| GB/T 33862-2017 |
Automatic（semi）Kjeldahl analyzer 全(半)自动凯氏定氮仪 |
China National Standards semi |
English PDF |
| GB/T 15651.4-2017 |
semiconductor devices—Discrete devices—Part 5-4:Optoelectronic devices—Semiconductor lasers 半导体器件 分立器件 第5-4部分:光电子器件 半导体激光器 |
China National Standards semi |
English PDF |
| GB/T 33709-2017 |
Mobile laboratory—Guidance on dissemination and traceability of the value of equipment 移动实验室 仪器设备量值溯源与传递指南 |
China National Standards semi |
English PDF |
| GB/T 249-2017 |
The rule of type designation for discrete semiconductor devices 半导体分立器件型号命名方法 |
China National Standards semi |
English PDF |
| GB/T 14048.12-2016 |
Low-voltage switchgear and controlgear—Part 4-3: Contactors and motor-starters—AC semiconductor controllers and contactors for non-motor loads 低压开关设备和控制设备 第4-3部分：接触器和电动机起动器 非电动机负载用交流半导体控制器和接触器 |
China National Standards semi |
English PDF |
| GB/T 32973-2016 |
Technical specification for hot charging and hot delivery of semi-closed arc furnace 半封闭矿热炉炉料热装热送技术规范 |
China National Standards semi |
English PDF |
| GB/T 32817-2016 |
semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS 半导体器件 微机电器件 MEMS总规范 |
China National Standards semi |
English PDF |
| GB/T 14048.6-2016 |
Low-voltage switchgear and controlgear—Part 4-2: Contactors and motor-starters—AC semiconductor motor controllers and starters (including soft-starters) 低压开关设备和控制设备 第4-2部分：接触器和电动机起动器 交流电动机用半导体控制器和起动器(含软起动器) |
China National Standards semi |
English PDF |
| GB/T 13539.4-2016 |
Low-voltage fuses—Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices 低压熔断器 第4部分：半导体设备保护用熔断体的补充要求 |
China National Standards semi |
English PDF |
| GB/T 4023-2015 |
semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分：整流二极管 |
China National Standards semi |
English PDF |
| GB/T 15291-2015 |
semiconductor devices—Part 6: Thyristors 半导体器件 第6部分：晶闸管 |
China National Standards semi |
English PDF |
| GB/T 19199-2015 |
Test method for carbon acceptor concentration in semi-insulating gallium arsenide single crystals by infrared absorption spectroscopy 半绝缘砷化镓单晶中碳浓度的红外吸收测试方法 |
China National Standards semi |
English PDF |
| GB/T 17170-2015 |
Test method for the EL2 deep donor concentration in semi-insulating gallium arsenide single crystals by infrared absorption spectroscopy 半绝缘砷化镓单晶深施主EL2浓度红外吸收测试方法 |
China National Standards semi |
English PDF |
| GB/T 4085-2015 |
semirigid polyvinyl chloride floor tiles 半硬质聚氯乙烯块状地板 |
China National Standards semi |
English PDF |
| GB/T 31469-2015 |
semiconductor materials cutting fluid 半导体材料切削液 |
China National Standards semi |
English PDF |
| GB/T 16525-2015 |
semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 |
China National Standards semi |
English PDF |
| GB/T 15878-2015 |
semiconductor integrated circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 |
China National Standards semi |
English PDF |
| GB/T 15876-2015 |
semiconductor integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 |
China National Standards semi |
English PDF |
| GB/T 14112-2015 |
semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 |
China National Standards semi |
English PDF |
| GB/T 31359-2015 |
Test methods of semiconductor lasers 半导体激光器测试方法 |
China National Standards semi |
English PDF |
| GB/T 31358-2015 |
General specification for semiconductor lasers 半导体激光器总规范 |
China National Standards semi |
English PDF |
| GB/T 8750-2014 |
Gold bonding wire for semiconductor package 半导体封装用键合金丝 |
China National Standards semi |
English PDF |
| GB/T 17951.2-2014 |
Cold-rolled non-oriented electrical steel strip delivered in the semi-processed state 半工艺冷轧无取向电工钢带 |
China National Standards semi |
English PDF |
| GB/T 15877-2013 |
semiconductor integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 |
China National Standards semi |
English PDF |
| GB 4793.9-2013 |
Safety requirements for electrical equipment for measurement, control and laboratory use―Part 9: Particular requirements for automatic and semi-automatic laboratory equipment for analysis and other purposes 测量、控制和实验室用电气设备的安全要求 第9部分：实验室用分析和其他目的自动和半自动设备的特殊要求 |
China National Standards semi |
English PDF |
| GB/T 17738.4-2013 |
Radio frequency and coaxial cable assemblies－Part 4: Sectional specification for semi-rigid coaxial cable assemblies 射频同轴电缆组件 第4部分：半硬同轴电缆组件分规范 |
China National Standards semi |
English PDF |
| GB/T 17738.3-2013 |
Radio frequency and coaxial cable assemblies―Part 3：Sectional specification for semi-flexible coaxial cable assemiblies 射频同轴电缆组件 第3部分：半柔同轴电缆组件分规范 |
China National Standards semi |
English PDF |
| GB/T 15872-2013 |
Power supply interface for semiconductor equipment 半导体设备电源接口 |
China National Standards semi |
English PDF |
| GB/T 30116-2013 |
Requirements for semiconductor manufacturing facility electromagnetic compatibility 半导体生产设施电磁兼容性要求 |
China National Standards semi |
English PDF |
| GB/T 29856-2013 |
Characterization of semiconducting single-walled carbon nanotubes using near infrared photoluminescence spectroscopy 半导体性单壁碳纳米管的近红外光致发光光谱表征方法 |
China National Standards semi |
English PDF |
| GB/T 29845-2013 |
Guide for final assembly, packaging,transportation, unpacking, and relocation of semiconductor manufacturing equipment 半导体制造设备的最终装配、包装、运输、拆包及安放导则 |
China National Standards semi |
English PDF |
| GB 50874-2013 |
Code for structure design on semi-underground storage bin in coal industry 煤炭工业半地下储仓建筑结构设计规范 |
China National Standards semi |
English PDF |
| GB/T 3859.3-2013 |
semiconductor converters - General requirements and line commutated converters - Part 1-3: Transformers and reactors 半导体变流器 通用要求和电网换相变流器 第1-3部分：变压器和电抗器 |
China National Standards semi |
English PDF |
| GB/T 3859.2-2013 |
semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guide 半导体变流器 通用要求和电网换相变流器 第1-2部分：应用导则 |
China National Standards semi |
English PDF |
| GB/T 3859.1-2013 |
semiconductor converters - General requirements and line commutated Converters - Part 1-1: Specification of basic requirements 半导体变流器 通用要求和电网换相变流器 第1-1部分：基本要求规范 |
China National Standards semi |
English PDF |
| GB/T 13422-2013 |
semiconductor converters - Electrical test methods 半导体变流器 电气试验方法 |
China National Standards semi |
English PDF |
| GB/T 29332-2012 |
semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors(IGBT) 半导体器件 分立器件 第9部分：绝缘栅双极晶体管(IGBT) |
China National Standards semi |
English PDF |
| GB/T 29299-2012 |
General specification of semiconductor laser rangefinder 半导体激光测距仪通用技术条件 |
China National Standards semi |
English PDF |
| GB/T 13973-2012 |
General specification test methods for semiconductor device curve tracers 半导体管特性图示仪通用规范 |
China National Standards semi |
English PDF |
| GB/T 11436-2012 |
Chemical analysis methods for products and semi-finished products made of soft ferrite materials 软磁铁氧体材料成品、半成品化学分析方法 |
China National Standards semi |
English PDF |
| GB/T 4937.4-2012 |
semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) 半导体器件 机械和气候试验方法 第4部分：强加速稳态湿热试验（HAST） |
China National Standards semi |
English PDF |
| GB/T 4937.3-2012 |
semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination 半导体器件 机械和气候试验方法 第3部分：外部目检 |
China National Standards semi |
English PDF |
| GB 50800-2012 |
Technical code for anechoic and semi-anechoic rooms 消声室和半消声室技术规范 |
China National Standards semi |
English PDF |
| GB/T 5201-2012 |
Test procedures for semiconductor charged particle detectors 带电粒子半导体探测器测量方法 |
China National Standards semi |
English PDF |
| GB/T 12669-2012 |
General specification for cascade speed control assembly with semiconductor converter 半导体变流串级调速装置总技术条件 |
China National Standards semi |
English PDF |
| GB/T 12667-2012 |
General specification for excitation assembly with semiconductors for synchronous motors 同步电动机半导体励磁装置总技术条件 |
China National Standards semi |
English PDF |
| GB/Z 28586-2012 |
Geographic information - Web-based data dissemination specification 地理信息 基于网络的数据分发规范 |
China National Standards semi |
English PDF |
| GB 27995.2-2011 |
semi-finished spectacle lens blanks - Part 2: Specifications for progressive power lens blanks 半成品眼镜片毛坯 第2部分：渐变焦眼镜片毛坯规范 |
China National Standards semi |
English PDF |
| GB 27995.1-2011 |
semi-finished spectacle lens blanks - Part 1: Specifications for single-vision and multifocal lens blanks 半成品眼镜片毛坯 第1部分：单光和多焦点眼镜片毛坯规范 |
China National Standards semi |
English PDF |
| GB/T 19229.2-2011 |
Coal-fired flue gas desulphurization equipment - Part 2: Coal-fired dry/semi-dry flue gas desulphurization equipment 燃煤烟气脱硫设备 第2部分：燃煤烟气干法/半干法脱硫设备 |
China National Standards semi |
English PDF |
| GB/T 27524-2011 |
Cigarettes - Determination of semi-volatile compounds (pyridine, styrene, quinoline) in mainstream smoke - GC-MS method 卷烟 主流烟气中半挥发性物质(吡啶、苯乙烯、喹啉)的测定 气相色谱-质谱联用法 |
China National Standards semi |
English PDF |
| GB/T 26960-2011 |
semi automatic strapping machine 半自动捆扎机 |
China National Standards semi |
English PDF |
| GB/T 26777-2011 |
semitrailer landing gears 挂车支撑装置 |
China National Standards semi |
English PDF |
| GB/T 26070-2010 |
Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method 化合物半导体抛光晶片亚表面损伤的反射差分谱测试方法 |
China National Standards semi |
English PDF |
| GB/T 254-2010 |
semi-refined paraffin wax 半精炼石蜡 |
China National Standards semi |
English PDF |
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