Cart:
| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 14264-2024 |
Terms of semiconductor materials {译} 半导体材料术语 |
China National Standards semiconductor |
 English PDF |
| GB/T 43894.1-2024 |
Evaluation of near-edge geometry of semiconductor wafers - Part 1: High radial second derivative method (ZDD) {译} 半导体晶片近边缘几何形态评价-第1部分：高度径向二阶导数法（ZDD） |
China National Standards semiconductor |
English PDF |
| GB/T 43967-2024 |
Space environment - single particle effect pulse laser test method for semiconductor devices for aerospace use {译} 空间环境-宇航用半导体器件单粒子效应脉冲激光试验方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43777-2024 |
semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors {译} 化妆品中功效组分虾青素的测定-高效液相色谱法 |
China National Standards semiconductor |
English PDF |
| GB/T 15651.5-2024 |
semiconductor devices - Part 5-5: Optoelectronic devices - Optocouplers {译} 半导体器件-第5-5部分：光电子器件-光电耦合器 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.35-2024 |
semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy of plastic encapsulated electronic components {译} 半导体器件-机械和气候试验方法-第35部分：塑封电子元器件的声学显微镜检查 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.34-2024 |
semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling {译} 半导体器件-机械和气候试验方法-第34部分：功率循环 |
China National Standards semiconductor |
English PDF |
| GB/T 43493.3-2023 |
semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第3部分：缺陷的光致发光检测方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43493.2-2023 |
semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 2: Optical detection methods for defects {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分：缺陷的光学检测方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43493.1-2023 |
semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 1: Defect classification {译} 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第1部分：缺陷分类 |
China National Standards semiconductor |
English PDF |
| GB/T 43366-2023 |
General specification for semiconductor discrete devices for aerospace applications {译} 宇航用半导体分立器件通用规范 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.26-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) susceptibility testing Human Body Model (HBM) {译} 半导体器件 机械和气候试验方法 第26部分：静电放电（ESD）敏感度测试 人体模型（HBM） |
China National Standards semiconductor |
English PDF |
| GB/T 4587-2023 |
semiconductor Devices Discrete Devices Part 7: Bipolar Transistors {译} 半导体器件 分立器件 第7部分：双极型晶体管 |
China National Standards semiconductor |
English PDF |
| GB/T 43226-2023 |
Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications {译} 宇航用半导体集成电路单粒子软错误时域测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43136-2023 |
Superabrasive products Grinding wheels for precision scribing of semiconductor chips {译} 超硬磨料制品 半导体芯片精密划切用砂轮 |
China National Standards semiconductor |
English PDF |
| GB/T 43061-2023 |
semiconductor integrated circuit PWM controller test method {译} 半导体集成电路 PWM控制器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43040-2023 |
semiconductor integrated circuit AC/DC converter test method {译} 半导体集成电路 AC/DC变换器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 43035-2023 |
semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements {译} 半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求 |
China National Standards semiconductor |
English PDF |
| GB/T 42975-2023 |
semiconductor integrated circuit driver test methods {译} 半导体集成电路 驱动器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 42974-2023 |
semiconductor integrated circuit flash memory (FLASH) {译} 半导体集成电路 快闪存储器（FLASH） |
China National Standards semiconductor |
English PDF |
| GB/T 42973-2023 |
semiconductor integrated circuit Digital-to-analog (DA) converter {译} 半导体集成电路 数字模拟（DA）转换器 |
China National Standards semiconductor |
English PDF |
| GB/T 42970-2023 |
semiconductor integrated circuit video encoding and decoding circuit testing method {译} 半导体集成电路 视频编解码电路测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 20870.5-2023 |
semiconductor devices Part 16-5: Microwave integrated circuits Oscillators {译} 半导体器件 第16-5部分：微波集成电路 振荡器 |
China National Standards semiconductor |
English PDF |
| GB/T 20870.2-2023 |
semiconductor devices Part 16-2: Microwave integrated circuits Prescalers {译} 半导体器件 第16-2部分：微波集成电路 预分频器 |
China National Standards semiconductor |
English PDF |
| GB/T 20870.10-2023 |
semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures {译} 半导体器件 第16-10部分：单片微波集成电路技术可接收程序 |
China National Standards semiconductor |
English PDF |
| GB/T 15651.6-2023 |
semiconductor devices Part 5-6: Optoelectronic devices Light emitting diodes {译} 半导体器件 第5-6部分：光电子器件 发光二极管 |
China National Standards semiconductor |
English PDF |
| GB/T 42709.19-2023 |
semiconductor devices Microelectronic mechanical devices Part 19: Electronic compass {译} 半导体器件 微电子机械器件 第19部分：电子罗盘 |
China National Standards semiconductor |
English PDF |
| GB/T 42676-2023 |
Testing the quality of semiconductor single crystals X-ray diffraction method {译} 半导体单晶晶体质量的测试 X射线衍射法 |
China National Standards semiconductor |
English PDF |
| GB/T 6616-2023 |
Testing of semiconductor wafer resistivity and semiconductor film sheet resistance non-contact eddy current method {译} 半导体晶片电阻率及半导体薄膜薄层电阻的测试 非接触涡流法 |
China National Standards semiconductor |
English PDF |
| GB/T 1555-2023 |
semiconductor single crystal crystal orientation determination method {译} 半导体单晶晶向测定方法 |
China National Standards semiconductor |
English PDF |
| GB/T 42848-2023 |
semiconductor integrated circuits - Test methods for direct digital frequency synthesizers {译} 半导体集成电路 直接数字频率合成器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 42839-2023 |
semiconductor integrated circuit Analog-to-digital (AD) converter {译} 半导体集成电路 模拟数字（AD）转换器 |
China National Standards semiconductor |
English PDF |
| GB/T 42838-2023 |
semiconductor integrated circuit Hall circuit test method {译} 半导体集成电路 霍尔电路测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 42837-2023 |
Microwave semiconductor integrated circuit amplifier {译} 微波半导体集成电路 放大器 |
China National Standards semiconductor |
English PDF |
| GB/T 42836-2023 |
Microwave semiconductor integrated circuit mixer {译} 微波半导体集成电路 混频器 |
China National Standards semiconductor |
English PDF |
| GB/T 42835-2023 |
semiconductor integrated circuit system on chip (SoC) {译} 半导体集成电路 片上系统（SoC） |
China National Standards semiconductor |
English PDF |
| GB/T 4937.23-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life {译} 半导体器件 机械和气候试验方法 第23部分：高温工作寿命 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.27-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) susceptibility test - Machine model (MM) {译} 半导体器件 机械和气候试验方法 第27部分：静电放电（ESD）敏感度测试 机器模型（MM） |
China National Standards semiconductor |
English PDF |
| GB/T 4937.32-2023 |
semiconductor devices - Methods of mechanical and climatic tests - Part 32: Flammability of plastic encapsulated devices (externally induced) {译} 半导体器件 机械和气候试验方法 第32部分：塑封器件的易燃性（外部引起的） |
China National Standards semiconductor |
English PDF |
| GB/T 4937.31-2023 |
semiconductor devices - Methods of mechanical and climatic tests - Part 31: Flammability of plastic encapsulated devices (internal origin) {译} 半导体器件 机械和气候试验方法 第31部分：塑封器件的易燃性（内部引起的） |
China National Standards semiconductor |
English PDF |
| GB/T 42706.5-2023 |
Electronic components - Long term storage of semiconductor devices - Part 5: Chips and wafers {译} 电子元器件 半导体器件长期贮存 第5部分：芯片和晶圆 |
China National Standards semiconductor |
English PDF |
| GB/T 42706.2-2023 |
Electronic components - Long-term storage of semiconductor devices - Part 2: Degradation mechanisms {译} 电子元器件 半导体器件长期贮存 第2部分：退化机理 |
China National Standards semiconductor |
English PDF |
| GB/T 42706.1-2023 |
Electronic components - Long term storage of semiconductor devices - Part 1: General {译} 电子元器件 半导体器件长期贮存 第1部分：总则 |
China National Standards semiconductor |
English PDF |
| GB/T 15879.604-2023 |
Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages {译} 半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.42-2023 |
semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage {译} 半导体器件 机械和气候试验方法 第42部分：温湿度贮存 |
China National Standards semiconductor |
English PDF |
| GB/T 42709.7-2023 |
semiconductor devices Microelectromechanical devices Part 7: MEMS bulk acoustic wave filters and duplexers for radio frequency control and selection {译} 半导体器件 微电子机械器件 第7部分：用于射频控制和选择的MEMS体声波滤波器和双工器 |
China National Standards semiconductor |
English PDF |
| GB/T 42709.5-2023 |
semiconductor devices Microelectromechanical devices Part 5: RF MEMS switches {译} 半导体器件 微电子机械器件 第5部分：射频MEMS开关 |
China National Standards semiconductor |
English PDF |
| GB/T 8446.3-2022 |
Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners 电力半导体器件用散热器 第3部分：绝缘件和紧固件 |
China National Standards semiconductor |
English PDF |
| GB/T 8446.2-2022 |
Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop 电力半导体器件用散热器 第2部分：热阻和流阻测量方法 |
China National Standards semiconductor |
English PDF |
| GB/T 8446.1-2022 |
Heat sinks for power semiconductor devices—Part 1: Radiators 电力半导体器件用散热器 第1部分：散热体 |
China National Standards semiconductor |
English PDF |
| GB/T 8750-2022 |
Gold-based bonding wire and ribbon for semiconductor packaging {译} 半导体封装用金基键合丝、带 |
China National Standards semiconductor |
English PDF |
| GB/T 34590.11-2022 |
Road vehicles - Functional safety - Part 11: Guidelines for semiconductor applications {译} 道路车辆 功能安全 第11部分：半导体应用指南 |
China National Standards semiconductor |
English PDF |
| GB/T 41852-2022 |
semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures {译} 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法 |
China National Standards semiconductor |
English PDF |
| GB/T 41853-2022 |
semiconductor devices MEMS devices Wafer-to-wafer bond strength measurement {译} 半导体器件 微机电器件 晶圆间键合强度测量 |
China National Standards semiconductor |
English PDF |
| GB/T 21548-2021 |
Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems 光通信用高速直接调制半导体激光器的测量方法 |
China National Standards semiconductor |
English PDF |
| GB/T 7092-2021 |
Outline dimensions of semiconductor integrated circuits 半导体集成电路外形尺寸 |
China National Standards semiconductor |
English PDF |
| GB/T 41040-2021 |
COTS semiconductor parts for space application -- Quality assurance requirements 宇航用商业现货（COTS）半导体器件 质量保证要求 |
China National Standards semiconductor |
English PDF |
| GB/T 38345-2019 |
General design requirements of semiconductor integrate circuit for space application 宇航用半导体集成电路通用设计要求 |
China National Standards semiconductor |
English PDF |
| GB/T 15879.4-2019 |
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages 半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系 |
China National Standards semiconductor |
English PDF |
| GB/T 37312.1-2019 |
Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors 航空电子过程管理 航空航天、国防及其他高性能应用领域（ADHP）电子元器件 第1部分：高可靠集成电路与分立半导体器件通用要求 |
China National Standards semiconductor |
English PDF |
| GB/T 11498-2018 |
semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) |
China National Standards semiconductor |
English PDF |
| GB/T 13062-2018 |
semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) |
China National Standards semiconductor |
English PDF |
| GB/T 14844-2018 |
Designations of semiconductor materials 半导体材料牌号表示方法 |
China National Standards semiconductor |
English PDF |
| GB/T 37131-2018 |
Nanotechnologies—Test method of semiconductor nanopowder using UV-Vis diffuse reflectance spectroscopy 纳米技术-半导体纳米粉体材料紫外-可见漫反射光谱的测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 37031-2018 |
semiconductor lighting terminology 半导体照明术语 |
China National Standards semiconductor |
English PDF |
| GB/T 36474-2018 |
semiconductor integrated circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM) 半导体集成电路 第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 36477-2018 |
semiconductor integrated circuit—Measuring methods for flash memory 半导体集成电路 快闪存储器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 36360-2018 |
semiconductor optoelectronic devices--Blank detail specification for middle power light-emitting diodes 半导体光电子器件 中功率发光二极管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 36358-2018 |
semiconductor optoelectronic devices—Blank detail specification for power light-emitting diodes 半导体光电子器件 功率发光二极管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 36359-2018 |
semiconductor optoelectronic devices—Blank detail specification for lower power light-emitting diodes 半导体光电子器件 小功率发光二极管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 4728.5-2018 |
Graphical symbols for electrical diagrams—Part 5：semiconductors and electron tubes 电气简图用图形符号 第5部分：半导体管和电子管 |
China National Standards semiconductor |
English PDF |
| GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.22-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength 半导体器件 机械和气候试验方法 第22部分：键合强度 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.21-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability 半导体器件 机械和气候试验方法 第21部分：可焊性 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.14-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity） 半导体器件 机械和气候试验方法 第14部分：引出端强度（引线牢固性） |
China National Standards semiconductor |
English PDF |
| GB/T 4937.201-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20-1部分：对潮湿和焊接热综合影响敏感的表面安装器件的操作、包装、标志和运输 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.13-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 13: Salt atmosphere 半导体器件 机械和气候试验方法 第13部分：盐雾 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.20-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 半导体器件 机械和气候试验方法 第20部分：塑封表面安装器件耐潮湿和焊接热综合影响 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.15-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices 半导体器件 机械和气候试验方法 第15部分：通孔安装器件的耐焊接热 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.12-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 12: Vibration, variable frequency 半导体器件 机械和气候试验方法 第12部分：扫频振动 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.18-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose) 半导体器件 机械和气候试验方法 第18部分：电离辐照(总剂量) |
China National Standards semiconductor |
English PDF |
| GB/T 4937.19-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength 半导体器件 机械和气候试验方法 第19部分：芯片剪切强度 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.30-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件 机械和气候试验方法 第30部分：非密封表面安装器件在可靠性试验前的预处理 |
China National Standards semiconductor |
English PDF |
| GB/T 36646-2018 |
Equipment for preparation of nitride semiconductor materials by hydride vapor phase epitaxy 制备氮化物半导体材料用氢化物气相外延设备 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.17-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation 半导体器件 机械和气候试验方法 第17部分：中子辐照 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.11-2018 |
semiconductor devices—Mechanical and climatic test methods—Part 11: Rapid change of temperature—Two-fluid-bath method 半导体器件 机械和气候试验方法 第11部分：快速温度变化 双液槽法 |
China National Standards semiconductor |
English PDF |
| GB/T 36005-2018 |
Measuring methods of optical radiation safety for semiconductor lighting equipments and systems 半导体照明设备和系统的光辐射安全测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.2-2018 |
semiconductor die products—Part 2: Exchange data formats 半导体芯片产品 第2部分：数据交换格式 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.6-2018 |
semiconductor die products—Part 6: Requirements for concerning thermal simulation 半导体芯片产品 第6部分：热仿真要求 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.8-2018 |
semiconductor die products—Part8: EXPRESS model schema for data exchange 半导体芯片产品 第8部分：数据交换的EXPRESS格式 |
China National Standards semiconductor |
English PDF |
| GB/T 35007-2018 |
semiconductor integrated circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路 低电压差分信号电路测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 35006-2018 |
semiconductor integrated circuits—Measuring method of level converter 半导体集成电路 电平转换器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.5-2018 |
semiconductor die products—Part 5：Requirements for concerning electrical simulation 半导体芯片产品 第5部分：电学仿真要求 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.7-2018 |
semiconductor die products—Part 7: XML schema for data exchange 半导体芯片产品 第7部分：数据交换的XML格式 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.1-2018 |
semiconductor die products—Part 1：Requirements for procurement and use 半导体芯片产品 第1部分：采购和使用要求 |
China National Standards semiconductor |
English PDF |
| GB/T 14028-2018 |
semiconductor integrated circuits—Measuring method of analogue switch 半导体集成电路 模拟开关测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.3-2018 |
semiconductor die products—Part 3: Guide for handling, packing and storage 半导体芯片产品 第3部分：操作、包装和贮存指南 |
China National Standards semiconductor |
English PDF |
| GB/T 4377-2018 |
semiconductor integrated circuits—Measuring method of voltage regulators 半导体集成电路 电压调整器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 35010.4-2018 |
semiconductor die products—Part 4: Requirements for die users and suppliers 半导体芯片产品 第4部分：芯片使用者和供应商要求 |
China National Standards semiconductor |
English PDF |
| GB/T 34971-2017 |
Guide for gaseous effluent handling in semiconductor industry 半导体制造用气体处理指南 |
China National Standards semiconductor |
English PDF |
| GB/T 34507-2017 |
Palladium coated copper bonding wire for semiconductor package 封装键合用镀钯铜丝 |
China National Standards semiconductor |
English PDF |
| GB/T 5226.33-2017 |
Electrical safety of machinary—Electrical equipment of machines—Part 33: Requirements for semiconductor fabrication equipment 机械电气安全 机械电气设备 第33部分：半导体设备技术条件 |
China National Standards semiconductor |
English PDF |
| GB/T 34502-2017 |
Gold-coated silver and silver alloy bonding wires for semiconductor package 封装键合用镀金银及银合金丝 |
China National Standards semiconductor |
English PDF |
| GB/T 15651.4-2017 |
semiconductor devices—Discrete devices—Part 5-4:Optoelectronic devices—Semiconductor lasers 半导体器件 分立器件 第5-4部分:光电子器件 半导体激光器 |
China National Standards semiconductor |
English PDF |
| GB/T 249-2017 |
The rule of type designation for discrete semiconductor devices 半导体分立器件型号命名方法 |
China National Standards semiconductor |
English PDF |
| GB/T 14048.12-2016 |
Low-voltage switchgear and controlgear—Part 4-3: Contactors and motor-starters—AC semiconductor controllers and contactors for non-motor loads 低压开关设备和控制设备 第4-3部分：接触器和电动机起动器 非电动机负载用交流半导体控制器和接触器 |
China National Standards semiconductor |
English PDF |
| GB/T 32817-2016 |
semiconductor devices—Micro-electromechanical devices—Generic specification for MEMS 半导体器件 微机电器件 MEMS总规范 |
China National Standards semiconductor |
English PDF |
| GB/T 14048.6-2016 |
Low-voltage switchgear and controlgear—Part 4-2: Contactors and motor-starters—AC semiconductor motor controllers and starters (including soft-starters) 低压开关设备和控制设备 第4-2部分：接触器和电动机起动器 交流电动机用半导体控制器和起动器(含软起动器) |
China National Standards semiconductor |
English PDF |
| GB/T 13539.4-2016 |
Low-voltage fuses—Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices 低压熔断器 第4部分：半导体设备保护用熔断体的补充要求 |
China National Standards semiconductor |
English PDF |
| GB/T 4023-2015 |
semiconductor devices—Discrete devices and integrated circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分：整流二极管 |
China National Standards semiconductor |
English PDF |
| GB/T 15291-2015 |
semiconductor devices—Part 6: Thyristors 半导体器件 第6部分：晶闸管 |
China National Standards semiconductor |
English PDF |
| GB/T 31469-2015 |
semiconductor materials cutting fluid 半导体材料切削液 |
China National Standards semiconductor |
English PDF |
| GB/T 16525-2015 |
semiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 |
China National Standards semiconductor |
English PDF |
| GB/T 15878-2015 |
semiconductor integrated circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 |
China National Standards semiconductor |
English PDF |
| GB/T 15876-2015 |
semiconductor integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 |
China National Standards semiconductor |
English PDF |
| GB/T 14112-2015 |
semiconductor integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 |
China National Standards semiconductor |
English PDF |
| GB/T 31359-2015 |
Test methods of semiconductor lasers 半导体激光器测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 31358-2015 |
General specification for semiconductor lasers 半导体激光器总规范 |
China National Standards semiconductor |
English PDF |
| GB/T 8750-2014 |
Gold bonding wire for semiconductor package 半导体封装用键合金丝 |
China National Standards semiconductor |
English PDF |
| GB/T 15877-2013 |
semiconductor integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 |
China National Standards semiconductor |
English PDF |
| GB/T 15872-2013 |
Power supply interface for semiconductor equipment 半导体设备电源接口 |
China National Standards semiconductor |
English PDF |
| GB/T 30116-2013 |
Requirements for semiconductor manufacturing facility electromagnetic compatibility 半导体生产设施电磁兼容性要求 |
China National Standards semiconductor |
English PDF |
| GB/T 29845-2013 |
Guide for final assembly, packaging,transportation, unpacking, and relocation of semiconductor manufacturing equipment 半导体制造设备的最终装配、包装、运输、拆包及安放导则 |
China National Standards semiconductor |
English PDF |
| GB/T 3859.3-2013 |
semiconductor converters - General requirements and line commutated converters - Part 1-3: Transformers and reactors 半导体变流器 通用要求和电网换相变流器 第1-3部分：变压器和电抗器 |
China National Standards semiconductor |
English PDF |
| GB/T 3859.2-2013 |
semiconductor converters - General requirements and line commutated converters - Part 1-2: Application guide 半导体变流器 通用要求和电网换相变流器 第1-2部分：应用导则 |
China National Standards semiconductor |
English PDF |
| GB/T 3859.1-2013 |
semiconductor converters - General requirements and line commutated Converters - Part 1-1: Specification of basic requirements 半导体变流器 通用要求和电网换相变流器 第1-1部分：基本要求规范 |
China National Standards semiconductor |
English PDF |
| GB/T 13422-2013 |
semiconductor converters - Electrical test methods 半导体变流器 电气试验方法 |
China National Standards semiconductor |
English PDF |
| GB/T 29332-2012 |
semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors(IGBT) 半导体器件 分立器件 第9部分：绝缘栅双极晶体管(IGBT) |
China National Standards semiconductor |
English PDF |
| GB/T 29299-2012 |
General specification of semiconductor laser rangefinder 半导体激光测距仪通用技术条件 |
China National Standards semiconductor |
English PDF |
| GB/T 13973-2012 |
General specification test methods for semiconductor device curve tracers 半导体管特性图示仪通用规范 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.4-2012 |
semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) 半导体器件 机械和气候试验方法 第4部分：强加速稳态湿热试验（HAST） |
China National Standards semiconductor |
English PDF |
| GB/T 4937.3-2012 |
semiconductor devices - Mechanical and climatic tests methods - Part 3: External visual examination 半导体器件 机械和气候试验方法 第3部分：外部目检 |
China National Standards semiconductor |
English PDF |
| GB/T 5201-2012 |
Test procedures for semiconductor charged particle detectors 带电粒子半导体探测器测量方法 |
China National Standards semiconductor |
English PDF |
| GB/T 12669-2012 |
General specification for cascade speed control assembly with semiconductor converter 半导体变流串级调速装置总技术条件 |
China National Standards semiconductor |
English PDF |
| GB/T 12667-2012 |
General specification for excitation assembly with semiconductors for synchronous motors 同步电动机半导体励磁装置总技术条件 |
China National Standards semiconductor |
English PDF |
| GB/T 26070-2010 |
Characterization of subsurface damage in polished compound semiconductor wafers by reflectance difference spectroscopy method 化合物半导体抛光晶片亚表面损伤的反射差分谱测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 6616-2009 |
Test methods for measuring resistivity of semiconductor wafers or sheet resistance of semiconductor films with a noncontact eddy-current gauge 半导体硅片电阻率及硅薄膜薄层电阻测试方法 非接触涡流法 |
China National Standards semiconductor |
English PDF |
| GB/T 1555-2009 |
Testing methods for determining the orientation of a semiconductor single crystal 半导体单晶晶向测定方法 |
China National Standards semiconductor |
English PDF |
| GB/T 14264-2009 |
semiconductor materials-terms and definitions 半导体材料术语 |
China National Standards semiconductor |
English PDF |
| GB/T 14140-2009 |
Test method for measuring diameter of semiconductor wafer 硅片直径测量方法 |
China National Standards semiconductor |
English PDF |
| GB/T 24468-2009 |
Specification for definition and measurement of semiconductor equipment reliability, availability, and maintainability(RAM) 半导体设备可靠性、可用性和维修性（RAM）的定义和测量规范 |
China National Standards semiconductor |
English PDF |
| GB/T 13539.4-2009 |
Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices 低压熔断器 第4部分：半导体设备保护用熔断体的补充要求 |
China National Standards semiconductor |
English PDF |
| GB/T 22193-2008 |
Electrical installations in ships - Equipment - semiconductor convertors 船舶电气设备 设备 半导体变流器 |
China National Standards semiconductor |
English PDF |
| GB/T 21548-2008 |
Methods of measurement of the high speed semiconductor lasers directly modulated for optical fiber communication systems 光通信用高速直接调制半导体激光器的测量方法 |
China National Standards semiconductor |
English PDF |
| GB 14048.6-2008 |
Low-voltage switchgear and controlgear - Part 4-2: Contactors and motor-starters AC semiconductor motor controllers and starters(including soft-starter) 低压开关设备和控制设备 第4-2部分：接触器和电动机起动器 交流半导体电动机控制器和起动器（含软起动器） |
China National Standards semiconductor |
English PDF |
| GB/T 21226-2007 |
semiconductor convertors - Identification code for convertor connections 半导体变流器 变流联结的标识代号 |
China National Standards semiconductor |
English PDF |
| GB/T 21039.1-2007 |
semiconductor devices - Discrete devices - Part 4-1: Microwave diodes and transistors - Microwave field effect transistors - Blank detail specification 半导体器件 分立器件 第4-1部分：微波二极管和晶体管 微波场效应晶体管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 20870.1-2007 |
semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers 半导体器件 第16-1部分：微波集成电路 放大器 |
China National Standards semiconductor |
English PDF |
| GB/T 20726-2006 |
Instrumental specification for energy dispersive X-ray spectrometers with semiconductor detectors 半导体探测器X射线能谱仪通则 |
China National Standards semiconductor |
English PDF |
| GB/T 17574.9-2006 |
semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories 半导体器件 集成电路 第2-9部分：数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 17574.20-2006 |
semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits 半导体器件 集成电路 第2-20部分：数字集成电路 低压集成电路族规范 |
China National Standards semiconductor |
English PDF |
| GB/T 17574.11-2006 |
semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory 半导体器件 集成电路 第2-11部分：数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 14048.12-2006 |
Low-voltage switchgear and controlgear - Part 4-3: Contactors and motor-starters-AC semiconductor controllers and contactors for non-motor loads 低压开关设备和控制设备 第4-3部分：接触器和电动机起动器-非电动机负载用交流半导体控制器和接触器 |
China National Standards semiconductor |
English PDF |
| GB/T 10236-2006 |
Guide for compatibility and protection of interference effects between semiconductor convertors and power supply system 半导体变流器与供电系统的兼容及干扰防护导则 |
China National Standards semiconductor |
English PDF |
| GB/T 4589.1-2006 |
semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits 半导体器件 第10部分：分立器件和集成电路总规范 |
China National Standards semiconductor |
English PDF |
| GB/T 20516-2006 |
semiconductor devices - Discrete devices - Part 4: Microwave devices 半导体器件 分立器件 第4部分：微波器件 |
China National Standards semiconductor |
English PDF |
| GB/T 20515-2006 |
semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits 半导体器件 集成电路 第5部分：半定制集成电路 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.2-2006 |
semiconductor devices―Mechanical and climatic test methods―Part 2: Low air pressure 半导体器件 机械和气候试验方法 第2部分:低气压 |
China National Standards semiconductor |
English PDF |
| GB/T 4937.1-2006 |
semiconductor devices―Mechanical and climatic test methods―Part 1: General 半导体器件 机械和气候试验方法 第1部分: 总则 |
China National Standards semiconductor |
English PDF |
| GB/T 20522-2006 |
semiconductor devices Part 14-3: Semiconductor sensors - Pressure sensors 半导体器件 第14-3部分: 半导体传感器-压力传感器 |
China National Standards semiconductor |
English PDF |
| GB/T 20521-2006 |
Semconductor devices Part 14-1: semiconductor sensors - General and classification 半导体器件 第14-1部分: 半导体传感器-总则和分类 |
China National Standards semiconductor |
English PDF |
| GB/T 12750-2006 |
semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits 半导体器件 集成电路 第11部分：半导体集成电路分规范(不包括混合电路) |
China National Standards semiconductor |
English PDF |
| GB/T 4326-2006 |
Extrinsic semiconductor single crystals measurement of Hall mobility and Hall coefficient 非本征半导体单晶霍尔迁移率和霍尔系数测量方法 |
China National Standards semiconductor |
English PDF |
| GB/T 13151-2005 |
semiconductor devices Discrete devices Part 6:Thyristors Section Three-Blank detail specification for reverse blocking triode thyristors,ambient and case-rated,for currents greater than 100A 半导体器件 分立器件 第6部分:晶闸管 第3篇 电流大于 100A、环境和管壳额定的反向阻断三极晶闸管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 13150-2005 |
semiconductor devices Discret devices Blank detail specification for bidirectional triode thyristors(triacs),ambient and case-rated,for currents greater than 100A 半导体器件 分立器件 电流大于 100A、环境和管壳额定的双向三极晶闸管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 4728.5-2005 |
Graphical symbols for diagrams Part 5 semiconductors and electron tubes 电气简图用图形符号 第5部分:半导体管和电子管 |
China National Standards semiconductor |
English PDF |
| GB/T 3859.4-2004 |
semiconductor converter--Self-commutated semiconductor converters including direct d.c.converters 半导体变流器 包括直接直流变流器的半导体自换相变流器 |
China National Standards semiconductor |
English PDF |
| GB/T 2900.66-2004 |
Electrotechnical terminology--semiconductor devices and integrated circuits 电工术语 半导体器件和集成电路 |
China National Standards semiconductor |
English PDF |
| GB/T 8446.3-2004 |
Heat sink for power semiconductor device--Part 3:Insulators and fasteners 电力半导体器件用散热器 第3部分:绝缘件和紧固件 |
China National Standards semiconductor |
English PDF |
| GB/T 8446.2-2004 |
Heat sink for power semiconductor device--Part 2:Measuring method of thermal resistance and inputfluid-output fluid pressure difference 电力半导体器件用散热器 第2部分:热阻和流阻测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 8446.1-2004 |
Heat sink for power semiconductor device--Part 1:Casting kind series 电力半导体器件用散热器 第1部分:铸造类系列 |
China National Standards semiconductor |
English PDF |
| GB/T 19403.1-2003 |
semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits) 半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 (不包括混合电路) |
China National Standards semiconductor |
English PDF |
| GB/T 17574.10-2003 |
semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories 半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 15651.3-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods 半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法 |
China National Standards semiconductor |
English PDF |
| GB/T 15651.2-2003 |
Discrete semiconductor devices and integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics 半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性 |
China National Standards semiconductor |
English PDF |
| GB/T 11685-2003 |
Measurement procedures for semiconductor X-ray detector system and semiconductor X-ray energyspectrometers 半导体X射线探测器系统和半导体X射线能谱仪的测量方法 |
China National Standards semiconductor |
English PDF |
| GB/T 18904.5-2003 |
semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail，for fibre optic systems or subsystems 半导体器件 第12-5部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的pin光电二极管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 6589-2002 |
semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes) 半导体器件 分立器件 第3-2部分:信号(包括开关)和调整二极管 电压调整二极管和电压基准二极管(不包括温度补偿精密基准二极管) 空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 18904.4-2002 |
semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems 半导体器件 第12-4部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的Pin-FET模块空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 18904.3-2002 |
semiconductor devices--Part 12-3:Optoelectronic devices--Blank detail specification for light-emitting diodes--Display application 半导体器件 第12-3部分:光电子器件 显示用发光二极管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 18904.2-2002 |
semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems 半导体器件 第12-2部分:光电子器件 纤维光学系统或子系统用带尾纤的激光二极管模块空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 18904.1-2002 |
semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems 半导体器件 第12-1部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的光发射或红外发射二极管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 18500.2-2001 |
semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) 半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 18500.1-2001 |
semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) 半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 11499-2001 |
Letter symbols for discrete semiconductor devices 半导体分立器件文字符号 |
China National Standards semiconductor |
English PDF |
| GB/T 6588-2000 |
semiconductor devices--Discrete devices--Part 3:Signal(including switching) and regulator diodes--Section One--Blank detail specification for signal diodes，switching diodes and controlled-avalanche diodes 半导体器件 分立器件 第3部分:信号(包括开关)和调整二极管 第1篇 信号二极管、开关二极管和可控雪崩二极管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 17950-2000 |
semiconductor converter--Part 6:Application guide for the protection of semiconductor converters against overcurrent by fuses 半导体变流器 第6部分:使用熔断器保护半导体变流器防止过电流的应用导则 |
China National Standards semiconductor |
English PDF |
| GB/T 5965-2000 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays) 半导体器件 集成电路 第2部分:数字集成电路 第一篇 双极型单片数字集成电路门电路(不包括自由逻辑阵列) 空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 17940-2000 |
semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits 半导体器件 集成电路 第3部分:模拟集成电路 |
China National Standards semiconductor |
English PDF |
| GB/T 12560-1999 |
semiconductor devices--Sectional specification for discrete devices 半导体器件 分立器件分规范 |
China National Standards semiconductor |
English PDF |
| GB/T 9424-1998 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Five:Blank detail specification for complementary MOS digital inte-grated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第五篇 CMOS数字集成电路4000B和4000UB系列空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 7576-1998 |
semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section Four:Blank detail specification for case-rated bipolartransistors for high-frequency amplification 半导体器件 分立器件 第7部分:双极型晶体管 第四篇 高频放大管壳额定双极型晶体管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 6590-1998 |
semiconductor devices--Discrete devices--Part6:Thyristors--Section Two:Blank detail specification for bidirectional triode thyristors(triacs)，ambient or case-rated，up to 100A 半导体器件 分立器件 第6部分:闸流晶体管 第二篇 100A以下环境或管壳额定的双向三极闸流晶体管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 6352-1998 |
semiconductor devices--Discrete devices--Part 6:Thyristors--Section One:Blank detail specification for reverse blocking triode thyristors，ambient or case-rated，up to 100A 半导体器件 分立器件 第6部分:闸流晶体管 第一篇 100A以下环境或管壳额定反向阻断三极闸流晶体管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 6351-1998 |
semiconductor devices--Discrete devices--Part 2:Rectifier diodes--Section One:Blank detail specification for rectifier diodes(including avalanche recti fier diodes)，ambient and case-rated，up to 100A 半导体器件 分立器件 第2部分:整流二极管 第一篇 100A以下环境或管壳额定整流二极管(包括雪崩整流二极管)空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 6219-1998 |
semiconductor devices--Discrete devices--Part 8:Field-effect transistors--Section One:Blank detail specification for single-gate field-effect transistors up to 5W and 1GHz 半导体器件 分立器件 第8部分:场效应晶体管 第一篇 1 GHz、5 W以下的单栅场效应晶体管 空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 6217-1998 |
semiconductor devices--Discrete devices--Part 7:Bipolar transistors--Section One:Blank detail speci-fication for ambient-rated bipolar transistors for low and high frequency amplification 半导体器件 分立器件 第7部分:双极型晶体管 第一篇 高低频放大环境额定的双极型晶体管空白详细规范 |
China National Standards semiconductor |
English PDF |
| GB/T 17574-1998 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits 半导体器件 集成电路 第2部分:数字集成电路 |
China National Standards semiconductor |
English PDF |
| GB/T 17573-1998 |
semiconductor devices--Discrete devices and integrated circuits--Part 1:General 半导体器件 分立器件和集成电路 第1部分:总则 |
China National Standards semiconductor |
English PDF |
| GB/T 17572-1998 |
semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section Four:Family specification for complementary MOS digital integrated circuits，series 4000B and 4000UB 半导体器件 集成电路 第2部分:数字集成电路 第四篇 CMOS数字集成电路 4000B和4000UB系列族规范 |
China National Standards semiconductor |
English PDF |
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