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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 15651.7-2024 |
Printed board assembly - Part 6: Evaluation requirements for voids in ball grid array (BGA) and land grid array (LGA) solder joints and test methods {译} 半导体器件-第5-7部分：光电子器件-光电二极管和光电晶体管 |
China National Standards voids |
 English PDF |
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