China 'GB/T 41852-2022
' standard english version:
NATIONAL STANDARD OF THE PEOPLE'S REPUBLIC OF CHINA
GB/T 41852-2022
Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures 半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
Issued Date:2022/10/12
Implemented Date:2022/10/12
Issued by:
The Standardization Administration of the People's Republic of China