China 'GB/T 15651.7-2024
' standard english version:
NATIONAL STANDARD OF THE PEOPLE'S REPUBLIC OF CHINA
GB/T 15651.7-2024
Printed board assembly - Part 6: Evaluation requirements for voids in ball grid array (BGA) and land grid array (LGA) solder joints and test methods 半导体器件-第5-7部分：光电子器件-光电二极管和光电晶体管
Issued Date:2024.3.15
Implemented Date:2024.7.1
Issued by:
The Standardization Administration of the People's Republic of China
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