China 'GB/T 15879.604-2023
' standard english version:
NATIONAL STANDARD OF THE PEOPLE'S REPUBLIC OF CHINA
GB/T 15879.604-2023
Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages 半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法
Issued Date:2023/5/23
Implemented Date:2023/9/1
Issued by:
The Standardization Administration of the People's Republic of China
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