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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| SJ/T 11027-1996 |
Analytical methods for silver copper brazing for electron device Determination of magnesium by atomic absorption spectrophotometry 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定镁 |
China Electronics
Standards Analytical methods silver |
 English PDF |
| SJ/T 11026-1996 |
Analytical methods for silver copper brazing for electron device Determination of iron, cadmium and zinc by atomic absorption spectrophotometry 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铁、镉、锌 |
China Electronics
Standards Analytical methods silver |
English PDF |
| SJ/T 11023-1996 |
Analytical methods for silver copper brazing for electron device Determination of bismuth by atomic absorption spectrophotometry 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铋 |
China Electronics
Standards Analytical methods silver |
English PDF |
| SJ/T 11022-1996 |
Analytical methods for silver copper brazing for electron device Determination of tin by C21H38BrN-absorption spectrophotometry 电子器件用银铜钎焊料的分析方法 邻基二酚紫－溴化十六烷基吡啶分光光度法测定锡 |
China Electronics
Standards Analytical methods silver |
English PDF |
| SJ/T 11021-1996 |
Analytical methods for silver copper brazing for electron device Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb by spectrochemical analysis 电子器件用银铜钎焊料的分析方法 铅、铋、锌、镉、铁、镁、铝、锡和锑的化学光谱测定 |
China Electronics
Standards Analytical methods silver |
English PDF |
| SJ/T 11020-1996 |
Analytical methods for silver copper brazing for electron device Determination of copper by iodimetry 电子器件用银铜钎焊料的分析方法 碘量法测定铜 |
China Electronics
Standards Analytical methods silver |
English PDF |
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