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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| HB 5299.3-2014(2017) |
Qualification and certification of welding operators in the aerospace industry Part 3: brazing {译} 航空工业焊接操作人员资格鉴定与认证 第3部分：钎焊 |
China Aviation Industry
Standards brazing |
 English PDF |
| YY/T 0912—2015 |
Dentistry brazing materials {译} 牙科学 钎焊材料 |
China Pharmaceutics Industry
Standards brazing |
English PDF |
| HG/T 20223-2017 |
(Technical specification for welding and brazing of copper and copper alloys) 铜及铜合金焊接及钎焊技术规程 |
China Chemical Industry
Standards brazing |
English PDF |
| SJ/T 11030-2015 |
(Electronic devices with gilt bronze and gold-nickel brazing filler metal impurities of lead, zinc, phosphorus ICP-AES determination) 电子器件用金铜及金镍钎料中杂质铅、锌、磷的icp-aes测定方法 |
China Electronics
Standards brazing |
English PDF |
| SJ/T 11011-2015 |
(Electronics ICP-AES test method silver brazing filler metal impurity content of lead, bismuth, zinc, cadmium, iron, magnesium, aluminum, tin, antimony, phosphorus) 电子器件用纯银钎料中杂质含量 铅、铋、锌、镉、铁、镁、铝、锡、锑、磷的icp-aes测试方法 |
China Electronics
Standards brazing |
English PDF |
| SJ/T 10754-2015 |
(Electronics with gold, silver and alloy brazing methods cleanliness, sputtering Determination) 电子器件用金、银及其合金钎料分析方法 清洁性、溅散性的测定 |
China Electronics
Standards brazing |
English PDF |
| YY/T 0912-2015 |
(Dentistry brazing material) 牙科学 钎焊材料 |
China Medicine & Medical Device
Standards brazing |
English PDF |
| SJ/T 11027-1996 |
Analytical methods for silver copper brazing for electron device Determination of magnesium by atomic absorption spectrophotometry 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定镁 |
China Electronics
Standards brazing |
English PDF |
| SJ/T 11026-1996 |
Analytical methods for silver copper brazing for electron device Determination of iron, cadmium and zinc by atomic absorption spectrophotometry 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铁、镉、锌 |
China Electronics
Standards brazing |
English PDF |
| SJ/T 11023-1996 |
Analytical methods for silver copper brazing for electron device Determination of bismuth by atomic absorption spectrophotometry 电子器件用银铜钎焊料的分析方法 原子吸收分光光度法测定铋 |
China Electronics
Standards brazing |
English PDF |
| SJ/T 11022-1996 |
Analytical methods for silver copper brazing for electron device Determination of tin by C21H38BrN-absorption spectrophotometry 电子器件用银铜钎焊料的分析方法 邻基二酚紫－溴化十六烷基吡啶分光光度法测定锡 |
China Electronics
Standards brazing |
English PDF |
| SJ/T 11021-1996 |
Analytical methods for silver copper brazing for electron device Determination of Pb, Bi, Zn, Cd, Fe, Mg, Al, Sn and Sb by spectrochemical analysis 电子器件用银铜钎焊料的分析方法 铅、铋、锌、镉、铁、镁、铝、锡和锑的化学光谱测定 |
China Electronics
Standards brazing |
English PDF |
| SJ/T 11020-1996 |
Analytical methods for silver copper brazing for electron device Determination of copper by iodimetry 电子器件用银铜钎焊料的分析方法 碘量法测定铜 |
China Electronics
Standards brazing |
English PDF |
| SJ/T 10667-1995 |
symbol and notation for brazing, soldering and sealing 钎焊、封接的代号及标注方法 |
China Electronics
Standards brazing |
English PDF |
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