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Keyword:
| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| YD/T 3944-2021 |
AI Chip Benchmark Evaluation Method {译} 人工智能芯片基准测试评估方法 |
China Telecommunication Industry
Standards AI Chip |
 English PDF |
| SJ/T 11482-2014 |
Varistors for use in electronic equipment-Detail specification for chip varistors of type MYP-Assessment level E 电子设备用压敏电阻器 myp型片式压敏电阻器详细规范 评定水平e |
China Electronics
Standards AI Chip |
English PDF |
| SJ/T 11278.4.1-2014 |
Varistors for use in electronic equipment-Part 4:Blank detail specification for chip varistors-Assessment level E 电子设备用压敏电阻器 第4部分：空白详细规范 片式压敏电阻器 评定水平e |
China Electronics
Standards AI Chip |
English PDF |
| SJ 52283/3-2008 |
Capacitors, solid electrolytic, tantalum, chip, established reliability, type CAK45A detail specification for cak45a型有可靠性指标的片式固体电解质钽电容器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 52283/2-2008 |
Capacitors, solid electrolytic, tantalum, chip, established reliability, type CAK45L detail specification for cak45l型有可靠性指标的片式固体电解质钽电容器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 20928-2005 |
Detail specification for seramic leadless chip carrier 陶瓷无引线片式载体详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 51864/2-2004 |
Detail specification for type LGC2B2520, LGC2B2012, LGC2B1608 RF wire wound chip inductors lgc2b2520、lgc2b2012、lgc2b1608射频绕线片式电感器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 51432/8-2004 |
Resistors, fixed, film, chip established reliability, style RMK3225, detail specification for rmk3225型有可靠性指标的片式膜固定电阻器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 51432/7-2002 |
Resistors, fixed, film, chip established reliability, style RMK1005, detail specification for rmk1005型有可靠性指标的片式膜固定电阻器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 50192/2-2002 |
Capacitors, chip, multiplayer, ceramic dielectric, unencapsulated, estabilished reliability, detail specification for CCK4102 type cck4102型有可靠性指标的无包封多层片式瓷介电容器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 50192/1-2002 |
Capacitors, chip, multilayer, ceramic dielectric, unencapsulated, estabilished reliability, detail specification for CCK4101 type cck4101型有可靠性指标的无包封多层片式瓷介电容器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 51432/6-2001 |
Resistors, fixed, film, chip established reliability, style RMK5025, detail specification for rmk5025型有可靠性指标的片式膜固定电阻器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 51432/5-2000 |
Resistors, fixed, film, chip established reliability, style RMK1206, detail specification for rmk1206型有可靠性指标的片式膜固定电阻器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 51432/4-2000 |
Resistors, fixed, film, chip established reliability, style RMK2021, detail specification for rmk2012型有可靠性指标的片式膜固定电阻器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 51432/3-2000 |
Resistors, fixed, film, chip established reliability, style RMK1608 detail specification for rmk1608型有可靠性指标的片式膜固定电阻器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 51432/2-2000 |
Resistors, fixed, film, chip established reliability, style RMK6332 detail specification for rmk6332型有可靠性指标的片式膜固定电阻器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 51432/1-1999 |
Resistors, fixed, film, chip established reliability, style RMK3216 detail specification for rmk3216型有可靠性指标的片式膜固定电阻器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 52453/2-1998 |
Type XGS 208/160 BY17×3 chip of smco rare - earth permanent magnets, detail specification for xgs208/160by17×3型片形钐钴稀土永磁体详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 51864/1-1998 |
Detail specification for type LGC2B4532, LGC2B3225 chip inductors lgc2b4532、lgc2b3225型片式电感器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 52283/1-1996 |
Capacitors, fixed, solid electrolytic (tantalum), chip, established reliability, style CAK45, detail specification for ｃａｋ４５型有可靠性指标的片式固体电解质钽电容器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 20318-1993 |
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CCK4103 ｃｃｋ４１０３型有可靠性指标的非密封多层片状瓷介固定电容器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 20314-1993 |
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4104 ｃｔｋ４１０４型有可靠性指标的非密封多层片状瓷介固定电容器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 20313-1993 |
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4103 ｃｔｋ４１０３型有可靠性指标的非密封多层片状瓷介固定电容器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 20312-1993 |
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4102 ｃｔｋ４１０２型有可靠性指标的非密封多层片状瓷介固定电容器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
| SJ 20203-1992 |
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability, type CTK4101 ｃｔｋ４１０１型有可靠性指标的非密封多层片状瓷介固定电容器详细规范 |
China Electronics
Standards AI Chip |
English PDF |
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