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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| SJ/T 11789-2021 |
Method for evaluating reliability of lead-free solder joints {译} 无铅焊点可靠性评价方法 |
China Electronics Industry
Standards Lead free |
 English PDF |
| SJ/T 11392-2019 |
Lead-Free Solder Chemical Composition and Form {译} 无铅焊料 化学成分与形态 |
China Electronics Industry
Standards Lead free |
English PDF |
| SJ/T 11390-2019 |
Lead-Free Solder Test Methods {译} 无铅焊料试验方法 |
China Electronics Industry
Standards Lead free |
English PDF |
| SJ/T 11389-2019 |
Flux for lead-free soldering {译} 无铅焊接用助焊剂 |
China Electronics Industry
Standards Lead free |
English PDF |
| JC/T 2145-2012 |
Lead-free color glaze for glass 无铅玻璃色釉 |
China Building Materials
Standards Lead free |
English PDF |
| SJ/T 11392-2009 |
Lead-free solders. Chemical compositions and forms 无铅焊料 化学成分与形态 |
China Electronics
Standards Lead free |
English PDF |
| SJ/T 11390-2009 |
Test method for lead-free solders 无铅焊料试验方法 |
China Electronics
Standards Lead free |
English PDF |
| SJ/T 11389-2009 |
Fluxes for lead-free soldering application 无铅焊接用助焊剂 |
China Electronics
Standards Lead free |
English PDF |
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