Cart:
Keyword:
| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| HB_Z 401-2013(2017) |
Environmental Design Guidelines for encapsulation and Interfaces of Integrated Modular Avionics Systems for Civil Aircraft {译} 民用飞机综合模块化航空电子系统封装与接口的环境设计指南 |
China Aviation Industry
Standards encapsulation |
 English PDF |
| YD/T 4269-2023 |
IP network in-band operation, administration and maintenance (IOAM) data content and encapsulation method {译} IP网络带内操作、管理和维护（IOAM）数据内容和封装方法 |
China Telecommunication Industry
Standards encapsulation |
English PDF |
| CY/T 102.2-2020 |
Specification for Object Storage, Reuse and Exchange of Digital Content for Press and Publication Part 2: Object encapsulation, Storage and Exchange {译} 新闻出版数字内容对象存储、复用与交换规范 第2部分：对象封装、存储与交换 |
China Publication Industry
Standards encapsulation |
English PDF |
| YD/T 2314-2011 |
Technique requirement of encapsulation methods for transport of ethernet over MPLS networks 对在多协议标记交换(mpls)网络上传送的以太网帧的封装方法的技术要求 |
China Telecommunication
Standards encapsulation |
English PDF |
| SJ/T 11126-1997 |
encapsulation materials of phenolic series for use in electronic components 电子器件用酚醛系包封材料 |
China Electronics
Standards encapsulation |
English PDF |
| SJ/T 11125-1997 |
encapsulation materials of epoxy series for use in electronic components 电子器件用环氧系灌封材料 |
China Electronics
Standards encapsulation |
English PDF |
| SJ/T 11124-1997 |
encapsulation materials of epoxy series powder for use in electronic components 电子元器件用环氧系粉末包封材料 |
China Electronics
Standards encapsulation |
English PDF |
| SJ 20451-1994 |
Electrical insulating epoxy compound colloidal silica filled for potting and encapsulation 灌封和包装用以胶体二氧化硅填充的环氧类电绝缘化合物 |
China Electronics
Standards encapsulation |
English PDF |
| QB/T 1452-1992 |
(Brush phosphorus matches, encapsulation, set box machine) 火柴刷磷、包封、套箱机 |
China Light Industry
Standards encapsulation |
English PDF |
| Find out:9Items | To Page of: First -Previous-Next -Last | 1 |
+86-755-25831330
