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Keyword:
| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| SJ/T 11789-2021 |
Method for evaluating reliability of lead-free solder joints {译} 无铅焊点可靠性评价方法 |
China Electronics Industry
Standards solder |
 English PDF |
| JB/T 14409-2022 |
Test method for melting temperature range of solder {译} 钎料熔化温度范围试验方法 |
China Machinery Industry
Standards solder |
English PDF |
| SJ/T 11186-2019 |
General Specification for solder Paste {译} 焊锡膏通用规范 |
China Electronics Industry
Standards solder |
English PDF |
| SJ/T 11392-2019 |
Lead-Free solder Chemical Composition and Form {译} 无铅焊料 化学成分与形态 |
China Electronics Industry
Standards solder |
English PDF |
| SJ/T 11391-2019 |
Tin alloy powder for soldering electronic products {译} 电子产品焊接用锡合金粉 |
China Electronics Industry
Standards solder |
English PDF |
| SJ/T 11390-2019 |
Lead-Free solder Test Methods {译} 无铅焊料试验方法 |
China Electronics Industry
Standards solder |
English PDF |
| SJ/T 11389-2019 |
Flux for lead-free soldering {译} 无铅焊接用助焊剂 |
China Electronics Industry
Standards solder |
English PDF |
| SJ/T 11584-2016 |
(solder balls Specification) 锡球规范 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11018-2016 |
(Electronics determination of sulfur by analysis of silver solder combustion iodometric method) 电子器件用纯银钎料的分析方法 燃烧碘量法测定硫 |
China Electronics
Standards solder |
English PDF |
| SJ/T 10309-2016 |
(PCB with solder resist) 印制板用阻焊剂 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11200-2016 |
(Environmental testing Part 2-58: Tests - Test Td: surface mount components solderability, dissolution of metallization layers and resistance to soldering heat resistance test method) 环境试验 2-58部分：试验 试验td：表面组装元器件可焊性、金属化层耐溶蚀性和耐焊接热的试验方法 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11550-2015 |
(Crystalline silicon photovoltaic module with dip solder ribbon) 晶体硅光伏组件用浸锡焊带 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11029-2015 |
(Electronics determination of nickel with gold Nickel solder analysis EDTA volumetric method) 电子器件用金镍钎料的分析方法 edta容量法测定镍 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11028-2015 |
(Determination of copper with gold and copper electronics solder analysis EDTA volumetric method) 电子器件用金铜钎料的分析方法 edta容量法测定铜 |
China Electronics
Standards solder |
English PDF |
| SJ/T 10753-2015 |
(Electronics with gold, silver and alloy solder) 电子器件用金、银及其合金焊料 |
China Electronics
Standards solder |
English PDF |
| SJ/T 10414-2015 |
(The semiconductor device with solder) 半导体器件用焊料 |
China Electronics
Standards solder |
English PDF |
| QB/T 4541-2013 |
solder-free screw caps. Technical specification 免焊螺口式灯头 技术要求 |
China Light Industry
Standards solder |
English PDF |
| SJ/T 11392-2009 |
Lead-free solders. Chemical compositions and forms 无铅焊料 化学成分与形态 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11391-2009 |
solder powder for electronic soldering applications 电子产品焊接用锡合金粉 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11390-2009 |
Test method for lead-free solders 无铅焊料试验方法 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11389-2009 |
Fluxes for lead-free soldering application 无铅焊接用助焊剂 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11186-2009 |
General specification for solder paste 焊锡膏能用规范 |
China Electronics
Standards solder |
English PDF |
| SJ 50599/7-2006 |
Detail specification for sheet connectors, electrical, circular, threaded, receptacle, weld mounting, hermetic, hermetic solder contacts, series Ⅲ J599/27(classes N and Y) 系列ⅲ j599/27螺纹连接锡焊式接触件锡焊安装气密封固定电连接器（n和y类）详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ 50599/6-2006 |
Detail specification for sheet connectfors e1ectrical, circular, threaded, receptacle, solder mounting, hermetic, hermetic solder contacts series Ⅲ, J599/25(classes N and Y) 系列ⅲ j599/25螺纹连接锡焊式接触件锡焊安装气密封固定电连接器（n和y类）详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ 50599/5-2006 |
Detail specification fir sheet connectors, Iectrical, circular, threaded, receptacle, JAM-NUT mounting, herrnetic, hermetic solder contacts series Ⅲ, J599/23(classes N and Y) 系列ⅲ j599/23螺纹连接锡焊式接触件螺母安装气密封固定电连接器（n和y类）详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ 50599/4-2006 |
Detail specificarion for sheet connectors, electrical, circular, threaded, receptacle, box mounting flange, hermetic, hermetic solder contacts, series Ⅲ, J599/21(classes N and Y) 系列ⅲ j599/21螺纹连接锡焊式接触件盒式法兰安装气密封圆形固定电连接器（n和y类）详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11319-2005 |
Quantity test method of the oxidation sludge in the tin solder 锡焊料动态条件氧化渣量定量试验方法 |
China Electronics
Standards solder |
English PDF |
| SJ 50599/1-2003 |
Detail specification for fixed connector electric, jam nut mounting, solder type, hermetic seal, bayonet coupling, series Ⅱ, classes Y for JY27477 系列ⅱ jy27477卡口连接锡焊式接触件气密封压紧螺母安装固定电连接器（y类）详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ 50598/2-2003 |
Detail specification for free connectors, electric, solder type, straight, bayonet coupling, series 1, classes E, F, J and P, for JY3116 系列1 jy3116卡口连接锡焊式接触件直式自由电连接器（e、f、j和p类）详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ 50598/1-2003 |
Detail specification for fixed connectors, electric, solder type, cable connecting, bayonet coupling, series 1, classes E, F, J and P, for JY3111 系列1 jy3111卡口连接锡焊式接触件接电缆的固定电连接器（e、f、j和p类）详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ 20882-2003 |
Requirement for soldering technology of PCB assembles 印制电路组件装焊工艺要求 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11216-1999 |
Technology requirement for infrared for air reflow soldering 红外／热风再流焊接技术要求 |
China Electronics
Standards solder |
English PDF |
| SJ/T 11168-1998 |
solder wire for soldering cleanout-free 免清洗焊接用焊锡丝 |
China Electronics
Standards solder |
English PDF |
| SJ/T 10669-1995 |
solderability tests for surface mounted devices 表面组装器件可焊性试验 |
China Electronics
Standards solder |
English PDF |
| SJ/T 10667-1995 |
symbol and notation for brazing, soldering and sealing 钎焊、封接的代号及标注方法 |
China Electronics
Standards solder |
English PDF |
| SJ 50681/75-1994 |
Connectors, receptacle, coaxial, radio frequency(series N(solder pocket), socket contact, jamnut mounted, calss 2), for semirigid cable, detail specification for ｎ系列（接半硬电缆）插孔接触件锁紧螺母安装２级射频同轴插座连接器详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ 50681/71-1994 |
Connectors, receptacle, coaxial, radio frequency(series BNC(solder pocket), socket contact, jamnut mounted, isolated, calss 2), detail specification for ｂｎｃ系列（带焊槽）插孔接触件锁紧螺母安装２级射频同轴插座连接器详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ/T 10534-1994 |
Requirements for wave soldering 波峰焊接技术要求 |
China Electronics
Standards solder |
English PDF |
| SJ/T 31250-1994 |
Requirements of readiness and methods of inspection and assessment for automatic potentiometer soldering lug riveting machines 电位器焊片铆接自动机完好要求和检查评定方法 |
China Electronics
Standards solder |
English PDF |
| SJ 20109-1992 |
Detail Specification for Fixed Connectors Electrical, straight, solder contacts, classes A, K, R and F, for JY 3106 ｊｙ３１０６锡焊式接触件直式自由端电连接器（ａ、ｋ、ｒ及ｆ类）详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ 20108-1992 |
Detail Specification for Fixed Connectors Electrical, Box Mounting, solder Contacts, Classes K and R, for JY 3102 ｊｙ３１０２盒式安装锡焊式接触件固定电连接器（ｋ、ｒ类）详细规范 |
China Electronics
Standards solder |
English PDF |
| SJ/T 10146-1991 |
Specification for solderability test instrument by solder bath method 焊槽法可焊性测试仪技术条件 |
China Electronics
Standards solder |
English PDF |
| SJ/T 10145-1991 |
Specification for solderability test instrument by wetting balance method 润湿秤量法可焊性测试仪技术条件 |
China Electronics
Standards solder |
English PDF |
| SJ/T 10144-1991 |
Specification for solderability test instrument by globule method 焊球法可焊性测试仪技术条件 |
China Electronics
Standards solder |
English PDF |
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