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| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| HG/T 5962-2021 |
Silicon wafer cutting waste liquid treatment and disposal method {译} 硅片切割废液处理处置方法 |
China Chemistry Industry
Standards wafer |
 English PDF |
| SJ/T 10876-2020 |
Detail specification for electronic components - Type CT52 wafer feedthrough ceramic capacitors - Evaluation level EZ {译} 电子元器件详细规范 CT52型圆片穿心瓷介电容器 评定水平EZ |
China Electronics Industry
Standards wafer |
English PDF |
| SJ/T 10875-2020 |
Detail specification for electronic components - Type CC52 wafer feedthrough ceramic dielectric capacitors - Evaluation level EZ {译} 电子元器件详细规范 CC52型圆片穿心瓷介电容器 评定水平EZ |
China Electronics Industry
Standards wafer |
English PDF |
| SJ/T 11761-2020 |
Specification for Load Ports of Semiconductor Equipment for wafers 200mm and Smaller {译} 200mm及以下晶圆用半导体设备装载端口规范 |
China Electronics Industry
Standards wafer |
English PDF |
| SJ/T 11630-2016 |
(Solar-wafer geometry test method) 太阳能电池用硅片几何尺寸测试方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11629-2016 |
(Solar wafers and cells online photoluminescence analysis) 太阳能电池用硅片和电池片的在线光致发光分析方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11627-2016 |
(Solar wafers rate online Test methods Resistance) 太阳能电池用硅片电阻率在线测试方法 |
China Electronics
Standards wafer |
English PDF |
| SN/T 4383-2015 |
(Food contact material wafers polyvinyl alcohol (PVA) Determination of UV - visible spectrophotometry) 食品接触材料 糯米纸 聚乙烯醇（pva）含量的测定 紫外-可见分光光度法 |
China Import Export Inspection
Standards wafer |
English PDF |
| SJ/T 11505-2015 |
Sapphire single crystal polished wafers specification 蓝宝石单晶抛光片规范 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11503-2015 |
Test methods for measuring surface roughness of polished monocrystalline silicon carbide wafers 碳化硅单晶抛光片表面粗糙度的测试方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11502-2015 |
Specification for polished monocrystalline silicon carbide wafers 碳化硅单晶抛光片规范 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11497-2015 |
Test method for thermal stability testing of gallium arsenide wafers 砷化镓晶片热稳定性的试验方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11492-2015 |
Test methods for measurement of composition of gallium arsenide phosphide wafers by photoluminescence 光致发光法测定磷镓砷晶片的组分 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11490-2015 |
Test method for measuring etch pit density (EPD) in low dislocation density gallium arsenide wafers 低位错密度砷化镓抛光片蚀坑密度的测量方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11489-2015 |
Test method for measuring etch pit density (EPD) in low dislocation density indium phosphide wafers 低位错密度磷化铟抛光片蚀坑密度的测量方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11487-2015 |
Non-contact measurement method for the resistivity of semi-insulating semiconductor wafer 半绝缘半导体晶片电阻率的无接触测量方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11471-2014 |
(Light-emitting diode epitaxial wafer test method) 发光二极管外延片测试方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 11470-2014 |
(Light-emitting diode epitaxial wafers) 发光二极管外延片 |
China Electronics
Standards wafer |
English PDF |
| SJ 20714-1998 |
Test method for sub-surface damage of gallium arsenide polished wafer by X-ray double crystal diffraction 砷化镓抛光片亚损伤层的x射线双晶衍射试验方法 |
China Electronics
Standards wafer |
English PDF |
| SJ 20658-1998 |
Specification for radiation hardened monocrystal silicon wafers for military CMOS integrated circuits 军用电站方舱通用规范 |
China Electronics
Standards wafer |
English PDF |
| SJ 20636-1997 |
Test method for oxygen and carbon contents of large diameter thin silicon wafer in microzone for use in IC ic用大直径薄硅片的氧、碳含量微区试验方法 |
China Electronics
Standards wafer |
English PDF |
| SJ 20514-1995 |
Specification for silicon epitaxial wafer for microwave power transistor 微波功率晶体管用硅外延片规范 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 31271-1994 |
Requirements of readiness and methods of inspection and assessment for ISM-14 wafer cutting machines ism－14型割片机完好要求和检查评定方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 31096-1994 |
Readiness requirements and methods of inspection and assessment for high-precision silicon wafer grinding machines 精密硅片磨床完好要求和检查评定方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 31092-1994 |
Requirements of readiness and methods of inspection and assessment for NC wafer cutting (scribing) machines 晶片数控切割（划片）机完好要求和检查评定方法 |
China Electronics
Standards wafer |
English PDF |
| SJ/T 31091-1994 |
Requirements of readiness and methods of inspection and assessment for wafer slicers 晶片内圆切片机完好要求和检查评定方法 |
China Electronics
Standards wafer |
English PDF |
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