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GB standards are the China national standards; Prefix code GB are Mandatory standards, GB/T are Recommended standards; All products or service must be compliance with GB standards; If you want to export products or services to huge Chinese market, need ensure they are meet the requirements of GB china national standards; We provide Chinese GB standards and English version GB standards Lookup, Translate, Download, Imported Commodity GB standards Testing and Compliance review services. |
| Standard Code | Standard Title | Standard Class | Order |
|---|---|---|---|
| GB/T 43931-2024 |
General specifications for microwave Integrated Circuit chips for aerospace use 宇航用微波集成电路芯片通用规范 |
China National Standards Integrated Circuit |
 English PDF |
| GB/T 43863-2024 |
Large-scale Integrated Circuits (LSI)-Package-Printed Circuit Board Common Design Structure 大规模集成电路（LSI）-封装-印制电路板共通设计结构 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43972-2024 |
Remote operation and maintenance of Integrated Circuit packaging equipment - state monitoring 集成电路封装设备远程运维-状态监测 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43748-2024 |
Microbeam analysis-Transmission electron microscopy-Method for determination of thickness of functional thin film layers in Integrated Circuit chips 微束分析-透射电子显微术-集成电路芯片中功能薄膜层厚度的测定方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43796-2024 |
Remote operation and maintenance of Integrated Circuit packaging equipment-Data collection 集成电路封装设备远程运维-数据采集 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43538-2023 |
Quality technical requirements for Integrated Circuit metal packaging casing 集成电路金属封装外壳质量技术要求 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43536.2-2023 |
Three-dimensional Integrated Circuits Part 2: Calibration requirements for fine-pitch stacked chips 三维集成电路 第2部分：微间距叠层芯片的校准要求 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43536.1-2023 |
Three-dimensional Integrated Circuits Part 1: Terms and definitions 三维集成电路 第1部分：术语和定义 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43454-2023 |
Integrated Circuit intellectual property (IP) core design requirements 集成电路知识产权（IP）核设计要求 |
China National Standards Integrated Circuit |
English PDF |
| GB/Z 43510-2023 |
Guide to Reliability Test Methods for Integrated Circuit TSV Three-Dimensional Packages 集成电路TSV三维封装可靠性试验方法指南 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43228-2023 |
Design requirements for radiation-hardened Integrated Circuit unit libraries for aerospace use 宇航用抗辐射加固集成电路单元库设计要求 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43227-2023 |
Test method for vapor-deposited protective films for inner leads of Integrated Circuits for aerospace use 宇航用集成电路内引线气相沉积保护膜试验方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43226-2023 |
Single-event soft error time domain testing method for semiconductor Integrated Circuits used in aerospace applications 宇航用半导体集成电路单粒子软错误时域测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43063-2023 |
Integrated Circuit CMOS image sensor test method 集成电路 CMOS图像传感器测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43061-2023 |
Semiconductor Integrated Circuit PWM controller test method 半导体集成电路 PWM控制器测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43041-2023 |
Hybrid Integrated Circuit DC/DC converter 混合集成电路 直流/直流（DC/DC）变换器 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43040-2023 |
Semiconductor Integrated Circuit AC/DC converter test method 半导体集成电路 AC/DC变换器测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43035-2023 |
Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements 半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 43034.3-2023 |
Integrated Circuits - Measurement of pulse immunity - Part 3: Non-synchronous transient injection method 集成电路 脉冲抗扰度测量 第3部分：非同步瞬态注入法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42975-2023 |
Semiconductor Integrated Circuit driver test methods 半导体集成电路 驱动器测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42974-2023 |
Semiconductor Integrated Circuit flash memory (FLASH) 半导体集成电路 快闪存储器（FLASH） |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42973-2023 |
Semiconductor Integrated Circuit Digital-to-analog (DA) converter 半导体集成电路 数字模拟（DA）转换器 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42970-2023 |
Semiconductor Integrated Circuit video encoding and decoding circuit testing method 半导体集成电路 视频编解码电路测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42968.8-2023 |
Integrated Circuits - Electromagnetic immunity measurements - Part 8: Radiated immunity measurements - IC stripline method 集成电路 电磁抗扰度测量 第8部分：辐射抗扰度测量 IC带状线法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42968.1-2023 |
Integrated Circuits - Electromagnetic immunity measurements - Part 1: General conditions and definitions 集成电路 电磁抗扰度测量 第1部分：通用条件和定义 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 20870.5-2023 |
Semiconductor devices Part 16-5: Microwave Integrated Circuits Oscillators 半导体器件 第16-5部分：微波集成电路 振荡器 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 20870.2-2023 |
Semiconductor devices Part 16-2: Microwave Integrated Circuits Prescalers 半导体器件 第16-2部分：微波集成电路 预分频器 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 20870.10-2023 |
Semiconductor Devices Part 16-10: Monolithic Microwave Integrated Circuit Technology Acceptable Procedures 半导体器件 第16-10部分：单片微波集成电路技术可接收程序 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42848-2023 |
Semiconductor Integrated Circuits - Test methods for direct digital frequency synthesizers 半导体集成电路 直接数字频率合成器测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42839-2023 |
Semiconductor Integrated Circuit Analog-to-digital (AD) converter 半导体集成电路 模拟数字（AD）转换器 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42838-2023 |
Semiconductor Integrated Circuit Hall circuit test method 半导体集成电路 霍尔电路测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42837-2023 |
Microwave semiconductor Integrated Circuit amplifier 微波半导体集成电路 放大器 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42836-2023 |
Microwave semiconductor Integrated Circuit mixer 微波半导体集成电路 混频器 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 42835-2023 |
Semiconductor Integrated Circuit system on chip (SoC) 半导体集成电路 片上系统（SoC） |
China National Standards Integrated Circuit |
English PDF |
| GB/T 41325-2022 |
Low-density crystal primary pit silicon single crystal polishing wafer for Integrated Circuits 集成电路用低密度晶体原生凹坑硅单晶抛光片 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 7092-2021 |
Outline dimensions of semiconductor Integrated Circuits 半导体集成电路外形尺寸 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 41213-2021 |
Integrated Circuit full automatic die bonder 集成电路用全自动装片机 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 40577-2021 |
Terminology for Integrated Circuit(IC) manufacturing equipment 集成电路制造设备术语 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 39679-2020 |
Integrated Circuit card device for lifts 电梯IC卡装置 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 39159-2020 |
High purity copper alloy target for Integrated Circuit 集成电路用高纯铜合金靶材 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 29271.4-2019 |
Identification cards—Integrated Circuit card programming interfaces—Part 4: Application programming interface (API) administration 识别卡 集成电路卡编程接口 第4部分：应用编程接口（API）管理 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16649.11-2019 |
Identification cards—Integrated Circuit cards—Part 11: Personal verification through biometric methods 识别卡 集成电路卡 第11部分：通过生物特征识别方法的身份验证 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 29271.6-2019 |
Identification cards—Integrated Circuit card programming interfaces—Part 6: Registration authority procedures for the authentication protocols for interoperability 识别卡 集成电路卡编程接口 第6部分：实现互操作的鉴别协议的注册管理规程 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 37312.1-2019 |
Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability Integrated Circuits and discrete semiconductors 航空电子过程管理 航空航天、国防及其他高性能应用领域（ADHP）电子元器件 第1部分：高可靠集成电路与分立半导体器件通用要求 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 11498-2018 |
Semiconductor devices—Integrated Circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) |
China National Standards Integrated Circuit |
English PDF |
| GB/T 13062-2018 |
Semiconductor devices—Integrated Circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) |
China National Standards Integrated Circuit |
English PDF |
| GB/T 37600.11-2018 |
National central product classification—Product category core metadata—Part 11：Magnetic stripe card and Integrated Circuit card 全国主要产品分类-产品类别核心元数据-第11部分：磁卡与集成电路卡 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 36474-2018 |
Semiconductor Integrated Circuit—Measuring methods for double data rate 3 synchronous dynamic random access memory(DDR3 SDRAM) 半导体集成电路 第三代双倍数据速率同步动态随机存储器 (DDR3 SDRAM)测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 36479-2018 |
Integrated Circuits—Test methods for column grid array 集成电路 焊柱阵列试验方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 36477-2018 |
Semiconductor Integrated Circuit—Measuring methods for flash memory 半导体集成电路 快闪存储器测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 15879.5-2018 |
Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of Integrated Circuits 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 36614-2018 |
Integrated Circuits—Memory devices pin configuration 集成电路 存储器引出端排列 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 36600.11-2018 |
National central product classification—Product category core metadata—Part 11：Magnetic stripe card and Integrated Circuit card 全国主要产品分类 产品类别核心元数据 第11部分：磁卡与集成电路卡 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 36636-2018 |
Identification cards—Specification for dual-interface Integrated Circuit card module 识别卡 双界面集成电路卡模块规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 35007-2018 |
Semiconductor Integrated Circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路 低电压差分信号电路测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 35006-2018 |
Semiconductor Integrated Circuits—Measuring method of level converter 半导体集成电路 电平转换器测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 35004-2018 |
Logic digital Integrated Circuits—Specification for I/O interface model for integrated circuit 数字集成电路 输入/输出电气接口模型规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 35005-2018 |
Test methods for flip chip Integrated Circuits 集成电路倒装焊试验方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 14028-2018 |
Semiconductor Integrated Circuits—Measuring method of analogue switch 半导体集成电路 模拟开关测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 4377-2018 |
Semiconductor Integrated Circuits—Measuring method of voltage regulators 半导体集成电路 电压调整器测试方法 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 33140-2016 |
Phosphorized copper anode used for Integrated Circuit 集成电路用磷铜阳极 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 4023-2015 |
Semiconductor devices—Discrete devices and Integrated Circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分：整流二极管 |
China National Standards Integrated Circuit |
English PDF |
| GB 51122-2015 |
Code for design of Integrated Circuit assembly and test factory 集成电路封装测试厂设计规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16525-2015 |
Semiconductor Integrated Circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 15878-2015 |
Semiconductor Integrated Circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 15876-2015 |
Semiconductor Integrated Circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 14112-2015 |
Semiconductor Integrated Circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 29271.3-2014 |
Identification cards—Integrated Circuit card programming interfaces—Part 3: Application interface 识别卡 集成电路卡编程接口 第3部分：应用接口 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 30962-2014 |
Identification cards―Integrated Circuit cards―High capacity cards 识别卡 集成电路卡 大容量卡 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 15877-2013 |
Semiconductor Integrated Circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16649.13-2013 |
Identification cards - Integrated Circuit cards - Part 13: Commands for application management in a multi-application environment 识别卡 集成电路卡 第13部分：在多应用环境中的应用管理命令 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 14620-2013 |
Alumina ceramic substrates for thin film Integrated Circuits 薄膜集成电路用氧化铝陶瓷基片 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 14619-2013 |
Alumina ceramic substrates for thick film Integrated Circuits 厚膜集成电路用氧化铝陶瓷基片 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 29271.2-2012 |
Identification card - Integrated Circuit card programming interfaces - Part 2: Generic card interface 识别卡 集成电路卡编程接口 第2部分：通用卡接口 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 29271.1-2012 |
Identification cards - Integrated Circuit card programming interfaces - Part 1: Architecture 识别卡 集成电路卡编程接口 第1部分：体系结构 |
China National Standards Integrated Circuit |
English PDF |
| GB 50809-2012 |
Code for design of silicon Integrated Circuits wafer fab 硅集成电路芯片工厂设计规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 15157.12-2011 |
Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with Integrated Circuits 频率低于3MHz的印制板连接器 第12部分：集成电路插座的尺寸、一般要求和试验方法详细规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 22351.2-2010 |
Identification cards - Contactless Integrated Circuit(s) cards - Vicinity cards - Part2: Air interface and initialization 识别卡 无触点的集成电路卡 邻近式卡 第2部分：空中接口和初始化 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16649.9-2010 |
Identification cards - Integrated Circuit cards - Part 9: Commands for card management 识别卡 集成电路卡 第9部分：用于卡管理的命令 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16649.4-2010 |
Identification Cards - Integrated Circuit cards - Part 4: Organization, security and commands for interchange 识别卡 集成电路卡 第4部分：用于交换的结构、安全和命令 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16649.15-2010 |
Identification cards - Integrated Circuit cards - Part 15: Cryptographic information application 识别卡 集成电路卡 第15部分：密码信息应用 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16649.12-2010 |
Identification cards - Integrated Circuit cards - Part 12: Cards with contacts - USB electrical interface and operating procedures 识别卡 集成电路卡 第12部分：带触点的卡-USB电气接口和操作规程 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 22351.3-2008 |
Identification cards - Contactless Integrated Circuit(s) IC cards - Vicinity cards - Part 3: Anticollision and transmission protocol 识别卡 无触点的集成电路卡 邻近式卡 第3部分：防冲突和传输协议 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 22351.1-2008 |
Identification cards - Contactless Integrated Circuit(s) cards - Vicinity cards - Part 1: Physical characteristics 识别卡 无触点的集成电路卡 邻近式卡 第1部分：物理特性 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 20870.1-2007 |
Semiconductor devices - Part 16-1: Microwave Integrated Circuits - Amplifiers 半导体器件 第16-1部分：微波集成电路 放大器 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 17574.9-2006 |
Semiconductor devices - Integrated Circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories 半导体器件 集成电路 第2-9部分：数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 17574.20-2006 |
Semiconductor devices - Integrated Circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits 半导体器件 集成电路 第2-20部分：数字集成电路 低压集成电路族规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 17574.11-2006 |
Semiconductor devices - Integrated Circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory 半导体器件 集成电路 第2-11部分：数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 4589.1-2006 |
Semiconductor devices - Part 10: Generic specification for discrete devices and Integrated Circuits 半导体器件 第10部分：分立器件和集成电路总规范 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 20515-2006 |
Semiconductor devices - Integrated Circuits - Part 5: Semicustom integrated circuits 半导体器件 集成电路 第5部分：半定制集成电路 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16790.7-2006 |
Financial transaction cards - Security architecture of financial transaction systems using Integrated Circuit cards - Part 7: Key management 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第7部分：密钥管理 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16790.6-2006 |
Financial transaction cards - Security architecture of financial transaction systems using Integrated Circuit cards - Part 6: Cardholder verification 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第6部分：持卡人身份验证 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16790.5-2006 |
Financial transaction cards - Security architecture of financial transaction systems using Integrated Circuit cards - Part 5: Use of algorithms 金融交易卡 使用集成电路卡的金融交易系统的安全体系 第5部分：算法应用 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 12750-2006 |
Semiconductor devices―Integrated Circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits 半导体器件 集成电路 第11部分：半导体集成电路分规范(不包括混合电路) |
China National Standards Integrated Circuit |
English PDF |
| GB/T 17554.3-2006 |
Identification cards - Test methods Part 3: Integrated Circuit(s) cards with contacts and related interface devices 识别卡 测试方法 第3部分:带触点的集成电路卡及其相关接口设备 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16649.3-2006 |
Identification cards - Integrated Circuit(s) cards with contacts - Part 3: Electronic signals and transmission protocols 识别卡 带触点的集成电路卡 第3部分:电信号和传输协议 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16649.2-2006 |
Identification cards - Integrated Circuit(s) cards with contacts - Part 2: Dimensions and location of the contacts 识别卡 带触点的集成电路卡 第2部分:触点的尺寸和位置 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 16649.1-2006 |
Identification cards - Integrated Circuit(s) cards with contacts - Part 1: Physical characteristics 识别卡 带触点的集成电路卡 第1部分:物理特性 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 19558-2004 |
General specifications for Integrated Circuit(IC)card payphone and system 集成电路(IC)卡公用付费电话系统总技术要求 |
China National Standards Integrated Circuit |
English PDF |
| GB/T 2900.66-2004 |
Electrotechnical terminology--Semiconductor devices and Integrated Circuits 电工术语 半导体器件和集成电路 |
China National Standards Integrated Circuit |
English PDF |
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